JP4789433B2 - Led表示器用筺体及びled表示器 - Google Patents
Led表示器用筺体及びled表示器 Download PDFInfo
- Publication number
- JP4789433B2 JP4789433B2 JP2004192412A JP2004192412A JP4789433B2 JP 4789433 B2 JP4789433 B2 JP 4789433B2 JP 2004192412 A JP2004192412 A JP 2004192412A JP 2004192412 A JP2004192412 A JP 2004192412A JP 4789433 B2 JP4789433 B2 JP 4789433B2
- Authority
- JP
- Japan
- Prior art keywords
- led display
- housing
- pair
- led
- lead terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/536—Shapes of wire connectors the connected ends being ball-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/531—Shapes of wire connectors
- H10W72/5363—Shapes of wire connectors the connected ends being wedge-shaped
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
- H10W72/50—Bond wires
- H10W72/551—Materials of bond wires
- H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
- H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Led Device Packages (AREA)
Description
1R LED表示器用筐体
1a 筐体
2a 開口部
3 リードワイヤー
11、12 リード端子
11A、12A リード端子の電極部
14 凹所
51 LED表示器連接部材
S1 筐体の底面
S2 筐体の正面
S3、S4 筐体の側面
S6 筐体の上面
P1、P2 筐体の段差部
C1A、C2A、C1B、C2B 凹部
21 発光素子(LED)
30 導電性部材
31A、32A 下部ハンガー部材
31B、32B 上部ハンガー部材
Claims (2)
- 底面と、光を出射する開口部を備える正面と、前記正面に隣接する一対の側面とを備え
る筐体と、一対のリード端子とを備え、前記一対のリード端子の各々を前記筐体の一対の
側面の各々から導出するようにしたLED表示器用筐体であって、前記一対の側面の各々
から導出するようにした一対のリード端子の各々を、対応する前記一対の側面の各々に沿
って正面方向に折り曲げ、次いで、前記一対のリード端子の各々の端部部分を前記底面に
沿って折り曲げ、前記底面の両端部の各々にリード端子の電極部を位置させるようにし、
前記底面の、前記リード端子の電極部の各々が位置する場所に段差部を設け、前記一対の
リード端子の電極部の各々を、前記底面に設けた段差部の各々に位置させるようにし、前
記段差部に、ハンガー部材の先端部が抜かれた痕跡である凹部を位置させたことを特徴と
するLED表示器用筐体。 - 請求項1に記載のLED表示器用筐体の、一対のリード端子のいずれか一方の筐体の開
口部の凹所内の露出部に発光素子(LED)を備えるLED表示器。
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004192412A JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
| PCT/JP2005/011899 WO2006003908A1 (ja) | 2004-06-30 | 2005-06-29 | Led表示器用筐体、led表示器及びled表示器連接部材 |
| US11/631,343 US7994532B2 (en) | 2004-06-30 | 2005-06-29 | LED indicator casing, LED indicator, and LED indicator joint member comprising hanger members |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004192412A JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2006019313A JP2006019313A (ja) | 2006-01-19 |
| JP4789433B2 true JP4789433B2 (ja) | 2011-10-12 |
Family
ID=35782716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2004192412A Expired - Fee Related JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US7994532B2 (ja) |
| JP (1) | JP4789433B2 (ja) |
| WO (1) | WO2006003908A1 (ja) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4857791B2 (ja) | 2006-02-01 | 2012-01-18 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
| KR100820529B1 (ko) | 2006-05-11 | 2008-04-08 | 엘지이노텍 주식회사 | 발광 장치 및 그 제조방법, 면 발광 장치 |
| JP2008198807A (ja) | 2007-02-14 | 2008-08-28 | Nichia Corp | 半導体装置 |
| JP4976167B2 (ja) * | 2007-03-06 | 2012-07-18 | 豊田合成株式会社 | 発光装置 |
| JP4976168B2 (ja) * | 2007-03-06 | 2012-07-18 | 豊田合成株式会社 | 発光装置 |
| US7993038B2 (en) | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
| US7566159B2 (en) * | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
| KR101326888B1 (ko) * | 2007-06-20 | 2013-11-11 | 엘지이노텍 주식회사 | 반도체 발광소자 패키지 |
| US20090026470A1 (en) | 2007-07-23 | 2009-01-29 | Novalite Optronics Corp. | Super thin side-view light-emitting diode (led) package and fabrication method thereof |
| JP2009111140A (ja) * | 2007-10-30 | 2009-05-21 | Sanyo Electric Co Ltd | 発光装置及びその製造方法 |
| TWM337834U (en) * | 2007-12-10 | 2008-08-01 | Everlight Electronics Co Ltd | Package structure for light emitting diode |
| KR100986202B1 (ko) * | 2008-07-01 | 2010-10-07 | 알티전자 주식회사 | 사이드 뷰 발광 다이오드 패키지 |
| JP5359135B2 (ja) * | 2008-09-10 | 2013-12-04 | 日亜化学工業株式会社 | 発光装置 |
| KR101705700B1 (ko) * | 2010-07-01 | 2017-02-10 | 엘지이노텍 주식회사 | 발광 소자 |
| KR101725221B1 (ko) * | 2011-01-20 | 2017-04-11 | 삼성전자 주식회사 | 발광 다이오드 패키지용 몰드 구조체 |
| KR101957884B1 (ko) * | 2012-05-14 | 2019-03-13 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 조명 장치 |
| JP6651699B2 (ja) * | 2015-02-27 | 2020-02-19 | 日亜化学工業株式会社 | 側面発光型発光装置の製造方法 |
| JP7057512B2 (ja) * | 2019-08-30 | 2022-04-20 | 日亜化学工業株式会社 | 発光装置 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5745982A (en) * | 1980-09-02 | 1982-03-16 | Toshiba Corp | Light emission indicator |
| JPS63159859A (ja) | 1986-12-23 | 1988-07-02 | Konica Corp | 電子写真感光体 |
| JPH0621258Y2 (ja) * | 1987-04-07 | 1994-06-01 | 日本デンヨ−株式会社 | Ledランプ |
| JPH01175164A (ja) | 1987-12-28 | 1989-07-11 | Toshiba Battery Co Ltd | 密閉形電池 |
| JPH01175166A (ja) | 1987-12-28 | 1989-07-11 | Shin Kobe Electric Mach Co Ltd | 鉛蓄電池用極柱の製造方法 |
| US4959761A (en) * | 1989-12-21 | 1990-09-25 | Dialight Corporation | Surface mounted led package |
| US5519596A (en) * | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
| JP3618534B2 (ja) * | 1997-11-28 | 2005-02-09 | 同和鉱業株式会社 | 光通信用ランプ装置とその製造方法 |
| US6386733B1 (en) * | 1998-11-17 | 2002-05-14 | Ichikoh Industries, Ltd. | Light emitting diode mounting structure |
| JP3348843B2 (ja) * | 1999-02-25 | 2002-11-20 | 日亜化学工業株式会社 | 発光ダイオード及びそれを用いたドットマトリックスディスプレイ |
| JP2002134699A (ja) * | 2000-10-27 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
| JP2002223003A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体とその製造方法及び発光装置 |
| JP2002344030A (ja) * | 2001-05-18 | 2002-11-29 | Stanley Electric Co Ltd | 横方向発光型面実装led及びその製造方法 |
| JP4610806B2 (ja) * | 2001-07-17 | 2011-01-12 | ローム株式会社 | 半導体装置の製造方法 |
| JP2003078172A (ja) * | 2001-09-03 | 2003-03-14 | Toyoda Gosei Co Ltd | Ledリードフレーム |
| US6812481B2 (en) * | 2001-09-03 | 2004-11-02 | Toyoda Gosei Co., Ltd. | LED device and manufacturing method thereof |
| JP2003168824A (ja) | 2001-11-30 | 2003-06-13 | Sanyo Electric Co Ltd | Led表示器及びその製造方法 |
| JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
| JP4222017B2 (ja) | 2001-12-18 | 2009-02-12 | 日亜化学工業株式会社 | 発光装置 |
| JP2003188422A (ja) * | 2001-12-20 | 2003-07-04 | Alps Electric Co Ltd | 発光装置及びその製造方法 |
| TWI292961B (en) * | 2002-09-05 | 2008-01-21 | Nichia Corp | Semiconductor device and an optical device using the semiconductor device |
| JP2004134699A (ja) * | 2002-10-15 | 2004-04-30 | Toyoda Gosei Co Ltd | 発光装置 |
-
2004
- 2004-06-30 JP JP2004192412A patent/JP4789433B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-29 US US11/631,343 patent/US7994532B2/en not_active Expired - Fee Related
- 2005-06-29 WO PCT/JP2005/011899 patent/WO2006003908A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2006003908A1 (ja) | 2006-01-12 |
| US7994532B2 (en) | 2011-08-09 |
| US20070183159A1 (en) | 2007-08-09 |
| JP2006019313A (ja) | 2006-01-19 |
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