WO2009041481A1 - 可動接点用銀被覆複合材料およびその製造方法 - Google Patents

可動接点用銀被覆複合材料およびその製造方法 Download PDF

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Publication number
WO2009041481A1
WO2009041481A1 PCT/JP2008/067275 JP2008067275W WO2009041481A1 WO 2009041481 A1 WO2009041481 A1 WO 2009041481A1 JP 2008067275 W JP2008067275 W JP 2008067275W WO 2009041481 A1 WO2009041481 A1 WO 2009041481A1
Authority
WO
WIPO (PCT)
Prior art keywords
silver
clad layer
composite material
movable contacts
production
Prior art date
Application number
PCT/JP2008/067275
Other languages
English (en)
French (fr)
Inventor
Naofumi Tokuhara
Masato Ohno
Takeo Uno
Original Assignee
The Furukawa Electric Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2008240328A external-priority patent/JP2009099550A/ja
Priority claimed from JP2008240327A external-priority patent/JP4558823B2/ja
Priority claimed from JP2008240326A external-priority patent/JP2009099548A/ja
Application filed by The Furukawa Electric Co., Ltd. filed Critical The Furukawa Electric Co., Ltd.
Priority to CN200880108602A priority Critical patent/CN101809695A/zh
Priority to KR1020107008883A priority patent/KR101501309B1/ko
Priority to EP08833392A priority patent/EP2200056A1/en
Priority to US12/680,350 priority patent/US20100233506A1/en
Publication of WO2009041481A1 publication Critical patent/WO2009041481A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10—Electroplating with more than one layer of the same or of different metals
    • C25D5/12—Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/623—Porosity of the layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/021—Composite material
    • H01H1/023—Composite material having a noble metal as the basic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H1/00—Contacts
    • H01H1/02—Contacts characterised by the material thereof
    • H01H1/04—Co-operating contacts of different material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01H—ELECTRIC SWITCHES; RELAYS; SELECTORS; EMERGENCY PROTECTIVE DEVICES
    • H01H2227/00—Dimensions; Characteristics
    • H01H2227/022—Collapsable dome
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12639—Adjacent, identical composition, components
    • Y10T428/12646—Group VIII or IB metal-base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12882—Cu-base component alternative to Ag-, Au-, or Ni-base component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771—Transition metal-base component
    • Y10T428/12861—Group VIII or IB metal-base component
    • Y10T428/12896—Ag-base component

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Composite Materials (AREA)
  • Contacts (AREA)

Abstract

　可動接点用銀被覆複合材料１００は、鉄またはニッケルを主成分とする合金からなる基材１１０と、基材１１０の表面の少なくとも一部に形成されたニッケル、コバルト、ニッケル合金およびコバルト合金の何れか１つからなる下地層１２０と、下地層１２０の上に形成された銅または銅合金からなる中間層１３０と、中間層１３０の上に形成された銀または銀合金からなる最表層１４０とを備え、下地層１２０の厚さと中間層１３０の厚さの合計が０．０２５μｍ以上０．２０μｍ以下となっている。
PCT/JP2008/067275 2007-09-26 2008-09-25 可動接点用銀被覆複合材料およびその製造方法 WO2009041481A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
CN200880108602A CN101809695A (zh) 2007-09-26 2008-09-25 可动触点用银包覆复合材料及其制造方法
KR1020107008883A KR101501309B1 (ko) 2007-09-26 2008-09-25 가동 접점용 은 피복 복합 재료 및 그의 제조 방법
EP08833392A EP2200056A1 (en) 2007-09-26 2008-09-25 Silver-clad composite material for movable contacts and process for production thereof
US12/680,350 US20100233506A1 (en) 2007-09-26 2008-09-25 Silver-coated composite material for movable contact and method for manufacturing the same

Applications Claiming Priority (12)

Application Number Priority Date Filing Date Title
JP2007-250204 2007-09-26
JP2007250205 2007-09-26
JP2007-250206 2007-09-26
JP2007250204 2007-09-26
JP2007250206 2007-09-26
JP2007-250205 2007-09-26
JP2008-240326 2008-09-19
JP2008-240328 2008-09-19
JP2008240328A JP2009099550A (ja) 2007-09-26 2008-09-19 可動接点用銀被覆複合材料およびその製造方法
JP2008-240327 2008-09-19
JP2008240327A JP4558823B2 (ja) 2007-09-26 2008-09-19 可動接点用銀被覆複合材料およびその製造方法
JP2008240326A JP2009099548A (ja) 2007-09-26 2008-09-19 可動接点用銀被覆複合材料およびその製造方法

Publications (1)

Publication Number Publication Date
WO2009041481A1 true WO2009041481A1 (ja) 2009-04-02

Family

ID=42174244

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/067275 WO2009041481A1 (ja) 2007-09-26 2008-09-25 可動接点用銀被覆複合材料およびその製造方法

Country Status (6)

Country Link
US (1) US20100233506A1 (ja)
EP (1) EP2200056A1 (ja)
KR (1) KR101501309B1 (ja)
CN (1) CN101809695A (ja)
TW (1) TWI428480B (ja)
WO (1) WO2009041481A1 (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8637164B2 (en) * 2010-02-12 2014-01-28 Furukawa Electric Co., Ltd. Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part
CN105304357A (zh) * 2015-09-15 2016-02-03 中国北车集团大连机车车辆有限公司 层式复合触点

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CN102040148A (zh) * 2010-12-15 2011-05-04 广州市镜华金属材料有限公司 电梯门锁用开关触头
DE102011078546A1 (de) * 2011-07-01 2013-01-03 Tyco Electronics Amp Gmbh Elektrische Kontaktbeschichtung
JP5077479B1 (ja) * 2011-12-15 2012-11-21 オムロン株式会社 コンタクトおよびこれを用いた電子部品
JP5923378B2 (ja) * 2012-05-07 2016-05-24 田中貴金属工業株式会社 温度ヒューズ可動電極用の電極材料
WO2013180443A1 (ko) * 2012-05-29 2013-12-05 한국생산기술연구원 구리층을 갖는 철계부스바 및 그 제조방법
US10288997B2 (en) * 2012-12-20 2019-05-14 SeeScan, Inc. Rotating contact assemblies for self-leveling camera heads
US20180241166A9 (en) * 2013-03-13 2018-08-23 Mark S. Olsson Rotating contact assemblies for self-leveling camera heads
TWI510362B (zh) * 2013-04-30 2015-12-01 Nippon Steel & Sumitomo Metal Corp 鍍Ｎｉ鋼板及鍍Ｎｉ鋼板之製造方法
JP2013239437A (ja) * 2013-05-02 2013-11-28 Tanaka Kikinzoku Kogyo Kk リベット型接点及びその製造方法
CN103551575A (zh) * 2013-10-31 2014-02-05 福达合金材料股份有限公司 一种具有自吹弧特性的软磁电触头材料的制备方法及其产品
JP6369742B2 (ja) * 2014-02-26 2018-08-08 北陽電機株式会社 微小機械装置
CN104112609B (zh) * 2014-07-21 2016-04-06 南通万德科技有限公司 耐电弧烧蚀的开关触点及其制备方法
CN104103435B (zh) * 2014-07-21 2016-07-13 南通万德科技有限公司 一种耐电弧烧蚀的钨合金开关触点及其制备方法
CN104103432B (zh) * 2014-07-21 2015-11-18 南通万德科技有限公司 含有钼合金镀层的开关触点及其制备方法
CN104112608B (zh) * 2014-07-21 2016-09-14 南通万德科技有限公司 一种含难熔金属合金镀层的开关触点及其制备方法
CN104112607B (zh) * 2014-07-21 2016-08-17 南通万德科技有限公司 一种镀金的开关触点及其制备方法
DE102015003285A1 (de) * 2015-03-14 2016-09-15 Diehl Metal Applications Gmbh Verfahren zur Beschichtung eines Einpresspins und Einpresspin
US9847468B1 (en) * 2016-06-20 2017-12-19 Asm Technology Singapore Pte Ltd Plated lead frame including doped silver layer
IT201700031070A1 (it) * 2017-03-21 2018-09-21 Aquasan S R L Dispositivo di sterilizzazione a rilascio di ioni d’argento, procedimento per la realizzazione di detto dispositivo ed apparecchiatura filtrante includente detto dispositivo
JP6358378B1 (ja) * 2017-08-09 2018-07-18 日立金属株式会社 クラッド材の製造方法
CN107591257B (zh) * 2017-10-20 2020-11-10 温州宏丰电工合金股份有限公司 一种银基多层复合电接触材料及其制备方法
CN109905503A (zh) * 2019-02-28 2019-06-18 Oppo广东移动通信有限公司 壳体、电子装置以及制备壳体的方法

Citations (7)

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JPS60251294A (ja) * 1984-05-28 1985-12-11 Toppan Printing Co Ltd ニッケルめっき装置
JPS6123789A (ja) * 1984-07-09 1986-02-01 Furukawa Electric Co Ltd:The ステンレス鋼の貴金属メツキ方法
JPS62256992A (ja) * 1986-04-30 1987-11-09 Nippon Kokan Kk <Nkk> 溶接缶用表面処理鋼板の製造方法
JP2005133169A (ja) * 2003-10-31 2005-05-26 Furukawa Electric Co Ltd:The 可動接点用銀被覆ステンレス条とその製造方法
JP2005174788A (ja) * 2003-12-12 2005-06-30 Matsushita Electric Ind Co Ltd プッシュオンスイッチ
JP2007138237A (ja) * 2005-11-17 2007-06-07 Furukawa Electric Co Ltd:The 可動接点用銀被覆ステンレス条およびその製造方法
WO2007119522A1 (ja) * 2006-03-28 2007-10-25 The Furukawa Electric Co., Ltd. 可動接点用銀被覆複合材料およびその製造方法

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US4604169A (en) * 1984-07-09 1986-08-05 Furukawa Electrical Company, Ltd. Process for metal plating a stainless steel
JP2007291509A (ja) * 2006-03-28 2007-11-08 Furukawa Electric Co Ltd:The 可動接点用銀被覆複合材料およびその製造方法

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60251294A (ja) * 1984-05-28 1985-12-11 Toppan Printing Co Ltd ニッケルめっき装置
JPS6123789A (ja) * 1984-07-09 1986-02-01 Furukawa Electric Co Ltd:The ステンレス鋼の貴金属メツキ方法
JPS62256992A (ja) * 1986-04-30 1987-11-09 Nippon Kokan Kk <Nkk> 溶接缶用表面処理鋼板の製造方法
JP2005133169A (ja) * 2003-10-31 2005-05-26 Furukawa Electric Co Ltd:The 可動接点用銀被覆ステンレス条とその製造方法
JP2005174788A (ja) * 2003-12-12 2005-06-30 Matsushita Electric Ind Co Ltd プッシュオンスイッチ
JP2007138237A (ja) * 2005-11-17 2007-06-07 Furukawa Electric Co Ltd:The 可動接点用銀被覆ステンレス条およびその製造方法
WO2007119522A1 (ja) * 2006-03-28 2007-10-25 The Furukawa Electric Co., Ltd. 可動接点用銀被覆複合材料およびその製造方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8637164B2 (en) * 2010-02-12 2014-01-28 Furukawa Electric Co., Ltd. Silver-coated composite material for a movable contact part, method of producing the same, and movable contact part
CN105304357A (zh) * 2015-09-15 2016-02-03 中国北车集团大连机车车辆有限公司 层式复合触点

Also Published As

Publication number Publication date
KR20100080811A (ko) 2010-07-12
KR101501309B1 (ko) 2015-03-10
CN101809695A (zh) 2010-08-18
EP2200056A1 (en) 2010-06-23
TWI428480B (zh) 2014-03-01
US20100233506A1 (en) 2010-09-16
TW200932960A (en) 2009-08-01

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