JP2004080060A5 - - Google Patents
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- Publication number
- JP2004080060A5 JP2004080060A5 JP2003400508A JP2003400508A JP2004080060A5 JP 2004080060 A5 JP2004080060 A5 JP 2004080060A5 JP 2003400508 A JP2003400508 A JP 2003400508A JP 2003400508 A JP2003400508 A JP 2003400508A JP 2004080060 A5 JP2004080060 A5 JP 2004080060A5
- Authority
- JP
- Japan
- Prior art keywords
- package
- electronic component
- nickel plating
- heat radiating
- radiating member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 10
- 238000007747 plating Methods 0.000 claims 6
- 229910052759 nickel Inorganic materials 0.000 claims 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- 229910017709 Ni Co Inorganic materials 0.000 claims 1
- 229910003267 Ni-Co Inorganic materials 0.000 claims 1
- 229910003262 Ni‐Co Inorganic materials 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003400508A JP4663975B2 (ja) | 2003-11-28 | 2003-11-28 | 電子部品用パッケージ |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003400508A JP4663975B2 (ja) | 2003-11-28 | 2003-11-28 | 電子部品用パッケージ |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29447398A Division JP3512653B2 (ja) | 1998-09-30 | 1998-09-30 | 電子部品用パッケージの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004080060A JP2004080060A (ja) | 2004-03-11 |
| JP2004080060A5 true JP2004080060A5 (enExample) | 2005-12-22 |
| JP4663975B2 JP4663975B2 (ja) | 2011-04-06 |
Family
ID=32025987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003400508A Expired - Fee Related JP4663975B2 (ja) | 2003-11-28 | 2003-11-28 | 電子部品用パッケージ |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4663975B2 (enExample) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3764160B2 (ja) * | 2004-09-10 | 2006-04-05 | 三井金属鉱業株式会社 | キャパシタ層形成材及びキャパシタ層形成材を用いて得られる内蔵キャパシタ回路を備えるプリント配線板。 |
| JP4765099B2 (ja) * | 2005-10-28 | 2011-09-07 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| US20080298024A1 (en) * | 2007-05-31 | 2008-12-04 | A.L.M.T. Corp. | Heat spreader and method for manufacturing the same, and semiconductor device |
| JP5747805B2 (ja) * | 2011-12-12 | 2015-07-15 | 株式会社デンソー | 電子装置 |
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2003
- 2003-11-28 JP JP2003400508A patent/JP4663975B2/ja not_active Expired - Fee Related