CN101920405A - 一种镀锌钢接地网用锡铅基复合钎料及其制备方法 - Google Patents
一种镀锌钢接地网用锡铅基复合钎料及其制备方法 Download PDFInfo
- Publication number
- CN101920405A CN101920405A CN2010102605852A CN201010260585A CN101920405A CN 101920405 A CN101920405 A CN 101920405A CN 2010102605852 A CN2010102605852 A CN 2010102605852A CN 201010260585 A CN201010260585 A CN 201010260585A CN 101920405 A CN101920405 A CN 101920405A
- Authority
- CN
- China
- Prior art keywords
- tin
- lead
- particle
- solder
- galvanized steel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002131 composite material Substances 0.000 title claims abstract description 63
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 56
- LQBJWKCYZGMFEV-UHFFFAOYSA-N lead tin Chemical compound [Sn].[Pb] LQBJWKCYZGMFEV-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 229910001335 Galvanized steel Inorganic materials 0.000 title claims abstract description 37
- 239000008397 galvanized steel Substances 0.000 title claims abstract description 37
- 238000002360 preparation method Methods 0.000 title claims description 20
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 45
- 238000005476 soldering Methods 0.000 claims abstract description 39
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 22
- 229910052709 silver Inorganic materials 0.000 claims abstract description 18
- 239000004332 silver Substances 0.000 claims abstract description 17
- 239000011159 matrix material Substances 0.000 claims abstract description 11
- 239000002245 particle Substances 0.000 claims description 49
- 238000003466 welding Methods 0.000 claims description 45
- 239000006071 cream Substances 0.000 claims description 22
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 6
- 238000013019 agitation Methods 0.000 claims description 6
- 238000005057 refrigeration Methods 0.000 claims description 6
- 230000007797 corrosion Effects 0.000 abstract description 9
- 238000005260 corrosion Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 9
- 230000008569 process Effects 0.000 abstract description 8
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 230000007547 defect Effects 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 16
- 229910052751 metal Inorganic materials 0.000 description 16
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 8
- 229910052725 zinc Inorganic materials 0.000 description 8
- 239000011701 zinc Substances 0.000 description 8
- 238000005219 brazing Methods 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910000831 Steel Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000010959 steel Substances 0.000 description 6
- 229910052718 tin Inorganic materials 0.000 description 6
- 229910020816 Sn Pb Inorganic materials 0.000 description 5
- 229910020922 Sn-Pb Inorganic materials 0.000 description 5
- 229910008783 Sn—Pb Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- 239000000956 alloy Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 230000004927 fusion Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 230000002708 enhancing effect Effects 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 239000013528 metallic particle Substances 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 229910000765 intermetallic Inorganic materials 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000002689 soil Substances 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000005275 alloying Methods 0.000 description 1
- 238000009412 basement excavation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Abstract
Description
平均值拉力(kN) | 熔点(℃) | 外观 | |
实施例1 | 13.5 | 409 | 良好 |
实施例2 | 15 | 429 | 有一定气孔 |
实施例3 | 16 | 411 | 较好 |
实施例4 | 17.5 | 423 | 有少量气孔 |
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 201010260585 CN101920405B (zh) | 2010-08-23 | 2010-08-23 | 一种镀锌钢接地网用锡铅基复合钎料及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 201010260585 CN101920405B (zh) | 2010-08-23 | 2010-08-23 | 一种镀锌钢接地网用锡铅基复合钎料及其制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN101920405A true CN101920405A (zh) | 2010-12-22 |
CN101920405B CN101920405B (zh) | 2013-07-31 |
Family
ID=43335756
Family Applications (1)
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CN 201010260585 Active CN101920405B (zh) | 2010-08-23 | 2010-08-23 | 一种镀锌钢接地网用锡铅基复合钎料及其制备方法 |
Country Status (1)
Country | Link |
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CN (1) | CN101920405B (zh) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1112693A (en) * | 1965-11-23 | 1968-05-08 | Westinghouse Electric Corp | Method for producing self-spacing solder composition |
KR930002525B1 (ko) * | 1990-11-26 | 1993-04-03 | 주식회사 금성사 | 반도체 레이저 다이오드 부착용 땜납(Solder) |
JPH07178587A (ja) * | 1993-11-09 | 1995-07-18 | Matsushita Electric Ind Co Ltd | はんだ |
CN1358606A (zh) * | 2001-12-19 | 2002-07-17 | 北京工业大学 | 金属颗粒增强的锡铅基复合钎料及其制备方法 |
US6630251B1 (en) * | 2002-09-23 | 2003-10-07 | Delphi Technologies, Inc. | Leach-resistant solder alloys for silver-based thick-film conductors |
EP1391261A1 (en) * | 2002-08-22 | 2004-02-25 | Delphi Technologies, Inc. | Lead-based solder alloys containing copper |
CN101224526A (zh) * | 2008-02-01 | 2008-07-23 | 北京工业大学 | Ni颗粒增强锡银基无铅复合钎料及其制备方法 |
JP2008277757A (ja) * | 2007-03-06 | 2008-11-13 | Infineon Technologies Ag | 半導体チップと基板との間の半田接続部およびその製造 |
-
2010
- 2010-08-23 CN CN 201010260585 patent/CN101920405B/zh active Active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1112693A (en) * | 1965-11-23 | 1968-05-08 | Westinghouse Electric Corp | Method for producing self-spacing solder composition |
KR930002525B1 (ko) * | 1990-11-26 | 1993-04-03 | 주식회사 금성사 | 반도체 레이저 다이오드 부착용 땜납(Solder) |
JPH07178587A (ja) * | 1993-11-09 | 1995-07-18 | Matsushita Electric Ind Co Ltd | はんだ |
CN1358606A (zh) * | 2001-12-19 | 2002-07-17 | 北京工业大学 | 金属颗粒增强的锡铅基复合钎料及其制备方法 |
EP1391261A1 (en) * | 2002-08-22 | 2004-02-25 | Delphi Technologies, Inc. | Lead-based solder alloys containing copper |
US6630251B1 (en) * | 2002-09-23 | 2003-10-07 | Delphi Technologies, Inc. | Leach-resistant solder alloys for silver-based thick-film conductors |
JP2008277757A (ja) * | 2007-03-06 | 2008-11-13 | Infineon Technologies Ag | 半導体チップと基板との間の半田接続部およびその製造 |
CN101224526A (zh) * | 2008-02-01 | 2008-07-23 | 北京工业大学 | Ni颗粒增强锡银基无铅复合钎料及其制备方法 |
Non-Patent Citations (1)
Title |
---|
闫焉服等: "银镍金属微细颗粒对锡铅基复合钎料力学性能的影响", 《稀有金属材料与工程》, vol. 34, no. 4, 30 April 2005 (2005-04-30), pages 622 - 626 * |
Also Published As
Publication number | Publication date |
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CN101920405B (zh) | 2013-07-31 |
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Owner name: STATE ELECTRIC NET CROP. Effective date: 20130219 |
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Effective date of registration: 20130219 Address after: 100192 Beijing city Haidian District Qinghe small Camp Road No. 15 Applicant after: China Electric Power Research Institute Applicant after: State Grid Corporation of China Address before: 100192 Beijing city Haidian District Qinghe small Camp Road No. 15 Applicant before: China Electric Power Research Institute |
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