GB1112693A - Method for producing self-spacing solder composition - Google Patents

Method for producing self-spacing solder composition

Info

Publication number
GB1112693A
GB1112693A GB33710/66A GB3371066A GB1112693A GB 1112693 A GB1112693 A GB 1112693A GB 33710/66 A GB33710/66 A GB 33710/66A GB 3371066 A GB3371066 A GB 3371066A GB 1112693 A GB1112693 A GB 1112693A
Authority
GB
United Kingdom
Prior art keywords
solder
particles
inch
metal
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB33710/66A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CBS Corp
Original Assignee
Westinghouse Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Westinghouse Electric Corp filed Critical Westinghouse Electric Corp
Publication of GB1112693A publication Critical patent/GB1112693A/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0244—Powders, particles or spheres; Preforms made therefrom
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
    • B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
    • B23K35/0233—Sheets, foils

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)

Abstract

1,112,693. Soldering. WESTINGHOUSE ELECTRIC CORPORATION. 27 July, 1966 [23 Nov., 1965], No. 33710/66. Heading B3R. A method of producing a self-spacing solder of predetermined final thickness comprises the steps of preparing a melt of a solder metal component, adding thereto powdered metallic particles which are insoluble in but wettable by the solder, the particles being of average overall size greater than the final thickness, solidifying to form an ingot and rolling down the ingot to form a strip of the required thickness. The solder may be of lead, tin, bismuth, silver or of an alloy of one or more of these metals while the particles may be of iron, cobalt nickel or refractory metal and for a joint which is optimally to be spaced 0À003 to 0À005 inch the powder particles must pass a 30-mesh screen and at least 85% be retained on a 325-mesh screen, the preferred range is 40 to 60 mesh. To prepare the solder the metal particles are heated in a reducing gas to remove oxide, coated with a flux, and added to and dispersed in the molten solder component and then cast in moulds ¥ to 1 inch in thickness; the resulting bars are rolled to the required thickness e.g. 0À005 inch. A wetting agent is preferably added to the solder melt after the particles have been added. The wetting agent may be phosphorus, lithium, caesium, sodium, calcium or magnesium and may be present in an amount up to 0À8% by weight. Specific solder compositions given are: The solder compositions referred to find application in the bonding of thermoelectric materials such as lead telluride, germanium bismuth telluride, germanium telluride and zinc antimonide to metal contacts e.g. tin-coated iron contacts. Soldering may be carried out in an oven or furnace in a stream of reducing gas such as hydrogen.
GB33710/66A 1965-11-23 1966-07-27 Method for producing self-spacing solder composition Expired GB1112693A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US50944465A 1965-11-23 1965-11-23

Publications (1)

Publication Number Publication Date
GB1112693A true GB1112693A (en) 1968-05-08

Family

ID=24026644

Family Applications (1)

Application Number Title Priority Date Filing Date
GB33710/66A Expired GB1112693A (en) 1965-11-23 1966-07-27 Method for producing self-spacing solder composition

Country Status (1)

Country Link
GB (1) GB1112693A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2177641A (en) * 1983-06-30 1987-01-28 Raychem Corp Solder preforms
EP0608905A1 (en) * 1993-01-29 1994-08-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
EP0612577A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. Article comprising solder with improved mechical properties, and method of making the solder
EP1616657A1 (en) * 2004-07-15 2006-01-18 Delphi Technologies, Inc. Braze alloy containing particulate material
WO2006037499A2 (en) * 2004-09-30 2006-04-13 Basf Aktiengesellschaft Contacting thermoelectric active antimonides
WO2006037498A2 (en) * 2004-09-30 2006-04-13 Basf Aktiengesellschaft Contacting thermoelectric materials by means of ultrasonic welding
CN101920405A (en) * 2010-08-23 2010-12-22 中国电力科学研究院 Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof
CN102198566A (en) * 2010-03-22 2011-09-28 王宣胜 Iron powder tin-based composite soldering alloy ball and flip chip bumping method thereof

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4705205A (en) * 1983-06-30 1987-11-10 Raychem Corporation Chip carrier mounting device
GB2177641A (en) * 1983-06-30 1987-01-28 Raychem Corp Solder preforms
EP0608905A1 (en) * 1993-01-29 1994-08-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
US5377899A (en) * 1993-01-29 1995-01-03 Nec Corporation Method for producing solder that contains therein additive particles maintaining its shape
EP0612577A1 (en) * 1993-02-22 1994-08-31 AT&T Corp. Article comprising solder with improved mechical properties, and method of making the solder
US7179558B2 (en) 2004-07-15 2007-02-20 Delphi Technologies, Inc. Braze alloy containing particulate material
EP1616657A1 (en) * 2004-07-15 2006-01-18 Delphi Technologies, Inc. Braze alloy containing particulate material
WO2006037499A2 (en) * 2004-09-30 2006-04-13 Basf Aktiengesellschaft Contacting thermoelectric active antimonides
WO2006037498A3 (en) * 2004-09-30 2006-08-03 Basf Ag Contacting thermoelectric materials by means of ultrasonic welding
WO2006037499A3 (en) * 2004-09-30 2006-08-03 Basf Ag Contacting thermoelectric active antimonides
WO2006037498A2 (en) * 2004-09-30 2006-04-13 Basf Aktiengesellschaft Contacting thermoelectric materials by means of ultrasonic welding
CN102198566A (en) * 2010-03-22 2011-09-28 王宣胜 Iron powder tin-based composite soldering alloy ball and flip chip bumping method thereof
CN101920405A (en) * 2010-08-23 2010-12-22 中国电力科学研究院 Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof
CN101920405B (en) * 2010-08-23 2013-07-31 中国电力科学研究院 Tin-lead-based composite solder for galvanized steel ground grid and preparation method thereof

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