JP2008311664A5 - - Google Patents
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- Publication number
- JP2008311664A5 JP2008311664A5 JP2008155877A JP2008155877A JP2008311664A5 JP 2008311664 A5 JP2008311664 A5 JP 2008311664A5 JP 2008155877 A JP2008155877 A JP 2008155877A JP 2008155877 A JP2008155877 A JP 2008155877A JP 2008311664 A5 JP2008311664 A5 JP 2008311664A5
- Authority
- JP
- Japan
- Prior art keywords
- phase change
- precursor
- forming
- group
- change material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002243 precursor Substances 0.000 claims 26
- 238000000034 method Methods 0.000 claims 17
- 239000012782 phase change material Substances 0.000 claims 12
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 8
- 229910052787 antimony Inorganic materials 0.000 claims 7
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 claims 7
- 229910052732 germanium Inorganic materials 0.000 claims 7
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims 7
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims 6
- 229910052799 carbon Inorganic materials 0.000 claims 6
- 125000003342 alkenyl group Chemical group 0.000 claims 5
- 125000000217 alkyl group Chemical group 0.000 claims 5
- 125000000304 alkynyl group Chemical group 0.000 claims 5
- 229910052714 tellurium Inorganic materials 0.000 claims 5
- PORWMNRCUJJQNO-UHFFFAOYSA-N tellurium atom Chemical compound [Te] PORWMNRCUJJQNO-UHFFFAOYSA-N 0.000 claims 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 4
- 239000000126 substance Substances 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 3
- 229910052739 hydrogen Inorganic materials 0.000 claims 3
- 239000001257 hydrogen Substances 0.000 claims 3
- 229910052757 nitrogen Inorganic materials 0.000 claims 3
- 239000000758 substrate Substances 0.000 claims 3
- 238000000231 atomic layer deposition Methods 0.000 claims 2
- 238000005229 chemical vapour deposition Methods 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- 125000003277 amino group Chemical group 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020070059001A KR100888617B1 (ko) | 2007-06-15 | 2007-06-15 | 상변화 메모리 장치 및 그 형성 방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008311664A JP2008311664A (ja) | 2008-12-25 |
| JP2008311664A5 true JP2008311664A5 (enExample) | 2011-08-11 |
Family
ID=40131450
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008155877A Pending JP2008311664A (ja) | 2007-06-15 | 2008-06-13 | 相変化メモリ装置及びその形成方法 |
Country Status (4)
| Country | Link |
|---|---|
| US (3) | US7943502B2 (enExample) |
| JP (1) | JP2008311664A (enExample) |
| KR (1) | KR100888617B1 (enExample) |
| TW (1) | TW200908303A (enExample) |
Families Citing this family (44)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4017650B2 (ja) | 2005-12-02 | 2007-12-05 | シャープ株式会社 | 可変抵抗素子及びその製造方法 |
| TWI284389B (en) * | 2005-12-28 | 2007-07-21 | Ind Tech Res Inst | Phase change memory (PCM) device and fabricating method thereof |
| US8288198B2 (en) | 2006-05-12 | 2012-10-16 | Advanced Technology Materials, Inc. | Low temperature deposition of phase change memory materials |
| JP5320295B2 (ja) | 2006-11-02 | 2013-10-23 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 金属薄膜のcvd/aldに有用なアンチモンおよびゲルマニウム錯体 |
| KR100888617B1 (ko) * | 2007-06-15 | 2009-03-17 | 삼성전자주식회사 | 상변화 메모리 장치 및 그 형성 방법 |
| KR20100084157A (ko) * | 2007-09-17 | 2010-07-23 | 레르 리키드 쏘시에떼 아노님 뿌르 레드 에렉스뿔라따시옹 데 프로세데 조르즈 클로드 | Gst 필름 증착용 텔루륨 전구체 |
| KR20090029488A (ko) * | 2007-09-18 | 2009-03-23 | 삼성전자주식회사 | Te 함유 칼코게나이드막 형성 방법 및 상변화 메모리소자 제조 방법 |
| US20090215225A1 (en) | 2008-02-24 | 2009-08-27 | Advanced Technology Materials, Inc. | Tellurium compounds useful for deposition of tellurium containing materials |
| US7812335B2 (en) * | 2008-04-11 | 2010-10-12 | Sandisk 3D Llc | Sidewall structured switchable resistor cell |
| US8133793B2 (en) | 2008-05-16 | 2012-03-13 | Sandisk 3D Llc | Carbon nano-film reversible resistance-switchable elements and methods of forming the same |
| US8636845B2 (en) | 2008-06-25 | 2014-01-28 | L'Air Liquide, Société Anonyme pour l'Etude et l'Exploitation des Procédés Georges Claude | Metal heterocyclic compounds for deposition of thin films |
| US8569730B2 (en) * | 2008-07-08 | 2013-10-29 | Sandisk 3D Llc | Carbon-based interface layer for a memory device and methods of forming the same |
| US8557685B2 (en) * | 2008-08-07 | 2013-10-15 | Sandisk 3D Llc | Memory cell that includes a carbon-based memory element and methods of forming the same |
| US8835892B2 (en) * | 2008-10-30 | 2014-09-16 | Sandisk 3D Llc | Electronic devices including carbon nano-tube films having boron nitride-based liners, and methods of forming the same |
| US8421050B2 (en) * | 2008-10-30 | 2013-04-16 | Sandisk 3D Llc | Electronic devices including carbon nano-tube films having carbon-based liners, and methods of forming the same |
| US20100108976A1 (en) * | 2008-10-30 | 2010-05-06 | Sandisk 3D Llc | Electronic devices including carbon-based films, and methods of forming such devices |
| US8330136B2 (en) | 2008-12-05 | 2012-12-11 | Advanced Technology Materials, Inc. | High concentration nitrogen-containing germanium telluride based memory devices and processes of making |
| US8183121B2 (en) | 2009-03-31 | 2012-05-22 | Sandisk 3D Llc | Carbon-based films, and methods of forming the same, having dielectric filler material and exhibiting reduced thermal resistance |
| JPWO2010116707A1 (ja) * | 2009-04-09 | 2012-10-18 | パナソニック株式会社 | 情報記録媒体及び情報記録媒体の製造方法 |
| US8697486B2 (en) | 2009-04-15 | 2014-04-15 | Micro Technology, Inc. | Methods of forming phase change materials and methods of forming phase change memory circuitry |
| US8148580B2 (en) | 2009-04-15 | 2012-04-03 | Micron Technology, Inc. | Methods of forming a tellurium alkoxide and methods of forming a mixed halide-alkoxide of tellurium |
| TW201247589A (en) | 2009-05-22 | 2012-12-01 | Advanced Tech Materials | Low temperature GST process |
| WO2011095849A1 (en) | 2010-02-03 | 2011-08-11 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Chalcogenide-containing precursors, methods of making, and methods of using the same for thin film deposition |
| WO2011119175A1 (en) | 2010-03-26 | 2011-09-29 | Advanced Technology Materials, Inc. | Germanium antimony telluride materials and devices incorporating same |
| WO2011146913A2 (en) | 2010-05-21 | 2011-11-24 | Advanced Technology Materials, Inc. | Germanium antimony telluride materials and devices incorporating same |
| JP5699516B2 (ja) * | 2010-10-07 | 2015-04-15 | 日本電気株式会社 | 電極に接する絶縁膜の製造方法及びその絶縁膜を含む半導体装置 |
| JP2012174827A (ja) | 2011-02-21 | 2012-09-10 | Elpida Memory Inc | 半導体装置及びその製造方法 |
| JP6202798B2 (ja) * | 2011-10-12 | 2017-09-27 | エーエスエム インターナショナル エヌ.ヴェー.Asm International N.V. | 酸化アンチモン膜の原子層堆積 |
| US8981330B2 (en) * | 2012-07-16 | 2015-03-17 | Macronix International Co., Ltd. | Thermally-confined spacer PCM cells |
| WO2014070682A1 (en) | 2012-10-30 | 2014-05-08 | Advaned Technology Materials, Inc. | Double self-aligned phase change memory device structure |
| US9012880B2 (en) * | 2013-02-21 | 2015-04-21 | Winbond Electronics Corp. | Resistance memory device |
| WO2015049773A1 (ja) | 2013-10-03 | 2015-04-09 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置、及び、半導体装置の製造方法 |
| US9627612B2 (en) | 2014-02-27 | 2017-04-18 | International Business Machines Corporation | Metal nitride keyhole or spacer phase change memory cell structures |
| WO2015129021A1 (ja) | 2014-02-28 | 2015-09-03 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッド | 半導体装置、及び半導体装置の製造方法 |
| JP6259073B2 (ja) * | 2014-03-28 | 2018-01-10 | 株式会社日立製作所 | 相変化薄膜気相成長方法 |
| JP5869092B2 (ja) * | 2014-11-27 | 2016-02-24 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置 |
| JP6143830B2 (ja) * | 2015-11-06 | 2017-06-07 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 半導体装置、及び半導体装置の製造方法 |
| JP6117327B2 (ja) * | 2015-12-24 | 2017-04-19 | ユニサンティス エレクトロニクス シンガポール プライベート リミテッドUnisantis Electronics Singapore Pte Ltd. | 記憶装置 |
| KR102673120B1 (ko) | 2016-12-05 | 2024-06-05 | 삼성전자주식회사 | 반도체 장치 및 그 제조 방법 |
| US10580978B2 (en) * | 2017-01-08 | 2020-03-03 | Intermolecular, Inc. | Current compliance layers and memory arrays comprising thereof |
| JP2020027818A (ja) | 2018-08-09 | 2020-02-20 | キオクシア株式会社 | 半導体記憶装置 |
| CN109786550B (zh) * | 2019-03-18 | 2024-04-05 | 北京时代全芯存储技术股份有限公司 | 相变化记忆体及其制造方法 |
| JP2021048159A (ja) | 2019-09-17 | 2021-03-25 | キオクシア株式会社 | 半導体記憶装置 |
| US11957069B2 (en) | 2021-10-22 | 2024-04-09 | International Business Machines Corporation | Contact resistance of a metal liner in a phase change memory cell |
Family Cites Families (30)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6958300B2 (en) * | 2002-08-28 | 2005-10-25 | Micron Technology, Inc. | Systems and methods for forming metal oxides using metal organo-amines and metal organo-oxides |
| EP1576670B1 (en) * | 2002-12-19 | 2007-02-21 | Koninklijke Philips Electronics N.V. | Electric device with phase change material and parallel heater |
| US7425735B2 (en) * | 2003-02-24 | 2008-09-16 | Samsung Electronics Co., Ltd. | Multi-layer phase-changeable memory devices |
| US6927410B2 (en) * | 2003-09-04 | 2005-08-09 | Silicon Storage Technology, Inc. | Memory device with discrete layers of phase change memory material |
| DE102004014487A1 (de) * | 2004-03-24 | 2005-11-17 | Infineon Technologies Ag | Speicherbauelement mit in isolierendes Material eingebettetem, aktiven Material |
| US7332852B2 (en) * | 2004-07-02 | 2008-02-19 | Samsung Electronics Co., Ltd. | One-way transparent optical system having light absorption elements and light refracting structures |
| KR100626381B1 (ko) * | 2004-07-19 | 2006-09-20 | 삼성전자주식회사 | 상변화 기억 소자 및 그 형성 방법 |
| DE102004041905A1 (de) * | 2004-08-30 | 2006-03-02 | Infineon Technologies Ag | Reaktiver Sputterprozess zur Optimierung der thermischen Stabilität dünner Chalkogenidschichten |
| KR100652378B1 (ko) * | 2004-09-08 | 2006-12-01 | 삼성전자주식회사 | 안티몬 프리커서 및 이를 이용한 상변화 메모리 소자의 제조방법 |
| KR100618879B1 (ko) * | 2004-12-27 | 2006-09-01 | 삼성전자주식회사 | 게르마늄 전구체, 이를 이용하여 형성된 gst 박막,상기 박막의 제조 방법 및 상변화 메모리 소자 |
| KR100640620B1 (ko) * | 2004-12-27 | 2006-11-02 | 삼성전자주식회사 | 트윈비트 셀 구조의 nor형 플래쉬 메모리 소자 및 그제조 방법 |
| KR100585175B1 (ko) * | 2005-01-31 | 2006-05-30 | 삼성전자주식회사 | 화학 기상 증착법에 의한 GeSbTe 박막의 제조방법 |
| KR100688532B1 (ko) * | 2005-02-14 | 2007-03-02 | 삼성전자주식회사 | 텔루르 전구체, 이를 이용하여 제조된 Te-함유 칼코게나이드(chalcogenide) 박막, 상기 박막의 제조방법 및 상변화 메모리 소자 |
| KR100707182B1 (ko) * | 2005-02-18 | 2007-04-13 | 삼성전자주식회사 | 상전이 메모리 소자 및 제조방법 |
| US7229883B2 (en) * | 2005-02-23 | 2007-06-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Phase change memory device and method of manufacture thereof |
| US7439338B2 (en) * | 2005-06-28 | 2008-10-21 | Micron Technology, Inc. | Beta-diketiminate ligand sources and metal-containing compounds thereof, and systems and methods including same |
| KR100704125B1 (ko) * | 2005-08-24 | 2007-04-06 | 주식회사 아이피에스 | Ge-Sb-Te 박막증착방법 |
| DE102006038885B4 (de) * | 2005-08-24 | 2013-10-10 | Wonik Ips Co., Ltd. | Verfahren zum Abscheiden einer Ge-Sb-Te-Dünnschicht |
| KR100666876B1 (ko) | 2005-09-26 | 2007-01-10 | 주식회사 아이피에스 | Ge-Sb-Te 박막증착방법 |
| US20070111429A1 (en) | 2005-11-14 | 2007-05-17 | Macronix International Co., Ltd. | Method of manufacturing a pipe shaped phase change memory |
| KR100695168B1 (ko) * | 2006-01-10 | 2007-03-14 | 삼성전자주식회사 | 상변화 물질 박막의 형성방법, 이를 이용한 상변화 메모리소자의 제조방법 |
| US8288198B2 (en) * | 2006-05-12 | 2012-10-16 | Advanced Technology Materials, Inc. | Low temperature deposition of phase change memory materials |
| KR101263822B1 (ko) * | 2006-10-20 | 2013-05-13 | 삼성전자주식회사 | 상변화 메모리 소자의 제조 방법 및 이에 적용된상변화층의 형성방법 |
| JP5320295B2 (ja) * | 2006-11-02 | 2013-10-23 | アドバンスド テクノロジー マテリアルズ,インコーポレイテッド | 金属薄膜のcvd/aldに有用なアンチモンおよびゲルマニウム錯体 |
| KR100871692B1 (ko) * | 2006-11-07 | 2008-12-08 | 삼성전자주식회사 | 저온 증착용 금속 전구체, 그를 사용한 금속 박막 형성방법 및 상변화 메모리 소자 제조 방법 |
| KR100791077B1 (ko) * | 2006-12-13 | 2008-01-03 | 삼성전자주식회사 | 작은 전이영역을 갖는 상전이 메모리소자 및 그 제조방법 |
| US7772120B2 (en) * | 2007-01-09 | 2010-08-10 | International Business Machines Corporation | Chemical vapor deposition method for the incorporation of nitrogen into materials including germanium and antimony |
| TW200847398A (en) * | 2007-05-16 | 2008-12-01 | Ind Tech Res Inst | Phase-change memory element |
| KR100888617B1 (ko) * | 2007-06-15 | 2009-03-17 | 삼성전자주식회사 | 상변화 메모리 장치 및 그 형성 방법 |
| US7893420B2 (en) * | 2007-09-20 | 2011-02-22 | Taiwan Seminconductor Manufacturing Company, Ltd. | Phase change memory with various grain sizes |
-
2007
- 2007-06-15 KR KR1020070059001A patent/KR100888617B1/ko active Active
-
2008
- 2008-06-10 US US12/136,176 patent/US7943502B2/en active Active
- 2008-06-13 JP JP2008155877A patent/JP2008311664A/ja active Pending
- 2008-06-13 TW TW097122338A patent/TW200908303A/zh unknown
-
2011
- 2011-04-08 US US13/082,557 patent/US8263963B2/en active Active
-
2012
- 2012-08-13 US US13/584,011 patent/US20120319069A1/en not_active Abandoned
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