WO2012096456A3 - 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 - Google Patents

고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 Download PDF

Info

Publication number
WO2012096456A3
WO2012096456A3 PCT/KR2011/010073 KR2011010073W WO2012096456A3 WO 2012096456 A3 WO2012096456 A3 WO 2012096456A3 KR 2011010073 W KR2011010073 W KR 2011010073W WO 2012096456 A3 WO2012096456 A3 WO 2012096456A3
Authority
WO
WIPO (PCT)
Prior art keywords
electrical conductivity
sheet
nano
alloy
high strength
Prior art date
Application number
PCT/KR2011/010073
Other languages
English (en)
French (fr)
Other versions
WO2012096456A2 (ko
Inventor
김형욱
임차용
Original Assignee
한국기계연구원
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 한국기계연구원 filed Critical 한국기계연구원
Priority to JP2013549357A priority Critical patent/JP2014514434A/ja
Priority to US13/979,467 priority patent/US9296064B2/en
Priority to EP11855697.6A priority patent/EP2664407A2/en
Publication of WO2012096456A2 publication Critical patent/WO2012096456A2/ko
Publication of WO2012096456A3 publication Critical patent/WO2012096456A3/ko

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/04Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a rolling mill
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/22Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
    • B23K20/233Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/24Preliminary treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/01Layered products comprising a layer of metal all layers being exclusively metallic
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/20Layered products comprising a layer of metal comprising aluminium or copper
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/08Non-ferrous metals or alloys
    • B23K2103/12Copper or alloys thereof
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00Layers arrangement
    • B32B2250/42Alternating layers, e.g. ABAB(C), AABBAABB(C)
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/20Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202Conductive
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00Properties of the layers or laminate
    • B32B2307/50Properties of the layers or laminate having particular mechanical properties
    • B32B2307/54Yield strength; Tensile strength
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/12All metal or with adjacent metals
    • Y10T428/12493Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
    • Y10T428/12771Transition metal-base component
    • Y10T428/12861Group VIII or IB metal-base component
    • Y10T428/12903Cu-base component
    • Y10T428/1291Next to Co-, Cu-, or Ni-base component

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Pressure Welding/Diffusion-Bonding (AREA)
  • Metal Rolling (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)

Abstract

본 발명에 의한 고강도 고전기전도도 나노결정립 다층 동합금 판재는, OFC(Oxygen Free Copper)합금과 DLP(Deoxidized Low-Phosphorous copper)합금을 반복적으로 압연접합(Roll-Bonding)하여 85IACS(%)이상의 전기전도도와 400㎫ 이상의 인장강도를 갖는 것을 특징으로 한다. 본 발명에 의한 고강도 고전기전도도 나노결정립 다층 동합금 판재의 제조방법은, OFC(Oxygen Free Copper)합금과 DLP(Deoxidized Low-Phosphorous copper)합금으로 이루어진 판재를 준비하는 재료준비단계와, 상기 판재를 표면처리하는 표면처리단계와, 상기 판재를 반복적으로 압연접합(Roll-Bonding)하여 85IACS(%)이상의 전기전도도와 400㎫ 이상의 인장강도를 갖는 고강도 고전기전도도 나노결정립 다층 동합금 판재를 성형하는 판재성형단계로 이루어지는 것을 특징으로 한다.
PCT/KR2011/010073 2011-01-12 2011-12-26 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법 WO2012096456A2 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013549357A JP2014514434A (ja) 2011-01-12 2011-12-26 高強度高電気伝導度のナノ結晶粒多層銅合金板材及びこれの製造方法
US13/979,467 US9296064B2 (en) 2011-01-12 2011-12-26 Nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, and method for manufacturing same
EP11855697.6A EP2664407A2 (en) 2011-01-12 2011-12-26 Nano-grained multilayer copper alloy sheet having high strength and high electrical conductivity, and method for manufacturing same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2011-0002941 2011-01-12
KR1020110002941A KR101227014B1 (ko) 2011-01-12 2011-01-12 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법

Publications (2)

Publication Number Publication Date
WO2012096456A2 WO2012096456A2 (ko) 2012-07-19
WO2012096456A3 true WO2012096456A3 (ko) 2012-09-07

Family

ID=46507535

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2011/010073 WO2012096456A2 (ko) 2011-01-12 2011-12-26 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법

Country Status (5)

Country Link
US (1) US9296064B2 (ko)
EP (1) EP2664407A2 (ko)
JP (1) JP2014514434A (ko)
KR (1) KR101227014B1 (ko)
WO (1) WO2012096456A2 (ko)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9397343B1 (en) 2015-10-15 2016-07-19 Chang Chun Petrochemical Co., Ltd. Copper foil exhibiting anti-swelling properties
CN108441666B (zh) * 2018-03-09 2020-07-31 盐城工学院 一种Ti2AlC颗粒增强铜基复合材料的制备方法
CN109174965B (zh) * 2018-08-17 2019-11-01 中南大学 一种制备极薄高性能多层铜/铜铝金属间化合物/铝复合箔材的方法
CN112391563B (zh) * 2019-08-19 2021-11-09 南京理工大学 一种层状纳米异构铝镁合金块体材料制备方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030073721A (ko) * 2002-03-13 2003-09-19 주식회사 효신 클래드판의 연속 제조 방법 및 장치
KR20030096234A (ko) * 2000-11-13 2003-12-24 도요 고한 가부시키가이샤 중공 적층체 및 그것을 사용한 히트싱크
KR100807847B1 (ko) * 2006-11-23 2008-02-27 한국조폐공사 주화용 적층 클래드판 및 그 제조방법
KR20080091929A (ko) * 2007-04-10 2008-10-15 주식회사 풍산홀딩스 고전도성, 고강도 및 고가공성을 갖는 전기 및 전자부품용동합금 및 그 제조방법

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03284869A (ja) * 1990-03-30 1991-12-16 Sumitomo Special Metals Co Ltd リードフレーム用クラッド材料
JPH0623571A (ja) * 1992-07-08 1994-02-01 Hitachi Cable Ltd クラッド条材およびその製造方法
JP2001184788A (ja) 1999-12-22 2001-07-06 Matsushita Electric Ind Co Ltd データ出力装置
JP2003001302A (ja) * 2001-06-19 2003-01-07 Hitachi Cable Ltd アルミナ分散強化銅の製造方法
JP2005029829A (ja) * 2003-07-10 2005-02-03 Sumitomo Metal Ind Ltd 金属薄帯
JP2005225063A (ja) * 2004-02-12 2005-08-25 Furukawa Electric Co Ltd:The 金属多層材料とその製造方法
KR20060013211A (ko) 2004-08-06 2006-02-09 한국기계연구원 반복겹침접합압연공정에 의한 고강도 구리판재 제조방법
JP4637601B2 (ja) 2005-02-09 2011-02-23 Jx日鉱日石金属株式会社 高強度高導電性銅合金の製造方法及び高強度高導電性銅合金
KR20090025941A (ko) * 2007-09-07 2009-03-11 한국기계연구원 3층반복겹침접합압연공정을 이용한 인탈산동판재 제조방법
JP2010013691A (ja) * 2008-07-03 2010-01-21 Kanazawa Univ 高強度及び高導電性銅合金板材

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20030096234A (ko) * 2000-11-13 2003-12-24 도요 고한 가부시키가이샤 중공 적층체 및 그것을 사용한 히트싱크
KR20030073721A (ko) * 2002-03-13 2003-09-19 주식회사 효신 클래드판의 연속 제조 방법 및 장치
KR100807847B1 (ko) * 2006-11-23 2008-02-27 한국조폐공사 주화용 적층 클래드판 및 그 제조방법
KR20080091929A (ko) * 2007-04-10 2008-10-15 주식회사 풍산홀딩스 고전도성, 고강도 및 고가공성을 갖는 전기 및 전자부품용동합금 및 그 제조방법

Also Published As

Publication number Publication date
KR101227014B1 (ko) 2013-01-28
US9296064B2 (en) 2016-03-29
KR20120081688A (ko) 2012-07-20
EP2664407A2 (en) 2013-11-20
US20150037609A1 (en) 2015-02-05
WO2012096456A2 (ko) 2012-07-19
JP2014514434A (ja) 2014-06-19

Similar Documents

Publication Publication Date Title
EP2515392A3 (en) Process of fabricating a slip ring component
EP3466570A4 (en) METHOD FOR PRODUCING SILVER-COATED COPPER NANO WIRE WITH CORE-SHELL STRUCTURE USING A CHEMICAL REDUCTION METHOD
EP2535908A4 (en) Silver-coated composite material for movable contact component, method for producing same, and movable contact component
EP3029168A4 (en) Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment
WO2009089513A3 (en) Methods of generating supported nanocatalysts and compositions thereof
EP3666914A4 (en) HIGH STRENGTH / HIGHLY CONDUCTIVE COPPER ALLOY PLATE MATERIAL AND METHOD OF MANUFACTURING THEREOF
MX2012008415A (es) Metodo para la aplicacion de un nanorrevestimiento conformable por medio de un procedimiento de plasma de baja presion.
EP2610359A4 (en) Copper alloy sheet and method for producing same
EP2612750A3 (en) Methods to form electrical interconnects on opthalmic devices
IN2014DN03003A (ko)
EP2319947A4 (en) COPPER ALLOY MATERIAL FOR ELECTRICAL AND ELECTRONIC COMPONENTS AND METHOD OF MANUFACTURING THE SAME
EP2592164A4 (en) CU-NI-SI COPPER ALLOY PLATE WITH OUTSTANDING DEEP POWDER FEATURES AND METHOD OF MANUFACTURING THEREOF
PH12018501391A1 (en) Copper alloy material for automobile and electrical and electronic components and method of producing the same
EP2278033A4 (en) WHITE-SILVER COPPER ALLOY AND METHOD FOR MANUFACTURING THE SAME
EP2796577A4 (en) CU-NI-SI BASED COPPER ALLOY WITH HIGH ABRASION STRENGTH MATRIZE AND GOOD SHEAR PROCESSABILITY AND MANUFACTURING METHOD THEREFOR
WO2012121515A3 (ko) 셀레늄화구리인듐 나노입자 및 그의 제조 방법
WO2013011127A3 (de) Thermoelektrisches modul, verfahren zur herstellung eines thermoelektrischen moduls und verwendung eines metallischen glases oder eines gesinterten werkstoffes
EP3006588A4 (en) COPPER ALLOY MANUFACTURING METHOD AND COPPER ALLOY
WO2012096456A3 (ko) 고강도 고전기전도도 나노결정립 다층 동합금 판재 및 이의 제조방법
TWI562294B (en) Method for producing an electrical component, and electrical component
EP2479297A4 (en) COPPER ALLOY WIRE AND METHOD OF MANUFACTURING THEREOF
PH12013000337B1 (en) Copper alloy material for electrical and electronic components and method of preparing the same
BR112017028216A2 (pt) material compósito condutivo, e, método para fabricação de um material compósito condutivo
EP3674016A4 (en) COPPER ALLOY POWDER FOR LAMINATION FORMING, LAMINATE FORMED PRODUCT PRODUCTION PROCESS, AND LAMINATE FORMED PRODUCT
EP3109260A4 (en) Aminosilane terminal modifier to which functional group has been introduced, method for producing terminal-modified conjugated diene polymer using the aminosilane terminal modifier, and terminal-modified conjugated diene polymer produced according to the method

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 11855697

Country of ref document: EP

Kind code of ref document: A2

ENP Entry into the national phase

Ref document number: 2013549357

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

REEP Request for entry into the european phase

Ref document number: 2011855697

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 2011855697

Country of ref document: EP

WWE Wipo information: entry into national phase

Ref document number: 13979467

Country of ref document: US