JP2008277757A - 半導体チップと基板との間の半田接続部およびその製造 - Google Patents

半導体チップと基板との間の半田接続部およびその製造 Download PDF

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Publication number
JP2008277757A
JP2008277757A JP2008050828A JP2008050828A JP2008277757A JP 2008277757 A JP2008277757 A JP 2008277757A JP 2008050828 A JP2008050828 A JP 2008050828A JP 2008050828 A JP2008050828 A JP 2008050828A JP 2008277757 A JP2008277757 A JP 2008277757A
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semiconductor chip
solder
substrate
solder connection
surface region
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JP2008050828A
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Japanese (ja)
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JP2008277757A5 (enExample
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Volker Gabler
ガブラー フォルカー
Thomas Licht
リヒト トーマス
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Infineon Technologies AG
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Infineon Technologies AG
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JP2008050828A 2007-03-06 2008-02-29 半導体チップと基板との間の半田接続部およびその製造 Pending JP2008277757A (ja)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101920405A (zh) * 2010-08-23 2010-12-22 中国电力科学研究院 一种镀锌钢接地网用锡铅基复合钎料及其制备方法
JP2011061170A (ja) * 2009-09-04 2011-03-24 Paragon Semiconductor Lighting Technology Co Ltd 放熱効果を高め発光効率を向上させることができる発光ダイオードのパッケージ構造とその製作方法
CN115609102A (zh) * 2022-09-26 2023-01-17 西安空间无线电技术研究所 一种芯片热沉组件低空洞率焊接方法

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JPS5368571A (en) * 1976-11-30 1978-06-19 Nec Home Electronics Ltd Production of semiconductor device
JPS53109477A (en) * 1977-03-07 1978-09-25 Toshiba Corp Mounting method of semiconductor element
JPH04171888A (ja) * 1990-11-05 1992-06-19 Matsushita Electric Ind Co Ltd リフロー半田付け方法
JPH11154785A (ja) * 1997-11-20 1999-06-08 Hitachi Ltd 電子部品の製造方法
JP2003297860A (ja) * 2002-03-29 2003-10-17 Fuji Electric Co Ltd 半導体装置の製造方法
JP2006054227A (ja) * 2004-08-10 2006-02-23 Hitachi Ltd 半導体パワーモジュール及び半導体装置

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JPH05291314A (ja) * 1992-04-10 1993-11-05 Fujitsu General Ltd ベアチップの半田付方法
DE4235908A1 (de) * 1992-10-23 1994-04-28 Telefunken Microelectron Verfahren zum Verlöten eines Halbleiterkörpers mit einem Trägerelement
JP2005205418A (ja) * 2004-01-20 2005-08-04 Denso Corp 接合構造体の製造方法

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JPS5368571A (en) * 1976-11-30 1978-06-19 Nec Home Electronics Ltd Production of semiconductor device
JPS53109477A (en) * 1977-03-07 1978-09-25 Toshiba Corp Mounting method of semiconductor element
JPH04171888A (ja) * 1990-11-05 1992-06-19 Matsushita Electric Ind Co Ltd リフロー半田付け方法
JPH11154785A (ja) * 1997-11-20 1999-06-08 Hitachi Ltd 電子部品の製造方法
JP2003297860A (ja) * 2002-03-29 2003-10-17 Fuji Electric Co Ltd 半導体装置の製造方法
JP2006054227A (ja) * 2004-08-10 2006-02-23 Hitachi Ltd 半導体パワーモジュール及び半導体装置

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011061170A (ja) * 2009-09-04 2011-03-24 Paragon Semiconductor Lighting Technology Co Ltd 放熱効果を高め発光効率を向上させることができる発光ダイオードのパッケージ構造とその製作方法
CN101920405A (zh) * 2010-08-23 2010-12-22 中国电力科学研究院 一种镀锌钢接地网用锡铅基复合钎料及其制备方法
CN101920405B (zh) * 2010-08-23 2013-07-31 中国电力科学研究院 一种镀锌钢接地网用锡铅基复合钎料及其制备方法
CN115609102A (zh) * 2022-09-26 2023-01-17 西安空间无线电技术研究所 一种芯片热沉组件低空洞率焊接方法

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