JP4382547B2 - 半導体装置用基板と半導体装置 - Google Patents

半導体装置用基板と半導体装置 Download PDF

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Publication number
JP4382547B2
JP4382547B2 JP2004085969A JP2004085969A JP4382547B2 JP 4382547 B2 JP4382547 B2 JP 4382547B2 JP 2004085969 A JP2004085969 A JP 2004085969A JP 2004085969 A JP2004085969 A JP 2004085969A JP 4382547 B2 JP4382547 B2 JP 4382547B2
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JP
Japan
Prior art keywords
substrate
insulating film
film
copper
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004085969A
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English (en)
Japanese (ja)
Other versions
JP2005276962A5 (enExample
JP2005276962A (ja
Inventor
浩一 ▲高▼島
和弥 上武
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ALMT Corp
Original Assignee
ALMT Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ALMT Corp filed Critical ALMT Corp
Priority to JP2004085969A priority Critical patent/JP4382547B2/ja
Priority to PCT/JP2005/003846 priority patent/WO2005091360A1/ja
Priority to EP05720118A priority patent/EP1732128A4/en
Priority to US10/593,819 priority patent/US7470982B2/en
Publication of JP2005276962A publication Critical patent/JP2005276962A/ja
Publication of JP2005276962A5 publication Critical patent/JP2005276962A5/ja
Application granted granted Critical
Publication of JP4382547B2 publication Critical patent/JP4382547B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/161—Cap
    • H01L2924/1615—Shape
    • H01L2924/16152—Cap comprising a cavity for hosting the device, e.g. U-shaped cap

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2004085969A 2004-03-24 2004-03-24 半導体装置用基板と半導体装置 Expired - Fee Related JP4382547B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004085969A JP4382547B2 (ja) 2004-03-24 2004-03-24 半導体装置用基板と半導体装置
PCT/JP2005/003846 WO2005091360A1 (ja) 2004-03-24 2005-03-07 半導体装置用基板と半導体装置
EP05720118A EP1732128A4 (en) 2004-03-24 2005-03-07 SUBSTRATE FOR A SEMICONDUCTOR COMPONENT AND SEMICONDUCTOR COMPONENT
US10/593,819 US7470982B2 (en) 2004-03-24 2005-03-07 Substrate for semiconductor device and semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004085969A JP4382547B2 (ja) 2004-03-24 2004-03-24 半導体装置用基板と半導体装置

Publications (3)

Publication Number Publication Date
JP2005276962A JP2005276962A (ja) 2005-10-06
JP2005276962A5 JP2005276962A5 (enExample) 2007-01-11
JP4382547B2 true JP4382547B2 (ja) 2009-12-16

Family

ID=34993971

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004085969A Expired - Fee Related JP4382547B2 (ja) 2004-03-24 2004-03-24 半導体装置用基板と半導体装置

Country Status (4)

Country Link
US (1) US7470982B2 (enExample)
EP (1) EP1732128A4 (enExample)
JP (1) JP4382547B2 (enExample)
WO (1) WO2005091360A1 (enExample)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1858078A4 (en) * 2005-01-20 2009-03-04 Almt Corp ELEMENT FOR A SEMICONDUCTOR COMPONENT AND MANUFACTURING METHOD THEREFOR
WO2007141851A1 (ja) * 2006-06-07 2007-12-13 Fujitsu Limited 半導体パッケージ及び電子装置
JP4768024B2 (ja) * 2006-07-28 2011-09-07 京セラ株式会社 電子部品収納用パッケージおよび電子装置
EP2098362A4 (en) 2006-12-27 2012-07-18 Hitachi Chemical Co Ltd ENGRAVED PLATE AND BASE MATERIAL WITH CONCRETE STRUCTURE AND ENGRAVED PLATE
WO2008142700A2 (en) * 2007-05-24 2008-11-27 Micro Components Ltd. Interconnect substrates, methods and systems thereof
JP4558012B2 (ja) * 2007-07-05 2010-10-06 株式会社東芝 半導体パッケージ用放熱プレート及び半導体装置
WO2010013383A1 (ja) * 2008-07-30 2010-02-04 株式会社アライドマテリアル ヒートスプレッダおよびその製造方法
JP2010056194A (ja) * 2008-08-27 2010-03-11 Oki Data Corp 半導体装置及び光プリントヘッド
TWI433615B (zh) * 2012-04-12 2014-04-01 旭德科技股份有限公司 散熱基板及其製作方法
US9575523B2 (en) * 2015-01-22 2017-02-21 Microsoft Technology Licensing, Llc Device sandwich structured composite housing
JP7589487B2 (ja) * 2020-10-12 2024-11-26 株式会社レゾナック 金属回路基板および半導体冷却装置
WO2024203738A1 (ja) * 2023-03-30 2024-10-03 日本特殊陶業株式会社 半導体素子搭載用基板
CN116618660A (zh) * 2023-05-06 2023-08-22 宁波江丰电子材料股份有限公司 一种钼铜合金散热片及其制备方法与应用
CN119900009B (zh) * 2025-01-20 2025-10-24 西安交通大学 一种铜钨合金及其制备工艺

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5815241A (ja) * 1981-07-20 1983-01-28 Sumitomo Electric Ind Ltd 半導体装置用基板
JPS60128625A (ja) 1983-12-15 1985-07-09 Sumitomo Electric Ind Ltd 半導体素子搭載用基板
JPS61194884A (ja) 1985-02-25 1986-08-29 Hitachi Ltd 超電導素子集積回路
JP3493833B2 (ja) * 1995-10-09 2004-02-03 住友電気工業株式会社 半導体素子搭載用プラスチックパッケージおよびその製造方法
JP3814924B2 (ja) 1997-04-03 2006-08-30 住友電気工業株式会社 半導体装置用基板
JP4304749B2 (ja) * 1998-02-24 2009-07-29 住友電気工業株式会社 半導体装置用部材の製造方法
JP3436702B2 (ja) * 1998-12-07 2003-08-18 日本碍子株式会社 複合材料
JP2001118960A (ja) * 1999-10-15 2001-04-27 Sentan Zairyo:Kk 電気絶縁膜付炭素基金属複合材基板
WO2001069674A1 (en) * 2000-03-15 2001-09-20 Sumitomo Electric Industries, Ltd. Aluminum-silicon carbide semiconductor substrate and method for producing the same
JP4206651B2 (ja) * 2001-06-19 2009-01-14 三菱マテリアル株式会社 ヒートシンク付回路基板
JP2004104074A (ja) * 2002-07-17 2004-04-02 Sumitomo Electric Ind Ltd 半導体装置用部材

Also Published As

Publication number Publication date
JP2005276962A (ja) 2005-10-06
US7470982B2 (en) 2008-12-30
EP1732128A4 (en) 2009-11-04
EP1732128A1 (en) 2006-12-13
US20070194440A1 (en) 2007-08-23
WO2005091360A1 (ja) 2005-09-29

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