TW201124023A - Method of forming conductive socket of ceramic heat dissipation substrate. - Google Patents
Method of forming conductive socket of ceramic heat dissipation substrate. Download PDFInfo
- Publication number
- TW201124023A TW201124023A TW98146173A TW98146173A TW201124023A TW 201124023 A TW201124023 A TW 201124023A TW 98146173 A TW98146173 A TW 98146173A TW 98146173 A TW98146173 A TW 98146173A TW 201124023 A TW201124023 A TW 201124023A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- copper
- forming
- layer
- silver
- Prior art date
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 91
- 238000000034 method Methods 0.000 title claims abstract description 35
- 239000000919 ceramic Substances 0.000 title claims abstract description 20
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 54
- 239000010949 copper Substances 0.000 claims abstract description 54
- 229910052802 copper Inorganic materials 0.000 claims abstract description 54
- 238000007747 plating Methods 0.000 claims abstract description 33
- 229910052709 silver Inorganic materials 0.000 claims abstract description 31
- 239000004332 silver Substances 0.000 claims abstract description 31
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 26
- 238000005553 drilling Methods 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 17
- 238000004544 sputter deposition Methods 0.000 claims abstract description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 30
- 229910052759 nickel Inorganic materials 0.000 claims description 15
- 239000000126 substance Substances 0.000 claims description 15
- 238000009713 electroplating Methods 0.000 claims description 13
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 238000007639 printing Methods 0.000 claims description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 7
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 7
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 6
- 238000011161 development Methods 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 5
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 4
- 238000013508 migration Methods 0.000 claims description 4
- 230000005012 migration Effects 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 claims description 2
- 238000007654 immersion Methods 0.000 claims description 2
- 239000006193 liquid solution Substances 0.000 claims description 2
- 238000003825 pressing Methods 0.000 claims description 2
- 238000004528 spin coating Methods 0.000 claims description 2
- 238000000059 patterning Methods 0.000 claims 2
- 229910018487 Ni—Cr Inorganic materials 0.000 claims 1
- 230000000903 blocking effect Effects 0.000 claims 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 claims 1
- 230000005611 electricity Effects 0.000 claims 1
- 238000005363 electrowinning Methods 0.000 claims 1
- 229910052500 inorganic mineral Inorganic materials 0.000 claims 1
- 238000010329 laser etching Methods 0.000 claims 1
- 239000011707 mineral Substances 0.000 claims 1
- -1 silver ions Chemical class 0.000 claims 1
- MAKDTFFYCIMFQP-UHFFFAOYSA-N titanium tungsten Chemical compound [Ti].[W] MAKDTFFYCIMFQP-UHFFFAOYSA-N 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 230000008569 process Effects 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 230000008719 thickening Effects 0.000 description 3
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910001431 copper ion Inorganic materials 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005065 mining Methods 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910001335 Galvanized steel Inorganic materials 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QAAXRTPGRLVPFH-UHFFFAOYSA-N [Bi].[Cu] Chemical compound [Bi].[Cu] QAAXRTPGRLVPFH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 210000003298 dental enamel Anatomy 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000008397 galvanized steel Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- CBXWGGFGZDVPNV-UHFFFAOYSA-N so4-so4 Chemical compound OS(O)(=O)=O.OS(O)(=O)=O CBXWGGFGZDVPNV-UHFFFAOYSA-N 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Electroplating Methods And Accessories (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98146173A TW201124023A (en) | 2009-12-31 | 2009-12-31 | Method of forming conductive socket of ceramic heat dissipation substrate. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW98146173A TW201124023A (en) | 2009-12-31 | 2009-12-31 | Method of forming conductive socket of ceramic heat dissipation substrate. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201124023A true TW201124023A (en) | 2011-07-01 |
| TWI353205B TWI353205B (enExample) | 2011-11-21 |
Family
ID=45046939
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW98146173A TW201124023A (en) | 2009-12-31 | 2009-12-31 | Method of forming conductive socket of ceramic heat dissipation substrate. |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TW201124023A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103429010A (zh) * | 2012-05-25 | 2013-12-04 | 大毅科技股份有限公司 | 陶瓷散热基板导电插孔的形成方法 |
| CN103533765A (zh) * | 2012-08-07 | 2014-01-22 | 立诚光电股份有限公司 | 改善陶瓷贯孔基板上金属表面粗糙度的方法及陶瓷基板 |
| CN104600184A (zh) * | 2014-12-31 | 2015-05-06 | 东莞市凯昶德电子科技股份有限公司 | 一种电镀亮银的陶瓷基板及在陶瓷基板上电镀亮银的方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108471680B (zh) * | 2018-05-15 | 2021-02-02 | 广东天承科技股份有限公司 | 一种线路板的孔金属化工艺 |
-
2009
- 2009-12-31 TW TW98146173A patent/TW201124023A/zh not_active IP Right Cessation
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103429010A (zh) * | 2012-05-25 | 2013-12-04 | 大毅科技股份有限公司 | 陶瓷散热基板导电插孔的形成方法 |
| CN103533765A (zh) * | 2012-08-07 | 2014-01-22 | 立诚光电股份有限公司 | 改善陶瓷贯孔基板上金属表面粗糙度的方法及陶瓷基板 |
| CN104600184A (zh) * | 2014-12-31 | 2015-05-06 | 东莞市凯昶德电子科技股份有限公司 | 一种电镀亮银的陶瓷基板及在陶瓷基板上电镀亮银的方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI353205B (enExample) | 2011-11-21 |
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| Date | Code | Title | Description |
|---|---|---|---|
| MM4A | Annulment or lapse of patent due to non-payment of fees |