JP2008270444A - 光半導体デバイスおよびその製造方法 - Google Patents
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Abstract
【解決手段】 光半導体チップ2がマウントされる第1のリード3と、第1のリード3上にマウントされた光半導体チップ2から延びるワイヤ(例えば金線)5が接合される第2のリード4と、前記第1のリード3および前記第2のリード4をそれぞれ2箇所で支持するホルダー部6と、レンズ部7と、光透過性の封止部8とを有し、前記第2のリード4は、該第2のリード4を2箇所で支持している前記ホルダー部6の内側において、所定の幅d(≠0)をもたせて2つのリード片4a,4bに分離されている。
【選択図】 図5
Description
前記光半導体チップ2を収容するホルダー部6と、
前記光半導体チップ2が配置されるマウント部を有し、前記ホルダー部6の第1の側面と該第1の側面とは反対の側の第2の側面との2つの側面から導出される第1のリード3と、
前記光半導体チップ2から延びる導電性のワイヤ5の接合部を有し、前記ホルダー部6の前記第1の側面の第1のリード3が導出される位置とは異なる位置から導出される第2のリード4aと、
前記ホルダー部6の前記第2の側面の第1のリード3が導出される位置とは異なる位置から導出される第3のリード4bと、
前記ホルダー部6内における、前記第1のリード3、前記第2のリード4a、前記第3のリード4b、および光半導体チップ2を覆う封止部8と、を有している光半導体デバイスである。
前記第1のリード部3の両端、前記第2のリード部4a、前記第3のリード部4bを支持するホルダー部6を成形する工程と、
前記リードフレーム50の前記ホルダー部6の内側において、前記第3のリード部4bと前記第2のリード部4aとの前記連結部を切断する工程と、
前記マウント部上に光半導体チップ2を載置する工程と、
光半導体チップ2と前記第2のリード部4aの前記接合部とを導電性のワイヤ5により接合する工程と、
前記ホルダー部6内における、前記第1のリード3、前記第2のリード4a、前記第3のリード4b、および光半導体チップ2を封止材料で覆う工程と、
によって、光半導体デバイスを製造することができる。
前記第1のリード部3の両端、前記第2のリード部4a、前記第3のリード部4bを支持するホルダー部6を成形する工程と、
前記リードフレーム50の前記ホルダー部6の内側において、前記第1のリード部3と前記第2のリード部4aとの前記連結部を切断する工程と、
前記マウント部上に光半導体チップ2を載置する工程と、
光半導体チップ2と前記第2のリード部4aの前記接合部とを導電性のワイヤ5により接合する工程と、
前記ホルダー部6内における、前記第1のリード3、前記第2のリード4a、前記第3のリード4b、および光半導体チップ2を封止材料で覆う工程と、
によって、光半導体デバイスを製造することができる。
3 第1のリード
4 第2のリード
4a,4b 第2のリードの片
5 ワイヤ
6 ホルダー部
7 レンズ部
8 封止材
50 リードフレーム
Claims (9)
- 光半導体チップと、
前記光半導体チップを収容するホルダー部と、
前記光半導体チップが配置されるマウント部を有し、前記ホルダー部の第1の側面と該第1の側面とは反対の側の第2の側面との2つの側面から導出される第1のリードと、
前記光半導体チップから延びるワイヤの接合部を有し、前記ホルダー部の前記第1の側面の第1のリードが導出される位置とは異なる位置から導出される第2のリードと、
前記ホルダー部の前記第2の側面の第1のリードが導出される位置とは異なる位置から導出される第3のリードと、
を有することを特徴とする光半導体デバイス。 - 請求項1記載の光半導体デバイスにおいて、前記ホルダー部内における、前記第1のリード、前記第2のリード、前記第3のリード、および光半導体チップを覆う封止部をさらに有していることを特徴とする光半導体デバイス。
- 請求項1または請求項2記載の光半導体デバイスにおいて、前記第3のリードの一方の端部は、前記ホルダー部の内側に存在する前記第2のリードの一方の端部と対向して配置されていることを特徴とする光半導体デバイス。
- 請求項3記載の光半導体デバイスにおいて、前記ホルダー部の内側に位置する前記第2のリードの一方の端部および前記第3のリードの一方の端部の少なくともいずれかは、屈曲形状を有していることを特徴とする光半導体デバイス。
- 請求項4記載の光半導体デバイスにおいて、前記屈曲形状は、2箇所の曲げ部と、第1リードの延出方向に平行な端部とから構成されていることを特徴とする光半導体デバイス。
- 請求項1乃至請求項5のいずれか一項に記載の光半導体デバイスにおいて、前記第1のリード、前記第2のリード、前記第3のリードは、それぞれ前記ホルダー部から平行に延出していることを特徴とする光半導体デバイス。
- 請求項1乃至請求項6のいずれか一項に記載の光半導体デバイスにおいて、前記光半導体チップと前記ワイヤとの接続部、前記第2リードと前記ワイヤとの接続部の少なくともいずれかには、再結晶化部が形成されていることを特徴とする光半導体デバイス。
- 請求項1乃至請求項7のいずれか一項に記載の光半導体デバイスにおいて、前記ホルダー部は額縁型のものであり、前記封止部は軟質樹脂からなることを特徴とする光半導体デバイス。
- 光半導体チップが配置されるマウント部を有する第1のリード部と、光半導体チップから延びる導電性のワイヤの接合部を有する第2のリード部と、第3のリード部とを備え、前記第3のリード部と前記第2のリード部との連結部、または、前記第1のリード部と前記第2のリード部との連結部を有するリードフレームを準備する工程と、
前記第1のリード部の両端、前記第2のリード部、前記第3のリード部を支持するホルダー部を成形する工程と、
前記リードフレームの前記ホルダー部の内側において、前記第3のリード部と前記第2のリード部との前記連結部、または、前記第1のリード部と前記第2のリード部との連結部を切断する工程と、
前記マウント部上に光半導体チップを載置する工程と、
光半導体チップと前記接合部とをワイヤにより接合する工程と、
前記ホルダー部内における、前記第1のリード、前記第2のリード、前記第3のリード、および光半導体チップを封止材料で覆う工程と、
を有することを特徴とする光半導体デバイスの製造方法。
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Application Number | Priority Date | Filing Date | Title |
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JP2007110057A JP5026848B2 (ja) | 2007-04-19 | 2007-04-19 | 光半導体デバイスおよびその製造方法 |
US12/105,420 US8120151B2 (en) | 2007-04-19 | 2008-04-18 | Optical semiconductor device and method for manufacturing the same |
EP08007660.7A EP1983580B1 (en) | 2007-04-19 | 2008-04-18 | Optical semiconductor device and method for manufacturing the same |
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JP2007110057A JP5026848B2 (ja) | 2007-04-19 | 2007-04-19 | 光半導体デバイスおよびその製造方法 |
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JP2016100350A (ja) * | 2014-11-18 | 2016-05-30 | 日亜化学工業株式会社 | 複合基板並びに発光装置及びその製造方法 |
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EP1983580B1 (en) | 2019-11-06 |
EP1983580A3 (en) | 2014-08-06 |
JP5026848B2 (ja) | 2012-09-19 |
US8120151B2 (en) | 2012-02-21 |
US20090321774A1 (en) | 2009-12-31 |
EP1983580A2 (en) | 2008-10-22 |
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