JP2008277757A5 - - Google Patents
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- Publication number
- JP2008277757A5 JP2008277757A5 JP2008050828A JP2008050828A JP2008277757A5 JP 2008277757 A5 JP2008277757 A5 JP 2008277757A5 JP 2008050828 A JP2008050828 A JP 2008050828A JP 2008050828 A JP2008050828 A JP 2008050828A JP 2008277757 A5 JP2008277757 A5 JP 2008277757A5
- Authority
- JP
- Japan
- Prior art keywords
- process according
- solder material
- substrate
- solder
- semiconductor chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 claims 29
- 229910000679 solder Inorganic materials 0.000 claims 20
- 239000000463 material Substances 0.000 claims 15
- 239000004065 semiconductor Substances 0.000 claims 11
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 239000011248 coating agent Substances 0.000 claims 9
- 238000000576 coating method Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 9
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 3
- 229910052737 gold Inorganic materials 0.000 claims 3
- 239000010931 gold Substances 0.000 claims 3
- 238000007639 printing Methods 0.000 claims 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- 229910045601 alloy Inorganic materials 0.000 claims 2
- 239000000956 alloy Substances 0.000 claims 2
- 238000010924 continuous production Methods 0.000 claims 2
- 238000001312 dry etching Methods 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 230000008018 melting Effects 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 238000001039 wet etching Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 229910020658 PbSn Inorganic materials 0.000 claims 1
- -1 PbSnAg Inorganic materials 0.000 claims 1
- 101150071746 Pbsn gene Proteins 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 229910007637 SnAg Inorganic materials 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 239000000919 ceramic Substances 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000013078 crystal Substances 0.000 claims 1
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 claims 1
- 238000000206 photolithography Methods 0.000 claims 1
- 239000002985 plastic film Substances 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102007010882A DE102007010882B4 (de) | 2007-03-06 | 2007-03-06 | Verfahren zur Herstellung einer Lötverbindung zwischen einem Halbleiterchip und einem Substrat |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2008277757A JP2008277757A (ja) | 2008-11-13 |
| JP2008277757A5 true JP2008277757A5 (enExample) | 2010-11-18 |
Family
ID=39712865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008050828A Pending JP2008277757A (ja) | 2007-03-06 | 2008-02-29 | 半導体チップと基板との間の半田接続部およびその製造 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2008277757A (enExample) |
| DE (1) | DE102007010882B4 (enExample) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI403004B (en) * | 2009-09-04 | 2013-07-21 | Led package structure for increasing heat-dissipating effect and light-emitting efficiency and method for making the same | |
| CN101920405B (zh) * | 2010-08-23 | 2013-07-31 | 中国电力科学研究院 | 一种镀锌钢接地网用锡铅基复合钎料及其制备方法 |
| CN115609102B (zh) * | 2022-09-26 | 2025-06-03 | 西安空间无线电技术研究所 | 一种芯片热沉组件低空洞率焊接方法 |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5368571A (en) * | 1976-11-30 | 1978-06-19 | Nec Home Electronics Ltd | Production of semiconductor device |
| JPS53109477A (en) * | 1977-03-07 | 1978-09-25 | Toshiba Corp | Mounting method of semiconductor element |
| JPH0797701B2 (ja) * | 1990-11-05 | 1995-10-18 | 松下電器産業株式会社 | リフロー半田付け方法 |
| JPH05291314A (ja) * | 1992-04-10 | 1993-11-05 | Fujitsu General Ltd | ベアチップの半田付方法 |
| DE4235908A1 (de) * | 1992-10-23 | 1994-04-28 | Telefunken Microelectron | Verfahren zum Verlöten eines Halbleiterkörpers mit einem Trägerelement |
| JP3753524B2 (ja) * | 1997-11-20 | 2006-03-08 | 株式会社日立製作所 | 電子部品の製造方法 |
| JP3809806B2 (ja) * | 2002-03-29 | 2006-08-16 | 富士電機デバイステクノロジー株式会社 | 半導体装置の製造方法 |
| JP2005205418A (ja) * | 2004-01-20 | 2005-08-04 | Denso Corp | 接合構造体の製造方法 |
| JP2006054227A (ja) * | 2004-08-10 | 2006-02-23 | Hitachi Ltd | 半導体パワーモジュール及び半導体装置 |
-
2007
- 2007-03-06 DE DE102007010882A patent/DE102007010882B4/de not_active Expired - Fee Related
-
2008
- 2008-02-29 JP JP2008050828A patent/JP2008277757A/ja active Pending
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