JP2008518209A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008518209A5 JP2008518209A5 JP2007538102A JP2007538102A JP2008518209A5 JP 2008518209 A5 JP2008518209 A5 JP 2008518209A5 JP 2007538102 A JP2007538102 A JP 2007538102A JP 2007538102 A JP2007538102 A JP 2007538102A JP 2008518209 A5 JP2008518209 A5 JP 2008518209A5
- Authority
- JP
- Japan
- Prior art keywords
- mandrel
- substrate
- contact
- plating
- elastic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 42
- 239000000758 substrate Substances 0.000 claims 26
- 239000000463 material Substances 0.000 claims 24
- 238000007747 plating Methods 0.000 claims 16
- 230000035939 shock Effects 0.000 claims 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- 229910045601 alloy Inorganic materials 0.000 claims 4
- 239000000956 alloy Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims 4
- 229910052721 tungsten Inorganic materials 0.000 claims 4
- 239000010937 tungsten Substances 0.000 claims 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 239000010941 cobalt Substances 0.000 claims 2
- 229910017052 cobalt Inorganic materials 0.000 claims 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 239000013013 elastic material Substances 0.000 claims 2
- 238000007772 electroless plating Methods 0.000 claims 2
- 238000009713 electroplating Methods 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 229910052742 iron Inorganic materials 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000010936 titanium Substances 0.000 claims 2
- 229910052719 titanium Inorganic materials 0.000 claims 2
- 238000005219 brazing Methods 0.000 claims 1
- -1 combinations thereof Substances 0.000 claims 1
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 238000004064 recycling Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/971,489 US7621044B2 (en) | 2004-10-22 | 2004-10-22 | Method of manufacturing a resilient contact |
| PCT/US2005/038063 WO2006047349A2 (en) | 2004-10-22 | 2005-10-21 | Electroform spring built on mandrel transferable to other surface |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008518209A JP2008518209A (ja) | 2008-05-29 |
| JP2008518209A5 true JP2008518209A5 (enExample) | 2008-12-04 |
Family
ID=36204834
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007538102A Pending JP2008518209A (ja) | 2004-10-22 | 2005-10-21 | 心棒上に作成された、他の表面に移動可能な電気鋳造バネ |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7621044B2 (enExample) |
| EP (1) | EP1807240A4 (enExample) |
| JP (1) | JP2008518209A (enExample) |
| KR (1) | KR20070057992A (enExample) |
| CN (1) | CN100524976C (enExample) |
| TW (1) | TW200620512A (enExample) |
| WO (1) | WO2006047349A2 (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7073254B2 (en) * | 1993-11-16 | 2006-07-11 | Formfactor, Inc. | Method for mounting a plurality of spring contact elements |
| US8033838B2 (en) | 1996-02-21 | 2011-10-11 | Formfactor, Inc. | Microelectronic contact structure |
| US6888362B2 (en) * | 2000-11-09 | 2005-05-03 | Formfactor, Inc. | Test head assembly for electronic components with plurality of contoured microelectronic spring contacts |
| US7799699B2 (en) | 2004-06-04 | 2010-09-21 | The Board Of Trustees Of The University Of Illinois | Printable semiconductor structures and related methods of making and assembling |
| CN101120433B (zh) | 2004-06-04 | 2010-12-08 | 伊利诺伊大学评议会 | 用于制造并组装可印刷半导体元件的方法 |
| US7202552B2 (en) * | 2005-07-15 | 2007-04-10 | Silicon Matrix Pte. Ltd. | MEMS package using flexible substrates, and method thereof |
| KR101430587B1 (ko) * | 2006-09-20 | 2014-08-14 | 더 보오드 오브 트러스티스 오브 더 유니버시티 오브 일리노이즈 | 전사가능한 반도체 구조들, 디바이스들 및 디바이스 컴포넌트들을 만들기 위한 릴리스 방안들 |
| KR20090057328A (ko) * | 2006-09-26 | 2009-06-04 | 알프스 덴키 가부시키가이샤 | 탄성 접촉자 및 이것을 이용한 금속단자 간의 접합방법 |
| US8354855B2 (en) * | 2006-10-16 | 2013-01-15 | Formfactor, Inc. | Carbon nanotube columns and methods of making and using carbon nanotube columns as probes |
| US7674112B2 (en) * | 2006-12-28 | 2010-03-09 | Formfactor, Inc. | Resilient contact element and methods of fabrication |
| US8149007B2 (en) * | 2007-10-13 | 2012-04-03 | Formfactor, Inc. | Carbon nanotube spring contact structures with mechanical and electrical components |
| US7683494B1 (en) * | 2008-06-18 | 2010-03-23 | Zilog, Inc. | Press-fit integrated circuit package involving compressed spring contact beams |
| EP2349440B1 (en) | 2008-10-07 | 2019-08-21 | Mc10, Inc. | Catheter balloon having stretchable integrated circuitry and sensor array |
| US8097926B2 (en) | 2008-10-07 | 2012-01-17 | Mc10, Inc. | Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy |
| US8389862B2 (en) | 2008-10-07 | 2013-03-05 | Mc10, Inc. | Extremely stretchable electronics |
| US8886334B2 (en) | 2008-10-07 | 2014-11-11 | Mc10, Inc. | Systems, methods, and devices using stretchable or flexible electronics for medical applications |
| US8372726B2 (en) | 2008-10-07 | 2013-02-12 | Mc10, Inc. | Methods and applications of non-planar imaging arrays |
| US20100104678A1 (en) * | 2008-10-28 | 2010-04-29 | Formfactor, Inc. | Apparatus and method for making and using a tooling die |
| US20100252317A1 (en) * | 2009-04-03 | 2010-10-07 | Formfactor, Inc. | Carbon nanotube contact structures for use with semiconductor dies and other electronic devices |
| US8272124B2 (en) * | 2009-04-03 | 2012-09-25 | Formfactor, Inc. | Anchoring carbon nanotube columns |
| US8865489B2 (en) | 2009-05-12 | 2014-10-21 | The Board Of Trustees Of The University Of Illinois | Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays |
| US9723122B2 (en) | 2009-10-01 | 2017-08-01 | Mc10, Inc. | Protective cases with integrated electronics |
| JP5373571B2 (ja) * | 2009-11-30 | 2013-12-18 | 日本電子材料株式会社 | プローブカード |
| US9936574B2 (en) | 2009-12-16 | 2018-04-03 | The Board Of Trustees Of The University Of Illinois | Waterproof stretchable optoelectronics |
| EP2513953B1 (en) | 2009-12-16 | 2017-10-18 | The Board of Trustees of the University of Illionis | Electrophysiology using conformal electronics |
| US10441185B2 (en) | 2009-12-16 | 2019-10-15 | The Board Of Trustees Of The University Of Illinois | Flexible and stretchable electronic systems for epidermal electronics |
| EP2547258B1 (en) * | 2010-03-17 | 2015-08-05 | The Board of Trustees of the University of Illionis | Implantable biomedical devices on bioresorbable substrates |
| WO2012158709A1 (en) | 2011-05-16 | 2012-11-22 | The Board Of Trustees Of The University Of Illinois | Thermally managed led arrays assembled by printing |
| US9159635B2 (en) | 2011-05-27 | 2015-10-13 | Mc10, Inc. | Flexible electronic structure |
| WO2012167096A2 (en) | 2011-06-03 | 2012-12-06 | The Board Of Trustees Of The University Of Illinois | Conformable actively multiplexed high-density surface electrode array for brain interfacing |
| WO2013089867A2 (en) | 2011-12-01 | 2013-06-20 | The Board Of Trustees Of The University Of Illinois | Transient devices designed to undergo programmable transformations |
| EP2830492B1 (en) | 2012-03-30 | 2021-05-19 | The Board of Trustees of the University of Illinois | Appendage mountable electronic devices conformable to surfaces and method of making the same |
| US9171794B2 (en) | 2012-10-09 | 2015-10-27 | Mc10, Inc. | Embedding thin chips in polymer |
| KR20180033468A (ko) | 2015-06-01 | 2018-04-03 | 더 보드 오브 트러스티즈 오브 더 유니버시티 오브 일리노이 | 무선 전력 및 근거리 통신기능을 갖는 소형화된 전자 시스템 |
| CN107923988A (zh) | 2015-06-01 | 2018-04-17 | 伊利诺伊大学评议会 | Uv感测的替代方法 |
| KR102329801B1 (ko) | 2015-10-21 | 2021-11-22 | 삼성전자주식회사 | 테스트 소켓의 제조 방법 및 반도체 패키지의 테스트 방법 |
| US10925543B2 (en) | 2015-11-11 | 2021-02-23 | The Board Of Trustees Of The University Of Illinois | Bioresorbable silicon electronics for transient implants |
| CN105624668A (zh) * | 2016-01-04 | 2016-06-01 | 兰州理工大学 | 三维立体网状织构组织复合涂层及其制备方法 |
| WO2017155155A1 (ko) * | 2016-03-07 | 2017-09-14 | 주식회사 이노글로벌 | 반도체 디바이스 테스트용 양방향 도전성 소켓, 반도체 디바이스 테스트용 양방향 도전성 모듈 및 이의 제조방법 |
| CN109411937B (zh) * | 2017-08-14 | 2021-09-21 | 富顶精密组件（深圳）有限公司 | 电连接器及其制造方法 |
| US10128593B1 (en) * | 2017-09-28 | 2018-11-13 | International Business Machines Corporation | Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body |
| CN110519916B (zh) * | 2019-08-14 | 2022-03-01 | 云谷（固安）科技有限公司 | 一种柔性电路板以及压接装置 |
| CN110461102A (zh) * | 2019-09-06 | 2019-11-15 | 苏州科源利电子有限公司 | 一种压条下压弹簧探针结构 |
| US11657963B2 (en) | 2020-09-15 | 2023-05-23 | Enphase Energy, Inc. | Transformer helix winding production |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4745670A (en) | 1980-10-28 | 1988-05-24 | Rockwell International Corporation | Method for making chemical laser nozzle arrays |
| US5476211A (en) | 1993-11-16 | 1995-12-19 | Form Factor, Inc. | Method of manufacturing electrical contacts, using a sacrificial member |
| US5230787A (en) | 1991-12-30 | 1993-07-27 | Xerox Corporation | Spring and process for making a spring for a fluid bearing by electroforming |
| US5299939A (en) * | 1992-03-05 | 1994-04-05 | International Business Machines Corporation | Spring array connector |
| US6482013B2 (en) | 1993-11-16 | 2002-11-19 | Formfactor, Inc. | Microelectronic spring contact element and electronic component having a plurality of spring contact elements |
| US6336269B1 (en) | 1993-11-16 | 2002-01-08 | Benjamin N. Eldridge | Method of fabricating an interconnection element |
| US5772451A (en) * | 1993-11-16 | 1998-06-30 | Form Factor, Inc. | Sockets for electronic components and methods of connecting to electronic components |
| US5974662A (en) | 1993-11-16 | 1999-11-02 | Formfactor, Inc. | Method of planarizing tips of probe elements of a probe card assembly |
| US20020121274A1 (en) | 1995-04-05 | 2002-09-05 | Aerogen, Inc. | Laminated electroformed aperture plate |
| US6036832A (en) | 1996-04-19 | 2000-03-14 | Stork Veco B.V. | Electroforming method, electroforming mandrel and electroformed product |
| EP0839321B1 (en) * | 1996-05-17 | 2006-01-11 | FormFactor, Inc. | Contact tip structures for microelectronic interconnection elements and methods of making same |
| DE19735831A1 (de) * | 1997-08-18 | 1999-02-25 | Zeiss Carl Fa | Galvanoplastische Optik-Fassung |
| DE19853445C2 (de) | 1998-11-19 | 2001-08-09 | Siemens Ag | Verfahren zur galvanischen Herstellung von Kontaktnadeln und einer Kontaktnadelanordnung, Kontaktnadeln und Kontaktnadelanordnung |
| KR20090038040A (ko) * | 1998-12-02 | 2009-04-17 | 폼팩터, 인크. | 전기 접촉 구조체의 제조 방법 |
| JP2000241452A (ja) * | 1999-02-17 | 2000-09-08 | Tokyo Electron Ltd | プロービングカードの製造方法 |
| US6558584B1 (en) * | 2000-03-31 | 2003-05-06 | Bausch & Lomb Incorporated | Apparatus and method for handling an ophthalmic lens |
| CN1506692A (zh) * | 2002-12-12 | 2004-06-23 | 聿勤科技股份有限公司 | 具有弹性接点的ic测试工具 |
| JP2005106762A (ja) * | 2003-10-02 | 2005-04-21 | Sumitomo Metal Mining Co Ltd | Ｌｓｉ検査用プローブ基板およびその製造方法 |
-
2004
- 2004-10-22 US US10/971,489 patent/US7621044B2/en not_active Expired - Fee Related
-
2005
- 2005-10-21 JP JP2007538102A patent/JP2008518209A/ja active Pending
- 2005-10-21 KR KR1020077009658A patent/KR20070057992A/ko not_active Ceased
- 2005-10-21 CN CNB2005800362980A patent/CN100524976C/zh not_active Expired - Fee Related
- 2005-10-21 WO PCT/US2005/038063 patent/WO2006047349A2/en not_active Ceased
- 2005-10-21 TW TW094136927A patent/TW200620512A/zh unknown
- 2005-10-21 EP EP05812242A patent/EP1807240A4/en not_active Withdrawn
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2008518209A5 (enExample) | ||
| JP2008518209A (ja) | 心棒上に作成された、他の表面に移動可能な電気鋳造バネ | |
| TW200713534A (en) | Semiconductor device having improved mechanical and thermal reliability | |
| CN104662207A (zh) | 接触元件 | |
| KR101131749B1 (ko) | 기판 표면 실장용 도전성 탄성 접촉 단자 | |
| JP2021099346A5 (enExample) | ||
| CN100407503C (zh) | 端子及其电镀方法 | |
| US9870930B2 (en) | Method for producing substrate for mounting semiconductor element | |
| TWI577257B (zh) | 於基材絕緣表面形成導電線路的方法 | |
| JP2005520936A5 (enExample) | ||
| TW200908833A (en) | Metal plugged substrates with no adhesive between metal and polyimide | |
| CN100392850C (zh) | 一种引线框架以及具有所述引线框架的半导体器件 | |
| MY138109A (en) | Electronic part and surface treatment method of the same | |
| TW201114114A (en) | Electrical connector contact and electroplating method thereof | |
| JP2016054216A (ja) | プリント配線基板の製造方法 | |
| JP3939252B2 (ja) | コンタクト | |
| CN111755933B (zh) | 一种导电端子的制造方法 | |
| JP4113087B2 (ja) | 積層メッキの製造方法、及び接続装置の製造方法 | |
| JP2008311017A (ja) | 接続装置 | |
| JP2006228978A (ja) | 低抵抗のチップ抵抗器とその製造方法 | |
| MY139649A (en) | Electronic component and method for forming external electrodes thereof | |
| TW200802763A (en) | Method for fabricating alloy conductive bump of electrical connecting pad of circuit board | |
| JP2004080060A5 (enExample) | ||
| CN108807019A (zh) | 开关用金属导电体及其制造方法 | |
| KR101340350B1 (ko) | 내마모성 및 고경도 단자부를 구비한 인쇄회로기판 및 그 제조 방법 |