WO2012096456A3 - 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 - Google Patents
고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 Download PDFInfo
- Publication number
- WO2012096456A3 WO2012096456A3 PCT/KR2011/010073 KR2011010073W WO2012096456A3 WO 2012096456 A3 WO2012096456 A3 WO 2012096456A3 KR 2011010073 W KR2011010073 W KR 2011010073W WO 2012096456 A3 WO2012096456 A3 WO 2012096456A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrical conductivity
- sheet
- nano
- alloy
- high strength
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/04—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/24—Preliminary treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2250/00—Layers arrangement
- B32B2250/42—Alternating layers, e.g. ABAB(C), AABBAABB(C)
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/202—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/50—Properties of the layers or laminate having particular mechanical properties
- B32B2307/54—Yield strength; Tensile strength
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12861—Group VIII or IB metal-base component
- Y10T428/12903—Cu-base component
- Y10T428/1291—Next to Co-, Cu-, or Ni-base component
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Metal Rolling (AREA)
- Conductive Materials (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013549357A JP2014514434A (ja) | 2011-01-12 | 2011-12-26 | 高強度高電気伝導度のナノ結晶粒多層銅合金板材及びこれの製造方法 |
US13/979,467 US9296064B2 (en) | 2011-01-12 | 2011-12-26 | Nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, and method for manufacturing same |
EP11855697.6A EP2664407A2 (en) | 2011-01-12 | 2011-12-26 | Nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, and method for manufacturing same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2011-0002941 | 2011-01-12 | ||
KR1020110002941A KR101227014B1 (ko) | 2011-01-12 | 2011-01-12 | 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2012096456A2 WO2012096456A2 (ko) | 2012-07-19 |
WO2012096456A3 true WO2012096456A3 (ko) | 2012-09-07 |
Family
ID=46507535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/KR2011/010073 WO2012096456A2 (ko) | 2011-01-12 | 2011-12-26 | 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9296064B2 (ko) |
EP (1) | EP2664407A2 (ko) |
JP (1) | JP2014514434A (ko) |
KR (1) | KR101227014B1 (ko) |
WO (1) | WO2012096456A2 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9397343B1 (en) | 2015-10-15 | 2016-07-19 | Chang Chun Petrochemical Co., Ltd. | Copper foil exhibiting anti-swelling properties |
CN108441666B (zh) * | 2018-03-09 | 2020-07-31 | 盐城工学院 | 一种Ti2AlC颗粒增强铜基复合材料的制备方法 |
CN109174965B (zh) * | 2018-08-17 | 2019-11-01 | 中南大学 | 一种制备极薄高性能多层铜/铜铝金属间化合物/铝复合箔材的方法 |
CN112391563B (zh) * | 2019-08-19 | 2021-11-09 | 南京理工大学 | 一种层状纳米异构铝镁合金块体材料制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030073721A (ko) * | 2002-03-13 | 2003-09-19 | 주식회사 효신 | 클래드판의 연속 제조 방법 및 장치 |
KR20030096234A (ko) * | 2000-11-13 | 2003-12-24 | 도요 고한 가부시키가이샤 | 중공 적층체 및 그것을 사용한 히트싱크 |
KR100807847B1 (ko) * | 2006-11-23 | 2008-02-27 | 한국조폐공사 | 주화용 적층 클래드판 및 그 제조방법 |
KR20080091929A (ko) * | 2007-04-10 | 2008-10-15 | 주식회사 풍산홀딩스 | 고전도성, 고강도 및 고가공성을 갖는 전기 및 전자부품용동합금 및 그 제조방법 |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03284869A (ja) * | 1990-03-30 | 1991-12-16 | Sumitomo Special Metals Co Ltd | リードフレーム用クラッド材料 |
JPH0623571A (ja) * | 1992-07-08 | 1994-02-01 | Hitachi Cable Ltd | クラッド条材およびその製造方法 |
JP2001184788A (ja) | 1999-12-22 | 2001-07-06 | Matsushita Electric Ind Co Ltd | データ出力装置 |
JP2003001302A (ja) * | 2001-06-19 | 2003-01-07 | Hitachi Cable Ltd | アルミナ分散強化銅の製造方法 |
JP2005029829A (ja) * | 2003-07-10 | 2005-02-03 | Sumitomo Metal Ind Ltd | 金属薄帯 |
JP2005225063A (ja) * | 2004-02-12 | 2005-08-25 | Furukawa Electric Co Ltd:The | 金属多層材料とその製造方法 |
KR20060013211A (ko) | 2004-08-06 | 2006-02-09 | 한국기계연구원 | 반복겹침접합압연공정에 의한 고강도 구리판재 제조방법 |
JP4637601B2 (ja) | 2005-02-09 | 2011-02-23 | Jx日鉱日石金属株式会社 | 高強度高導電性銅合金の製造方法及び高強度高導電性銅合金 |
KR20090025941A (ko) * | 2007-09-07 | 2009-03-11 | 한국기계연구원 | 3층반복겹침접합압연공정을 이용한 인탈산동판재 제조방법 |
JP2010013691A (ja) * | 2008-07-03 | 2010-01-21 | Kanazawa Univ | 高強度及び高導電性銅合金板材 |
-
2011
- 2011-01-12 KR KR1020110002941A patent/KR101227014B1/ko active IP Right Grant
- 2011-12-26 US US13/979,467 patent/US9296064B2/en active Active
- 2011-12-26 WO PCT/KR2011/010073 patent/WO2012096456A2/ko active Application Filing
- 2011-12-26 JP JP2013549357A patent/JP2014514434A/ja active Pending
- 2011-12-26 EP EP11855697.6A patent/EP2664407A2/en not_active Withdrawn
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20030096234A (ko) * | 2000-11-13 | 2003-12-24 | 도요 고한 가부시키가이샤 | 중공 적층체 및 그것을 사용한 히트싱크 |
KR20030073721A (ko) * | 2002-03-13 | 2003-09-19 | 주식회사 효신 | 클래드판의 연속 제조 방법 및 장치 |
KR100807847B1 (ko) * | 2006-11-23 | 2008-02-27 | 한국조폐공사 | 주화용 적층 클래드판 및 그 제조방법 |
KR20080091929A (ko) * | 2007-04-10 | 2008-10-15 | 주식회사 풍산홀딩스 | 고전도성, 고강도 및 고가공성을 갖는 전기 및 전자부품용동합금 및 그 제조방법 |
Also Published As
Publication number | Publication date |
---|---|
KR101227014B1 (ko) | 2013-01-28 |
US9296064B2 (en) | 2016-03-29 |
KR20120081688A (ko) | 2012-07-20 |
EP2664407A2 (en) | 2013-11-20 |
US20150037609A1 (en) | 2015-02-05 |
WO2012096456A2 (ko) | 2012-07-19 |
JP2014514434A (ja) | 2014-06-19 |
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