JP2008284678A - パネル研磨装置 - Google Patents
パネル研磨装置 Download PDFInfo
- Publication number
- JP2008284678A JP2008284678A JP2008099919A JP2008099919A JP2008284678A JP 2008284678 A JP2008284678 A JP 2008284678A JP 2008099919 A JP2008099919 A JP 2008099919A JP 2008099919 A JP2008099919 A JP 2008099919A JP 2008284678 A JP2008284678 A JP 2008284678A
- Authority
- JP
- Japan
- Prior art keywords
- panel
- polishing
- tape
- pair
- mechanisms
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
- B24B21/04—Machines or devices using grinding or polishing belts; Accessories therefor for grinding plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Nonlinear Science (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
【解決手段】 パネルWを連続的に水平搬送可能なパネル搬送機構1と、パネルの表面及び裏面の両面をパネルを境にして上下に配置された一対の研磨テープTで挟み込み、パネルの両面を同時に研磨またはクリーニングする上下一対の研磨機構5が備えられ、研磨テープをパネルの搬送方向Hと交差する方向に移送可能なテープ移送機構6と、研磨テープの移送経路途中をパネルに押し付けるためのテープ押圧機構7を設けてなる。
【選択図】図1
Description
T 研磨テープ
H 搬送方向
K 移送方向
Q 水平往復運動
1 パネル搬送機構
5 研磨機構
6 テープ移送機構
7 テープ押圧機構
7a パッド部材
7e エアーシリンダ機構
8 異方向往復運動機構
10 弛み取り機構
11 清掃機構
Claims (6)
- パネルを連続的に水平搬送可能なパネル搬送機構と、該パネルの表面及び裏面の両面をパネルを境にして上下に配置された一対の研磨テープで挟み込み、該パネルの両面を同時に研磨またはクリーニングする上下一対の研磨機構とが備えられ、上記一対の各研磨機構は、研磨テープをパネルの搬送方向と交差する方向に移送可能なテープ移送機構と、該研磨テープの移送経路途中を該パネルに押し付けるためのテープ押圧機構とからなり、該一対の各研磨機構における該テープ移送機構と該テープ押圧機構とは相互に分離独立した構造に構成され、該一対の上下の各テープ押圧機構を該研磨テープの移送方向としての上記パネルの搬送方向と交差する方向に互いに逆向きに水平往復運動させる異方向往復作動機構を設けてなることを特徴とするパネル研磨装置。
- 上記異方向往復作動機構はクランク機構からなることを特徴とする請求項1記載パネル研磨装置。
- 上記各テープ移送機構と上記テープ押圧機構との間に生ずる上記研磨テープの弛みを取り除くための弛み取り機構を設けてなることを特徴とする請求項1又は2記載パネル研磨装置。
- 上記各テープ押圧機構は上記研磨テープを上記パネルに押圧可能なパッド部材及びエアーシリンダ機構からなることを特徴とする請求項1〜3のいずれか1項に記載パネル研磨装置。
- 上記テープ移送機構は、上記研磨テープを間欠的又は連続的に移送可能な構造に構成されていることを特徴とする請求項1〜4のいずれか1項に記載のパネル研磨装置。
- 上記上下一対の研磨機構により上記研磨またはクリーニングした後に上記パネルの表面及び又は裏面を清掃するための清掃機構を設けてなることを特徴とする請求項1〜5のいずれか1項に記載のパネル研磨装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008099919A JP2008284678A (ja) | 2007-04-16 | 2008-04-08 | パネル研磨装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2007107149 | 2007-04-16 | ||
JP2008099919A JP2008284678A (ja) | 2007-04-16 | 2008-04-08 | パネル研磨装置 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2008284678A true JP2008284678A (ja) | 2008-11-27 |
Family
ID=40033484
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008099919A Pending JP2008284678A (ja) | 2007-04-16 | 2008-04-08 | パネル研磨装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP2008284678A (ja) |
KR (1) | KR101143111B1 (ja) |
CN (1) | CN101288945B (ja) |
TW (1) | TW200841987A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150044949A1 (en) * | 2013-06-17 | 2015-02-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Grinding Device and Method for Grinding Panel |
CN117103093A (zh) * | 2023-10-19 | 2023-11-24 | 成都广日电气设备有限公司 | 一种用于电梯生产的抛光机 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102366919B (zh) * | 2011-09-21 | 2015-01-07 | 杭州祥生砂光机制造有限公司 | 一圈两磨倒角去毛刺机及去毛刺方法 |
CN104551941A (zh) * | 2013-10-15 | 2015-04-29 | 青岛达沃斯达五金工具有限公司 | 一种双面砂带抛光机 |
CN105252387A (zh) * | 2015-09-01 | 2016-01-20 | 深圳市易天自动化设备有限公司 | 一种液晶玻璃的研磨清洗设备 |
KR102429138B1 (ko) * | 2017-07-10 | 2022-08-05 | 주식회사 케이씨텍 | 순환 구동 유닛 및 이를 포함하는 기판 연마 장치 |
JP6583701B2 (ja) | 2018-01-31 | 2019-10-02 | 株式会社サンシン | ウオーム研磨方法及びその装置 |
CN110561235B (zh) * | 2019-08-27 | 2023-08-29 | 雅视特科技(杭州)有限公司 | 全自动立式铸件表面打磨机及其操作方法 |
CN110900397B (zh) * | 2019-12-05 | 2021-12-03 | 新沂市大自然木业有限公司 | 一种高精度可双面同时抛光的木板砂光机及其工作方式 |
CN111113530B (zh) * | 2019-12-27 | 2021-10-01 | 湖南新汇制药股份有限公司 | 一种金樱子初加工装置和加工方法 |
CN112548787B (zh) * | 2020-12-24 | 2022-10-21 | 国网福建省电力有限公司莆田供电公司 | 一种电器插脚抛光装置 |
CN112847055A (zh) * | 2020-12-29 | 2021-05-28 | 张媛淇 | 一种新能源汽车用导流板加工打磨装置 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60151838A (ja) * | 1984-01-19 | 1985-08-09 | Matsushita Electric Ind Co Ltd | 磁気記録媒体の製造方法 |
JPH0265964A (ja) * | 1988-09-01 | 1990-03-06 | Noritake Co Ltd | 研摩テープを使用した平面研摩装置 |
JPH0343148A (ja) * | 1989-07-07 | 1991-02-25 | Noritake Co Ltd | 研摩テープを使用した平面研摩装置 |
JP2001062696A (ja) * | 1999-08-24 | 2001-03-13 | Nihon Micro Coating Co Ltd | 研掃方法及び装置 |
JP2001138202A (ja) * | 1999-11-12 | 2001-05-22 | Noda Screen:Kk | プリント基板の研磨装置 |
JP2002224940A (ja) * | 2001-01-29 | 2002-08-13 | Nihon Micro Coating Co Ltd | 研磨装置 |
JP2004322305A (ja) * | 2003-04-11 | 2004-11-18 | Tokki Corp | 基板表面平坦化・洗浄装置 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1053384A (zh) * | 1990-01-18 | 1991-07-31 | 丸仲化工机株式会社 | 砂磨方法及其装置 |
US6520833B1 (en) * | 2000-06-30 | 2003-02-18 | Lam Research Corporation | Oscillating fixed abrasive CMP system and methods for implementing the same |
CN2670054Y (zh) * | 2003-11-25 | 2005-01-12 | 阳程科技股份有限公司 | 往复式上下磨刷机 |
JP3964886B2 (ja) * | 2004-05-24 | 2007-08-22 | 日本ミクロコーティング株式会社 | パネルクリーニング装置及び方法 |
KR20060068997A (ko) * | 2004-12-17 | 2006-06-21 | 삼성전자주식회사 | 액정표시장치 제조용 연마 및 세정 시스템 |
-
2007
- 2007-06-01 TW TW096119676A patent/TW200841987A/zh unknown
- 2007-07-19 CN CN2007101361596A patent/CN101288945B/zh not_active Expired - Fee Related
-
2008
- 2008-04-08 JP JP2008099919A patent/JP2008284678A/ja active Pending
- 2008-04-16 KR KR1020080035135A patent/KR101143111B1/ko not_active IP Right Cessation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS60151838A (ja) * | 1984-01-19 | 1985-08-09 | Matsushita Electric Ind Co Ltd | 磁気記録媒体の製造方法 |
JPH0265964A (ja) * | 1988-09-01 | 1990-03-06 | Noritake Co Ltd | 研摩テープを使用した平面研摩装置 |
JPH0343148A (ja) * | 1989-07-07 | 1991-02-25 | Noritake Co Ltd | 研摩テープを使用した平面研摩装置 |
JP2001062696A (ja) * | 1999-08-24 | 2001-03-13 | Nihon Micro Coating Co Ltd | 研掃方法及び装置 |
JP2001138202A (ja) * | 1999-11-12 | 2001-05-22 | Noda Screen:Kk | プリント基板の研磨装置 |
JP2002224940A (ja) * | 2001-01-29 | 2002-08-13 | Nihon Micro Coating Co Ltd | 研磨装置 |
JP2004322305A (ja) * | 2003-04-11 | 2004-11-18 | Tokki Corp | 基板表面平坦化・洗浄装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20150044949A1 (en) * | 2013-06-17 | 2015-02-12 | Shenzhen China Star Optoelectronics Technology Co., Ltd. | Grinding Device and Method for Grinding Panel |
CN117103093A (zh) * | 2023-10-19 | 2023-11-24 | 成都广日电气设备有限公司 | 一种用于电梯生产的抛光机 |
CN117103093B (zh) * | 2023-10-19 | 2023-12-29 | 成都广日电气设备有限公司 | 一种用于电梯生产的抛光机 |
Also Published As
Publication number | Publication date |
---|---|
CN101288945A (zh) | 2008-10-22 |
KR101143111B1 (ko) | 2012-05-08 |
KR20080093390A (ko) | 2008-10-21 |
CN101288945B (zh) | 2010-12-08 |
TW200841987A (en) | 2008-11-01 |
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