JP4663975B2 - 電子部品用パッケージ - Google Patents

電子部品用パッケージ Download PDF

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Publication number
JP4663975B2
JP4663975B2 JP2003400508A JP2003400508A JP4663975B2 JP 4663975 B2 JP4663975 B2 JP 4663975B2 JP 2003400508 A JP2003400508 A JP 2003400508A JP 2003400508 A JP2003400508 A JP 2003400508A JP 4663975 B2 JP4663975 B2 JP 4663975B2
Authority
JP
Japan
Prior art keywords
plating
package
thickness
layer
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2003400508A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004080060A (ja
JP2004080060A5 (enExample
Inventor
英志 松原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niterra Co Ltd
Original Assignee
NGK Spark Plug Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Spark Plug Co Ltd filed Critical NGK Spark Plug Co Ltd
Priority to JP2003400508A priority Critical patent/JP4663975B2/ja
Publication of JP2004080060A publication Critical patent/JP2004080060A/ja
Publication of JP2004080060A5 publication Critical patent/JP2004080060A5/ja
Application granted granted Critical
Publication of JP4663975B2 publication Critical patent/JP4663975B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item

Landscapes

  • Electroplating Methods And Accessories (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2003400508A 2003-11-28 2003-11-28 電子部品用パッケージ Expired - Fee Related JP4663975B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003400508A JP4663975B2 (ja) 2003-11-28 2003-11-28 電子部品用パッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003400508A JP4663975B2 (ja) 2003-11-28 2003-11-28 電子部品用パッケージ

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP29447398A Division JP3512653B2 (ja) 1998-09-30 1998-09-30 電子部品用パッケージの製造方法

Publications (3)

Publication Number Publication Date
JP2004080060A JP2004080060A (ja) 2004-03-11
JP2004080060A5 JP2004080060A5 (enExample) 2005-12-22
JP4663975B2 true JP4663975B2 (ja) 2011-04-06

Family

ID=32025987

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003400508A Expired - Fee Related JP4663975B2 (ja) 2003-11-28 2003-11-28 電子部品用パッケージ

Country Status (1)

Country Link
JP (1) JP4663975B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3764160B2 (ja) * 2004-09-10 2006-04-05 三井金属鉱業株式会社 キャパシタ層形成材及びキャパシタ層形成材を用いて得られる内蔵キャパシタ回路を備えるプリント配線板。
JP4765099B2 (ja) * 2005-10-28 2011-09-07 富士電機株式会社 半導体装置およびその製造方法
US20080298024A1 (en) * 2007-05-31 2008-12-04 A.L.M.T. Corp. Heat spreader and method for manufacturing the same, and semiconductor device
JP5747805B2 (ja) * 2011-12-12 2015-07-15 株式会社デンソー 電子装置

Also Published As

Publication number Publication date
JP2004080060A (ja) 2004-03-11

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