TWI353205B - - Google Patents

Description

1353205 r. 6. Description of the Invention: [Technical Field] The present invention relates to a method for forming a conductive socket of a ceramic heat dissipating substrate, and more particularly to a method for producing an ideal thermal conductivity, low cost, and physical stability. A method of forming a conductive socket. _ [Prior Art] Due to the rapid development of the electronics industry, the circuit density on the board is getting higher and higher, which also causes the waste heat accumulated on the board to be more and more difficult to dissipate. Nowadays, the circuit board has a lightening trend in the function requirements, so that the circuit board is often installed in a narrow and confined space, and the waste heat generated by the operation process cannot be dissipated, which not only affects the operation quality of the circuit. , will reduce the life of the relevant components °. A conventional heat sinking resin is disposed on a metal heat sink, and a plurality of copper wires are disposed on the heat conductive adhesive resin, and then the heat generating member is disposed on the plurality of copper wires. When the high-heating element is in operation, the heat generated is transferred to the metal heat sink by the heat-conductive adhesive resin, and then radiated through the metal heat sink. However, relying on a number of heat dissipating components to assist in heat dissipation not only increases the density of the substrate, but also increases the heat dissipation and increases the burden on the substrate. Moreover, the most difficult point in the general production of alumina substrates is the problem of filling holes in the conductive jacks. When the aperture is too large, the line 1353205 will be thickened. When the aperture is too small, the plating solution cannot penetrate the holes. Electroplating has caused considerable trouble for the industry. In view of this, the inventors have started research and improvement, and have finally developed the present invention through long-term research and testing. SUMMARY OF THE INVENTION Accordingly, the present invention is directed to a method for forming a conductive hole of a ceramic heat dissipation substrate, which has a good heat dissipation performance of the ceramic heat dissipation substrate, and a conductive hole formed on the substrate has good conductivity. The method for forming a conductive socket of a ceramic heat dissipation substrate according to the present invention includes the steps of: forming a substrate, drilling, printing a silver paste filling step, sputtering step, plating a copper step, and forming a photoresist layer. The steps of exposure step, development step, etching step, photoresist layer removal step, line forming step, nickel plating/sputtering step and silver plating step are performed to obtain the advantages of ideal heat conduction efficiency, low cost and physical stability. An alumina substrate with a conductive socket. According to the method for forming a conductive socket of the ceramic heat-dissipating substrate according to the present invention, a relatively fine-invariant type circuit can be further etched, and a large number of (four) etching steps can be omitted, which is the second object of the present invention. According to the method for forming a conductive socket of a ceramic heat-dissipating substrate according to the present invention, the size of the hole of the conductive jack can be effectively controlled, and in this case, an oxide substrate having a relatively low cost and a high thermal conductivity is used, so that the cost effect and the heat dissipation effect are Can have a certain degree of efficacy; follow-up

Claims (1)

1. Patent application model 11丨1. A method for forming ceramic heat dissipation; base V plate ^^, using the following steps in sequence: substrate preparation step: using alumina substrate or aluminum nitride as main substrate; drilling step: Laser drilling technology pre-positions on the substrate, drilling, and forming a plurality of holes with a predetermined aperture on the substrate; hunting this advanced precision laser etching method for micro hole drilling 5 2 to improve accuracy and reduce drilling on hard substrates The damage of the hole I, the smaller hole diameter is drilled and the faster drilling speed can be obtained; Step: the copper brilliance, nickel chrome, chin; or the seed layer; the electric material is formed on the substrate by the bismuth method to form the seed. Layer::: Step: On the seed layer, the electric steel layer is added to increase the step of the second step: the photoresist layer forming step, the exposure on the substrate, the second step: the step and the photoresist layer removal step, the road, the line forming step: the line Copper is plated over the coating to form a copper line:: away from::::::on the nickel layer on the mine' to avoid the layer; an upper silver ion migrates to the steel-plated silver step<· μ ^ ball The surface of the surface line is then deposited on the silver layer.一丨丨.♦ .月h曰修(更>正射'::: 2.Formation method for the conductive socket of the ceramic heat dissipation substrate of the application i·利范围第"Τ^ι ' ^ ^ 1 The seed layer forming step of the household m. τ can also be formed by printing a conductive paste of molybdenum bamboo silver glue, copper glue or carbon ink on the substrate by using a printing and filling step. 3. As claimed in the patent scope a method for forming a conductive socket of a ceramic heat-dissipating substrate of a 1 or 2 item, wherein the step of forming a photoresist layer in the patterning step is performed on a side of the substrate on which a line is to be formed With photoresist, to protect the circuit from being surnamed, the dry film can be used as a positive-type photoresist liquid solution, coated on the oxide substrate by spin-bonding method &4; or 'negative photoresist can also be used The photoresist formed by the hot pressing of the thin crucible. 4. The method of forming a conductive via of a ceramic heat-dissipating substrate according to claim 3, wherein the etching step of the patterning step is performed by using an etching machine or using an immersion etching solution in combination with ultrasonic oscillating. 5. The method for forming a conductive socket of a ceramic heat dissipation substrate according to claim 4, wherein the nickel plating step may be performed by electroplating, money plating, copper or chemical recording, and chemical recording may be selected from low phosphorus, medium Fill in or record the scales of Nanlin. 6. The method for forming a conductive socket of a ceramic heat dissipation substrate according to claim 5, wherein the silver plating step, silver plating may be electroplated silver or chemical silver, electroplated gold or chemical gold (chemical palladium), electricity Mineral tin or chemical tin. 7. For the conductive plug of the ceramic heat-dissipating substrate of the sixth paragraph of the patent application scope, the repairing d: ': The method of electroplating copper is optional in the seed, or the method of forming the hole after the line forming step, i ping layer It is carried out after the formation step. A method for forming a conductive socket for a heat dissipation substrate, the following steps are sequentially used: a substrate preparation step: an alumina substrate or an aluminum nitride substrate is selected as a main substrate, and a plurality of dicing streets are formed on the surface of the substrate; : using a laser drilling technique to drill a hole at a predetermined conductive hole position on the substrate to form a hole; a seed layer forming step: a copper ore seed layer on the substrate; a pattern imaging step: sequentially illuminating the copper layer above the substrate Resisting layer, exposure and development; electroplating copper step: electroplating copper layer to thicken the line; removing film step: removing the photoresist on the substrate; etching step · etching the copper layer of the substrate to form a line; A layer of silver is plated over the copper layer of the copper line to meet the high frequency requirements. For example, the conductive plug of the heat-dissipating substrate of the eighth part of the patent scope of the patent can be selected from the steps of silver plating or silver plating or gold (chemical palladium), electroplating tin or chemical 1353205. 1353205 Month $曰修(史) is replacing page 3B Figure 1353205 . . . I Tao (Οβ丨日修 (more) is replacing page 4 3D illustration 1353205 s 3F匮