TWI353205B - - Google Patents

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Publication number
TWI353205B
TWI353205B TW98146173A TW98146173A TWI353205B TW I353205 B TWI353205 B TW I353205B TW 98146173 A TW98146173 A TW 98146173A TW 98146173 A TW98146173 A TW 98146173A TW I353205 B TWI353205 B TW I353205B
Authority
TW
Taiwan
Prior art keywords
substrate
layer
forming
copper
silver
Prior art date
Application number
TW98146173A
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English (en)
Chinese (zh)
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TW201124023A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to TW98146173A priority Critical patent/TW201124023A/zh
Publication of TW201124023A publication Critical patent/TW201124023A/zh
Application granted granted Critical
Publication of TWI353205B publication Critical patent/TWI353205B/zh

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  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Electroplating Methods And Accessories (AREA)
TW98146173A 2009-12-31 2009-12-31 Method of forming conductive socket of ceramic heat dissipation substrate. TW201124023A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW98146173A TW201124023A (en) 2009-12-31 2009-12-31 Method of forming conductive socket of ceramic heat dissipation substrate.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW98146173A TW201124023A (en) 2009-12-31 2009-12-31 Method of forming conductive socket of ceramic heat dissipation substrate.

Publications (2)

Publication Number Publication Date
TW201124023A TW201124023A (en) 2011-07-01
TWI353205B true TWI353205B (enExample) 2011-11-21

Family

ID=45046939

Family Applications (1)

Application Number Title Priority Date Filing Date
TW98146173A TW201124023A (en) 2009-12-31 2009-12-31 Method of forming conductive socket of ceramic heat dissipation substrate.

Country Status (1)

Country Link
TW (1) TW201124023A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451821B (enExample) * 2012-08-07 2014-09-01
CN108471680A (zh) * 2018-05-15 2018-08-31 广东天承科技有限公司 一种线路板的孔金属化工艺

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103429010A (zh) * 2012-05-25 2013-12-04 大毅科技股份有限公司 陶瓷散热基板导电插孔的形成方法
CN104600184B (zh) * 2014-12-31 2017-07-07 东莞市凯昶德电子科技股份有限公司 一种在陶瓷基板上电镀亮银的方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI451821B (enExample) * 2012-08-07 2014-09-01
CN108471680A (zh) * 2018-05-15 2018-08-31 广东天承科技有限公司 一种线路板的孔金属化工艺
CN108471680B (zh) * 2018-05-15 2021-02-02 广东天承科技股份有限公司 一种线路板的孔金属化工艺

Also Published As

Publication number Publication date
TW201124023A (en) 2011-07-01

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MM4A Annulment or lapse of patent due to non-payment of fees