JP2008192938A5 - - Google Patents
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- Publication number
- JP2008192938A5 JP2008192938A5 JP2007027413A JP2007027413A JP2008192938A5 JP 2008192938 A5 JP2008192938 A5 JP 2008192938A5 JP 2007027413 A JP2007027413 A JP 2007027413A JP 2007027413 A JP2007027413 A JP 2007027413A JP 2008192938 A5 JP2008192938 A5 JP 2008192938A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- layer
- board according
- hole
- conductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims 16
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 10
- 239000007769 metal material Substances 0.000 claims 8
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 5
- 229910052804 chromium Inorganic materials 0.000 claims 5
- 239000011651 chromium Substances 0.000 claims 5
- 229910052802 copper Inorganic materials 0.000 claims 5
- 239000010949 copper Substances 0.000 claims 5
- 229910052759 nickel Inorganic materials 0.000 claims 5
- 239000011347 resin Substances 0.000 claims 5
- 229920005989 resin Polymers 0.000 claims 5
- 239000013078 crystal Substances 0.000 claims 4
- 229910052751 metal Inorganic materials 0.000 claims 4
- 239000002184 metal Substances 0.000 claims 4
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 claims 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 3
- 229910052750 molybdenum Inorganic materials 0.000 claims 3
- 239000011733 molybdenum Substances 0.000 claims 3
- 239000010936 titanium Substances 0.000 claims 3
- 229910052719 titanium Inorganic materials 0.000 claims 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 3
- 229910052721 tungsten Inorganic materials 0.000 claims 3
- 239000010937 tungsten Substances 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims 1
- 229920000178 Acrylic resin Polymers 0.000 claims 1
- 239000004925 Acrylic resin Substances 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 239000004809 Teflon Substances 0.000 claims 1
- 229920006362 Teflon® Polymers 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 239000003822 epoxy resin Substances 0.000 claims 1
- 239000011810 insulating material Substances 0.000 claims 1
- 229920003192 poly(bis maleimide) Polymers 0.000 claims 1
- 229920000647 polyepoxide Polymers 0.000 claims 1
- 229920001721 polyimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- -1 polyparaphenylene benzoxazole Polymers 0.000 claims 1
- 229920001955 polyphenylene ether Polymers 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007027413A JP2008192938A (ja) | 2007-02-06 | 2007-02-06 | 配線基板、実装構造体および配線基板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007027413A JP2008192938A (ja) | 2007-02-06 | 2007-02-06 | 配線基板、実装構造体および配線基板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008192938A JP2008192938A (ja) | 2008-08-21 |
| JP2008192938A5 true JP2008192938A5 (enExample) | 2009-09-03 |
Family
ID=39752729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007027413A Pending JP2008192938A (ja) | 2007-02-06 | 2007-02-06 | 配線基板、実装構造体および配線基板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2008192938A (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010157590A (ja) * | 2008-12-26 | 2010-07-15 | Fujifilm Corp | 多層配線基板の製造方法 |
| KR20210154512A (ko) * | 2020-06-12 | 2021-12-21 | 엘지이노텍 주식회사 | 회로기판 |
| WO2024071007A1 (ja) * | 2022-09-30 | 2024-04-04 | 京セラ株式会社 | 配線基板およびそれを用いた実装構造体 |
| JPWO2024090336A1 (enExample) * | 2022-10-28 | 2024-05-02 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH10190224A (ja) * | 1996-12-27 | 1998-07-21 | Ibiden Co Ltd | 多層プリント配線板およびその製造方法 |
| JP4049554B2 (ja) * | 2001-06-26 | 2008-02-20 | イビデン株式会社 | 多層プリント配線板および多層プリント配線板の製造方法 |
| JP2003229668A (ja) * | 2002-12-16 | 2003-08-15 | Toshiba Corp | 多層配線装置の製造方法 |
| JP2004288748A (ja) * | 2003-03-19 | 2004-10-14 | Sumitomo Bakelite Co Ltd | 配線板の製造方法 |
| JP2006303171A (ja) * | 2005-04-20 | 2006-11-02 | Teijin Ltd | フレキシブルプリント回路用基板 |
| JP4701842B2 (ja) * | 2005-06-02 | 2011-06-15 | 凸版印刷株式会社 | 半導体装置基板の製造方法 |
-
2007
- 2007-02-06 JP JP2007027413A patent/JP2008192938A/ja active Pending
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