KR20070057992A - 다른 표면에 이송 가능한 맨드릴 상에서 제작되는 전기주조스프링 - Google Patents

다른 표면에 이송 가능한 맨드릴 상에서 제작되는 전기주조스프링 Download PDF

Info

Publication number
KR20070057992A
KR20070057992A KR1020077009658A KR20077009658A KR20070057992A KR 20070057992 A KR20070057992 A KR 20070057992A KR 1020077009658 A KR1020077009658 A KR 1020077009658A KR 20077009658 A KR20077009658 A KR 20077009658A KR 20070057992 A KR20070057992 A KR 20070057992A
Authority
KR
South Korea
Prior art keywords
mandrel
contact
plating
substrate
elastic contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
KR1020077009658A
Other languages
English (en)
Korean (ko)
Inventor
벤자민 엔 엘드릿지
개탄 엘 매튜
Original Assignee
폼팩터, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 폼팩터, 인코포레이티드 filed Critical 폼팩터, 인코포레이티드
Publication of KR20070057992A publication Critical patent/KR20070057992A/ko
Ceased legal-status Critical Current

Links

Images

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/10—Moulds; Masks; Masterforms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P21/00—Machines for assembling a multiplicity of different parts to compose units, with or without preceding or subsequent working of such parts, e.g. with programme control
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/1601—Process or apparatus
    • C23C18/1633—Process of electroless plating
    • C23C18/1655—Process features
    • C23C18/1657—Electroless forming, i.e. substrate removed or destroyed at the end of the process
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/31—Coating with metals
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D1/00—Electroforming
    • C25D1/20—Separation of the formed objects from the electrodes with no destruction of said electrodes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0726—Electroforming, i.e. electroplating on a metallic carrier thereby forming a self-supporting structure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H05K3/326—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49149—Assembling terminal to base by metal fusion bonding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y10T29/49151—Assembling terminal to base by deforming or shaping
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49204—Contact or terminal manufacturing
    • Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53313—Means to interrelatedly feed plural work parts from plural sources without manual intervention
    • Y10T29/53378—Means to interrelatedly feed plural work parts from plural sources without manual intervention including converging conveyors

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Mechanical Engineering (AREA)
  • General Chemical & Material Sciences (AREA)
  • Electrochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Leads Or Probes (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
KR1020077009658A 2004-10-22 2005-10-21 다른 표면에 이송 가능한 맨드릴 상에서 제작되는 전기주조스프링 Ceased KR20070057992A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/971,489 2004-10-22
US10/971,489 US7621044B2 (en) 2004-10-22 2004-10-22 Method of manufacturing a resilient contact

Publications (1)

Publication Number Publication Date
KR20070057992A true KR20070057992A (ko) 2007-06-07

Family

ID=36204834

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020077009658A Ceased KR20070057992A (ko) 2004-10-22 2005-10-21 다른 표면에 이송 가능한 맨드릴 상에서 제작되는 전기주조스프링

Country Status (7)

Country Link
US (1) US7621044B2 (enExample)
EP (1) EP1807240A4 (enExample)
JP (1) JP2008518209A (enExample)
KR (1) KR20070057992A (enExample)
CN (1) CN100524976C (enExample)
TW (1) TW200620512A (enExample)
WO (1) WO2006047349A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295979B1 (ko) * 2005-07-15 2013-08-13 산동 겟탑 어쿠스틱 캄파니 리미티드 Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7073254B2 (en) * 1993-11-16 2006-07-11 Formfactor, Inc. Method for mounting a plurality of spring contact elements
US8033838B2 (en) 1996-02-21 2011-10-11 Formfactor, Inc. Microelectronic contact structure
US6888362B2 (en) * 2000-11-09 2005-05-03 Formfactor, Inc. Test head assembly for electronic components with plurality of contoured microelectronic spring contacts
CN102097458B (zh) 2004-06-04 2013-10-30 伊利诺伊大学评议会 用于制造并组装可印刷半导体元件的方法和设备
US7799699B2 (en) * 2004-06-04 2010-09-21 The Board Of Trustees Of The University Of Illinois Printable semiconductor structures and related methods of making and assembling
TWI438827B (zh) 2006-09-20 2014-05-21 美國伊利諾大學理事會 用於製造可印刷半導體結構、裝置及裝置元件的脫離對策
WO2008041484A1 (fr) * 2006-09-26 2008-04-10 Alps Electric Co., Ltd. Contact élastique et procédé de liage entre des bornes métalliques l'utilisant
US8354855B2 (en) * 2006-10-16 2013-01-15 Formfactor, Inc. Carbon nanotube columns and methods of making and using carbon nanotube columns as probes
US7674112B2 (en) * 2006-12-28 2010-03-09 Formfactor, Inc. Resilient contact element and methods of fabrication
US8149007B2 (en) * 2007-10-13 2012-04-03 Formfactor, Inc. Carbon nanotube spring contact structures with mechanical and electrical components
US7683494B1 (en) * 2008-06-18 2010-03-23 Zilog, Inc. Press-fit integrated circuit package involving compressed spring contact beams
US8886334B2 (en) 2008-10-07 2014-11-11 Mc10, Inc. Systems, methods, and devices using stretchable or flexible electronics for medical applications
US8389862B2 (en) 2008-10-07 2013-03-05 Mc10, Inc. Extremely stretchable electronics
US8097926B2 (en) 2008-10-07 2012-01-17 Mc10, Inc. Systems, methods, and devices having stretchable integrated circuitry for sensing and delivering therapy
WO2010042653A1 (en) 2008-10-07 2010-04-15 Mc10, Inc. Catheter balloon having stretchable integrated circuitry and sensor array
US8372726B2 (en) 2008-10-07 2013-02-12 Mc10, Inc. Methods and applications of non-planar imaging arrays
US20100104678A1 (en) * 2008-10-28 2010-04-29 Formfactor, Inc. Apparatus and method for making and using a tooling die
US8272124B2 (en) * 2009-04-03 2012-09-25 Formfactor, Inc. Anchoring carbon nanotube columns
US20100252317A1 (en) * 2009-04-03 2010-10-07 Formfactor, Inc. Carbon nanotube contact structures for use with semiconductor dies and other electronic devices
US8865489B2 (en) 2009-05-12 2014-10-21 The Board Of Trustees Of The University Of Illinois Printed assemblies of ultrathin, microscale inorganic light emitting diodes for deformable and semitransparent displays
WO2011041727A1 (en) 2009-10-01 2011-04-07 Mc10, Inc. Protective cases with integrated electronics
JP5373571B2 (ja) * 2009-11-30 2013-12-18 日本電子材料株式会社 プローブカード
US9936574B2 (en) 2009-12-16 2018-04-03 The Board Of Trustees Of The University Of Illinois Waterproof stretchable optoelectronics
JP6046491B2 (ja) 2009-12-16 2016-12-21 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ コンフォーマル電子機器を使用した生体内での電気生理学
US10441185B2 (en) 2009-12-16 2019-10-15 The Board Of Trustees Of The University Of Illinois Flexible and stretchable electronic systems for epidermal electronics
JP5751728B2 (ja) 2010-03-17 2015-07-22 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 生体吸収性基板上の埋め込み型バイオメディカルデバイス
WO2012158709A1 (en) 2011-05-16 2012-11-22 The Board Of Trustees Of The University Of Illinois Thermally managed led arrays assembled by printing
JP2014523633A (ja) 2011-05-27 2014-09-11 エムシー１０ インコーポレイテッド 電子的、光学的、且つ／又は機械的装置及びシステム並びにこれらの装置及びシステムを製造する方法
WO2012167096A2 (en) 2011-06-03 2012-12-06 The Board Of Trustees Of The University Of Illinois Conformable actively multiplexed high-density surface electrode array for brain interfacing
EP2786644B1 (en) 2011-12-01 2019-04-10 The Board of Trustees of the University of Illionis Transient devices designed to undergo programmable transformations
JP2015521303A (ja) 2012-03-30 2015-07-27 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシ 表面への形状適合可能な付属物装着可能電子デバイス
US9171794B2 (en) 2012-10-09 2015-10-27 Mc10, Inc. Embedding thin chips in polymer
JP2018524677A (ja) 2015-06-01 2018-08-30 ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ 無線電力及び近距離無線通信機能を備えた小型電子システム
WO2016196673A1 (en) 2015-06-01 2016-12-08 The Board Of Trustees Of The University Of Illinois Alternative approach to uv sensing
KR102329801B1 (ko) 2015-10-21 2021-11-22 삼성전자주식회사 테스트 소켓의 제조 방법 및 반도체 패키지의 테스트 방법
US10925543B2 (en) 2015-11-11 2021-02-23 The Board Of Trustees Of The University Of Illinois Bioresorbable silicon electronics for transient implants
CN105624668A (zh) * 2016-01-04 2016-06-01 兰州理工大学 三维立体网状织构组织复合涂层及其制备方法
WO2017155155A1 (ko) * 2016-03-07 2017-09-14 주식회사 이노글로벌 반도체 디바이스 테스트용 양방향 도전성 소켓, 반도체 디바이스 테스트용 양방향 도전성 모듈 및 이의 제조방법
CN109411937B (zh) * 2017-08-14 2021-09-21 富顶精密组件（深圳）有限公司 电连接器及其制造方法
US10128593B1 (en) * 2017-09-28 2018-11-13 International Business Machines Corporation Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
CN110519916B (zh) * 2019-08-14 2022-03-01 云谷（固安）科技有限公司 一种柔性电路板以及压接装置
CN110461102A (zh) * 2019-09-06 2019-11-15 苏州科源利电子有限公司 一种压条下压弹簧探针结构
US11657963B2 (en) 2020-09-15 2023-05-23 Enphase Energy, Inc. Transformer helix winding production

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4745670A (en) 1980-10-28 1988-05-24 Rockwell International Corporation Method for making chemical laser nozzle arrays
US5476211A (en) 1993-11-16 1995-12-19 Form Factor, Inc. Method of manufacturing electrical contacts, using a sacrificial member
US5230787A (en) 1991-12-30 1993-07-27 Xerox Corporation Spring and process for making a spring for a fluid bearing by electroforming
US5299939A (en) * 1992-03-05 1994-04-05 International Business Machines Corporation Spring array connector
US5974662A (en) 1993-11-16 1999-11-02 Formfactor, Inc. Method of planarizing tips of probe elements of a probe card assembly
US5772451A (en) 1993-11-16 1998-06-30 Form Factor, Inc. Sockets for electronic components and methods of connecting to electronic components
US6482013B2 (en) 1993-11-16 2002-11-19 Formfactor, Inc. Microelectronic spring contact element and electronic component having a plurality of spring contact elements
US6336269B1 (en) 1993-11-16 2002-01-08 Benjamin N. Eldridge Method of fabricating an interconnection element
US20020121274A1 (en) 1995-04-05 2002-09-05 Aerogen, Inc. Laminated electroformed aperture plate
US6036832A (en) 1996-04-19 2000-03-14 Stork Veco B.V. Electroforming method, electroforming mandrel and electroformed product
EP0839323B1 (en) * 1996-05-17 2004-08-25 Formfactor, Inc. Microelectronic spring contact elements
DE19735831A1 (de) * 1997-08-18 1999-02-25 Zeiss Carl Fa Galvanoplastische Optik-Fassung
DE19853445C2 (de) 1998-11-19 2001-08-09 Siemens Ag Verfahren zur galvanischen Herstellung von Kontaktnadeln und einer Kontaktnadelanordnung, Kontaktnadeln und Kontaktnadelanordnung
KR20080047629A (ko) * 1998-12-02 2008-05-29 폼팩터, 인크. 전기 접촉 구조체의 제조 방법
JP2000241452A (ja) * 1999-02-17 2000-09-08 Tokyo Electron Ltd プロービングカードの製造方法
US6558584B1 (en) * 2000-03-31 2003-05-06 Bausch & Lomb Incorporated Apparatus and method for handling an ophthalmic lens
CN1506692A (zh) * 2002-12-12 2004-06-23 聿勤科技股份有限公司 具有弹性接点的ic测试工具
JP2005106762A (ja) * 2003-10-02 2005-04-21 Sumitomo Metal Mining Co Ltd Ｌｓｉ検査用プローブ基板およびその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101295979B1 (ko) * 2005-07-15 2013-08-13 산동 겟탑 어쿠스틱 캄파니 리미티드 Ｍｅｍｓ 패키지 및 ｍｅｍｓ 패키지 제조 방법

Also Published As

Publication number Publication date
EP1807240A4 (en) 2009-04-01
JP2008518209A (ja) 2008-05-29
CN100524976C (zh) 2009-08-05
WO2006047349A3 (en) 2007-02-22
TW200620512A (en) 2006-06-16
US7621044B2 (en) 2009-11-24
US20060085976A1 (en) 2006-04-27
EP1807240A2 (en) 2007-07-18
WO2006047349A2 (en) 2006-05-04
CN101048920A (zh) 2007-10-03

Similar Documents

Publication Publication Date Title
US7621044B2 (en) Method of manufacturing a resilient contact
KR100252457B1 (ko) 캔틸레버 요소및 희생기층을 사용하는 상호 접속요소의 제작방법
US6741085B1 (en) Contact carriers (tiles) for populating larger substrates with spring contacts
JP3386077B2 (ja) プローブカード・アセンブリ及びキット、及びそれらを用いる方法
US6023103A (en) Chip-scale carrier for semiconductor devices including mounted spring contacts
US7330039B2 (en) Method for making a socket to perform testing on integrated circuits
US6246247B1 (en) Probe card assembly and kit, and methods of using same
US7127811B2 (en) Methods of fabricating and using shaped springs
US6215196B1 (en) Electronic component with terminals and spring contact elements extending from areas which are remote from the terminals
US5974662A (en) Method of planarizing tips of probe elements of a probe card assembly
US20090291573A1 (en) Probe card assembly and kit, and methods of making same
JP2001502851A (ja) 対応する端子から離れた領域に弾性接触要素を有する電子部品
WO1996038858A2 (en) Method and probe card for testing semiconductor devices
US7458816B1 (en) Shaped spring
EP1275150A2 (en) Shaped springs and methods of fabricating and using shaped springs
WO1997016866A2 (en) Chip interconnection carrier and methods of mounting spring contacts to semiconductor devices
KR100312872B1 (ko) 초소형전자스프링접촉요소
EP0792462A1 (en) Probe card assembly and kit, and methods of using same

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20070427

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20101021

Comment text: Request for Examination of Application

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20120507

Patent event code: PE09021S01D

AMND Amendment
E601 Decision to refuse application
PE0601 Decision on rejection of patent

Patent event date: 20130321

Comment text: Decision to Refuse Application

Patent event code: PE06012S01D

Patent event date: 20120507

Comment text: Notification of reason for refusal

Patent event code: PE06011S01I

AMND Amendment
J201 Request for trial against refusal decision
PJ0201 Trial against decision of rejection

Patent event date: 20130410

Comment text: Request for Trial against Decision on Refusal

Patent event code: PJ02012R01D

Patent event date: 20130321

Comment text: Decision to Refuse Application

Patent event code: PJ02011S01I

Appeal kind category: Appeal against decision to decline refusal

Decision date: 20140310

Appeal identifier: 2013101002689

Request date: 20130410

PB0901 Examination by re-examination before a trial

Comment text: Amendment to Specification, etc.

Patent event date: 20130410

Patent event code: PB09011R02I

Comment text: Request for Trial against Decision on Refusal

Patent event date: 20130410

Patent event code: PB09011R01I

Comment text: Amendment to Specification, etc.

Patent event date: 20121107

Patent event code: PB09011R02I

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

Comment text: Notification of reason for refusal

Patent event date: 20130612

Patent event code: PE09021S01D

B601 Maintenance of original decision after re-examination before a trial
PB0601 Maintenance of original decision after re-examination before a trial

Comment text: Report of Result of Re-examination before a Trial

Patent event code: PB06011S01D

Patent event date: 20131226

J801 Dismissal of trial

Free format text: REJECTION OF TRIAL FOR APPEAL AGAINST DECISION TO DECLINE REFUSAL REQUESTED 20130410

Effective date: 20140310

PJ0801 Rejection of trial

Patent event date: 20140310

Patent event code: PJ08011S01D

Comment text: Decision on Dismissal of Request for Trial (Dismissal of Decision)

Decision date: 20140310

Appeal kind category: Appeal against decision to decline refusal

Appeal identifier: 2013101002689

Request date: 20130410