WO2006003908A1 - Led表示器用筐体、led表示器及びled表示器連接部材 - Google Patents
Led表示器用筐体、led表示器及びled表示器連接部材 Download PDFInfo
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- WO2006003908A1 WO2006003908A1 PCT/JP2005/011899 JP2005011899W WO2006003908A1 WO 2006003908 A1 WO2006003908 A1 WO 2006003908A1 JP 2005011899 W JP2005011899 W JP 2005011899W WO 2006003908 A1 WO2006003908 A1 WO 2006003908A1
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- Prior art keywords
- led display
- housing
- pair
- led
- lead terminals
- Prior art date
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- 230000008569 process Effects 0.000 description 11
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
- H01L33/486—Containers adapted for surface mounting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Definitions
- the present invention relates to an LED display housing, an LED display, and an LED display connecting member, and more particularly, an LED display that is highly reliable after being mounted on a circuit board, such an LED display housing, and The present invention relates to such an LED display casing or an LED display connecting member in which a plurality of LED displays are connected.
- liquid crystal display is required to be thin even though the display area is large and a plurality of displays are incorporated. Therefore, the backlight LED display used in liquid crystal displays is also increasingly required to be thinner.
- FIG. 7 shows such a conventional LED display (more specifically, a “horizontal light emitting LED display”.
- Fig. 7 (a) shows a top view schematically showing the appearance of a conventional LED indicator
- Fig. 7 (b) shows a front view schematically showing the conventional LED indicator
- Fig. 7 (c) shows a bottom view schematically showing a conventional LED indicator
- Fig. 7 (d) shows a side view schematically showing a conventional LED indicator.
- FIG. 8 (a) is a schematic cross-sectional view taken along the line Z-Z shown in FIG. 7 (d), and FIG. 8 (b) is a conventional view shown in FIG. The perspective view which extracted the lead terminal part of the LED display is shown.
- the conventional LED display 101 includes a housing 101a and lead terminals 111 and 112.
- the housing 101a includes a bottom surface S101, a front surface S102 having an opening 102a for emitting light, a pair of flanges J surfaces S103 and S104, a rear surface S105, and an upper surface S106 adjacent to the front surface S102.
- a pair of flanges J surfaces S103 and S104 a pair of flanges J surfaces S103 and S104
- a rear surface S105 a rear surface S105
- an upper surface S106 adjacent to the front surface S102.
- the lead terminals 111 and 112 are also derived from the bottom surface S101 side force of the housing 101a. ing.
- each of the lead terminals 111 and 112 led out from the bottom surface S101 side of the casing 101a is bent along the bottom surface S101 in the front S102 direction.
- These portions are referred to as electrode portions 111A and 112A.
- the end portion of each of the lead terminals 111 and 112 has a shape that the bottom surface S101 side force is also bent upward in the direction of the upper surface S106 along each of the corresponding pair of side surfaces S103 and S104.
- each of the lead terminals 111 and 112 is exposed in the recess 114 forming the opening 102a.
- one end of the light emitting element (LED) 121 is fixedly connected to the exposed portion in the recess 114 of the lead terminal 111, and the other end of the light emitting element (LED) 121 is connected via the lead wire 103.
- the lead terminal 112 is connected to the exposed portion in the recess 114.
- the LED display 101 When the LED display 101 is connected to a circuit provided on a circuit board (not shown), the electrode portions 111A and 112A of the lead terminals 111 and 112 led out from the bottom surface S101 are connected to the circuit. A substrate (not shown) is soldered.
- the recess 114 is usually filled and sealed with a translucent epoxy resin or translucent silicon, or a translucent epoxy resin or translucent silicon 116 mixed with a fluorescent material. Has been.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2003-168824
- Patent Document 2 Japanese Patent Laid-Open No. 2003-249689
- Patent Document 3 Design Registration No. 175164
- Patent Document 4 Design Registration No. 175166
- the distance between the electrode portions 111A and 112A and the casing 101a, the electrode portion, as the size and thickness are further reduced in response to the demand for thickness reduction.
- the distance force between A and the light emitting element 121 is further shortened, and the lead terminal 111 of the housing 101a
- the area of the buried portion is also reduced. For this reason, these are the causes of reducing the reliability of LED displays.
- the housing 101a moves with respect to the force in the direction of the arrow shown in FIG. 7 (d), the angle of the front surface S102 having an opening for emitting light varies, and the illumination range varies. This is a cause of lowering the sex.
- the present invention has been made to solve the above-described problems, and the thermal power casing 101a or the like when the electrode portions 111A and 112A are soldered to a circuit board (not shown).
- An object of the present invention is to provide an LED display housing and an LED display which are made difficult to conduct to the light emitting element 121, and an LED display connecting member having a hanger-compatible structure capable of preventing the movement of the housing.
- an LED display housing includes a bottom surface, a front surface including an opening for emitting light, and a pair of side surfaces adjacent to the front surface. And a pair of lead terminals to which the light emitting element is attached, and each of the pair of lead terminals is led out to the bottom surface through each of a pair of side surfaces of the housing. ing.
- each of the pair of lead terminals led out from each of the pair of side surfaces is provided in the front direction along each of the corresponding pair of side surfaces.
- the end portions of each of the pair of lead terminals are bent along the bottom surface, and the electrode portions of the lead terminals are positioned at both end portions of the bottom surface. It is set as the structure.
- the LED display housing having the above-mentioned constitutional power is provided with a step portion at a position where each of the electrode portions of the lead terminal on the bottom surface is located, and each of the electrode portions of the pair of lead terminals is provided with the step It is set as the structure located in each of the level
- the LED display according to the present invention is configured to include a light emitting element in an exposed portion in the opening of one of the pair of lead terminals of the housing for the LED display. ing.
- the LED display connecting member includes a plurality of LED display housings or LED displays connected by a conductive member, and the plurality of LED display housings or A housing front side member having a front surface having an opening for emitting light on one side of each pair of lead terminals of the LED display and a housing rear side having a back surface on the other side of the pair of lead terminals.
- the conductive member has a first projecting portion that serves as the pair of lead terminals, and the housing does not have to be separated even after the first projecting portion is cut.
- the housing has a second projecting portion serving as a supporting hanger member, and the casing is connected to the second projecting portion.
- the LED display housing according to the present invention is configured so that each of the pair of lead terminals also derives each force on the side surface of the housing. Accordingly, the distance between the electrode portion of the lead terminal and the lead-out portion from the housing in each of the pair of lead terminals can be made longer than that in which each of the pair of lead terminals is derived from the bottom surface force of the housing.
- the LED display in which the light emitting element (LED) is mounted on the LED display housing is soldered when mounted on the circuit board. Heat is less likely to be conducted to the housing force lead-out portion of each of the pair of lead terminals, and the lead terminal lead-out portion of the housing is less likely to be heated by the lead terminal. Deformation can be prevented. That is, in this LED display, the airtightness between the lead terminal and the housing is not impaired after the LED display is mounted on the circuit board. Therefore, the LED display housing according to the present invention can be used in an LED display, so that the reliability of the LED display after mounting the LED display on the circuit board can be increased.
- the LED display housing according to the present invention can be used in an LED display, so that the reliability of the LED display after mounting the LED display on the circuit board can be increased.
- the opening is formed after mounting on the circuit board. Mounting accuracy can be maintained without tilting with respect to the plane of the mounting circuit board due to external force.
- the pair of lead terminals are bent along the side surface and the bottom surface, and the electrode portion of each lead terminal is positioned at the lower portion.
- the electrode portion of each lead terminal is positioned at the lower portion.
- the LED display housing according to the present invention is provided with stepped portions at both ends of the bottom surface of the housing, and the electrode portion of the lead terminal is positioned at each of the pair of stepped portions.
- the height of the housing can be lowered by the height of the electrode portion of the lead terminal while ensuring the height of the portion.
- the LED display housing is equipped with a light emitting element (LED) mounted on the LED display housing. When mounting, the LED display can be fixed stably, making it difficult for variations in height after mounting.
- LED light emitting element
- the LED display according to the present invention uses the LED display housing having the above-described configuration, the airtightness between the lead terminal and the housing is improved after mounting on the circuit board. It will not be damaged. As a result, the LED display according to the present invention can increase the reliability after mounting on the circuit board. Further, the LED display according to the present invention has a pair of lead terminals bent along the side surface and the bottom surface, and when the electrode portion of each lead terminal is positioned at the lower part, the external dimensions thereof are It fits in almost the same size and can be made compact.
- the LED display according to the present invention has a configuration in which stepped portions are provided at both ends of the bottom surface of the housing, and the electrode portion of the lead terminal is positioned in each of the pair of stepped portions. While ensuring the height, the height of the housing can be lowered by the height of the electrode portion of the lead terminal. In addition, by making the bottom surface of the housing and the bottom surface of the electrode the same surface, when mounting the LED display on the circuit board, the LED display is fixed stably, and variations in height after mounting are less likely to occur. be able to.
- the LED display connecting member includes a plurality of LED display cases or LED tables. Since each indicator is connected with a hanger member, the LED indicator housing in the manufacturing process and inspection process can be compared to the case where multiple LED indicator housings or LED indicators are manufactured separately. It is easy to support and fix the body or LED indicator when working. In addition, since it can be handled by the number of units that require operations such as arranging them one by one in a box, it can be easily transferred.
- the LED display connecting member according to the present invention is adjacent to each other by using, as a noninger member, a conductive member in which lead terminals of each of a plurality of LED display housings or LED displays are formed. Since the housings are adjacent to each other, no special hanger member is prepared. That is, the LED display connecting member according to the present invention has an advantage in that resources are effectively used.
- FIG. 1 is a perspective view schematically showing an example of an LED display housing and an LED display according to the present invention.
- FIG. 2 is a diagram schematically showing an example of an LED display housing and an LED display according to the present invention.
- 2 (a) is a top view schematically showing the LED display housing and LED display shown in FIG. 1 as viewed from above and below, and FIG. 2 (b) is shown in FIG. Fig. 2 (c) is a schematic front view of the LED display housing and LED display, and Fig. 2 (c) is a schematic bottom view of the LED display housing and LED display shown in Fig. 1.
- FIG. 2 is a schematic side view of the LED display housing and LED display shown in FIG.
- FIG. 3 is a diagram schematically showing an example of an LED display housing and an LED display according to the present invention.
- Fig. 3 (a) is a cross-sectional view taken along line Y-Y shown in Fig. 2 (d), and
- Fig. 3 (b) is the LED display housing and lead terminal portion of the LED display shown in Fig. 1.
- FIG. 3 (a) is a cross-sectional view taken along line Y-Y shown in Fig. 2 (d)
- Fig. 3 (b) is the LED display housing and lead terminal portion of the LED display shown in Fig. 1.
- FIG. 3 is a diagram schematically showing an example of an LED display housing and an LED display according to the present invention.
- Fig. 3 (a) is a cross-sectional view taken along line Y-Y shown in Fig. 2 (d)
- Fig. 3 (b) is the LED display housing and lead terminal portion of the LED display shown in Fig. 1.
- FIG. 3 (a) is a cross-sectional
- FIG. 4 is a process diagram illustratively illustrating a manufacturing process of an LED display connecting member according to the present invention.
- Fig. 4 (a) is a front view of the conductive member
- Fig. 4 (b) is a front view of the plurality of LED display casings punched into shapes to be constituent members
- Fig. 4 (c) is an enlarged front view of one LED display housing among the plurality of punched LED display housings shown in FIG. 4 (b).
- FIG. 5 is a process diagram illustratively explaining a manufacturing process of the LED display connecting member according to the present invention.
- Fig. 5 (a) is a front view of a plurality of LED display housings formed by resin molding
- Fig. 5 (b) is a plurality of LED display housings in Fig. 5 (a).
- Fig. 5 (c) is an enlarged front view of one of the body for an LED display in the body, and is a cross-sectional view taken along the line V-V shown in Fig. 5 (b).
- FIG. 6 is a process diagram for exemplarily explaining a process for manufacturing an LED display connecting member according to the present invention.
- Fig. 6 (a) is a front view of the lead terminal forming portions of each of the plurality of LED display housings cut at a predetermined position
- Fig. 6 (b) is the lead of the plurality of LED display units.
- FIG. 6 (c) is an enlarged perspective view of one LED display among the plurality of LED displays.
- FIG. 6 (c) is a perspective view showing a state after the terminal bending process and the light emitting element (LED) are mounted.
- LED light emitting element
- FIG. 7 is a diagram schematically showing an example of a conventional LED display.
- Fig. 7 (a) is a top view schematically showing the appearance of a conventional LED display
- Fig. 7 (b) is a front view schematically showing a conventional LED display
- Fig. 7 (c) is a bottom view schematically showing a conventional LED display
- FIG. 7 (d) is a side view schematically showing the conventional LED display.
- FIG. 8 is a diagram schematically showing an example of a conventional LED display.
- Fig. 8 (a) is a schematic cross-sectional view taken along the line Z-Z shown in Fig. 7 (d), and
- Fig. 8 (b) is the extracted lead terminal portion of the conventional LED display shown in Fig. 7.
- FIG. 8 (a) is a schematic cross-sectional view taken along the line Z-Z shown in Fig. 7 (d)
- Fig. 8 (b) is the extracted lead terminal portion of the conventional LED display shown in Fig. 7.
- a housing for an LED display according to the present invention, an LED display in which a light emitting element (LED) is mounted on the housing for the LED display, and a plurality of the housing for the LED display or the LED display are connected.
- LED light emitting element
- FIG. 1 is a perspective view schematically showing an example of an LED display housing and an LED display according to the present invention.
- FIG. 2 (a) is a top view schematically showing the LED display housing and the LED display according to the present invention shown in FIG. 1 (a plan view schematically showing a state seen below the upper force).
- Fig. 2 (b) shows a schematic front view of the LED display case and LED display shown in Fig. 1, and
- Fig. 2 (c) shows the LED display case shown in Fig. 1.
- Fig. 2 (d) shows a schematic side view of the LED display housing and LED display shown in Fig. 1.
- Fig. 2 (d) shows a schematic side view of the LED display.
- Fig. 3 (a) is a cross-sectional view taken along the line Y-Y shown in Fig. 2 (d), and Fig. 3 (b) is an LED display housing and LED shown in Fig. 1. The perspective view which extracted the lead terminal part of the indicator is shown.
- the LED display 1 means a state in which a light emitting element (LED) 21 is mounted.
- the LED display housing 1R means a state in which the light emitting element (LED) 21 is mounted on the LED display 1.
- the housing la includes a bottom surface S1, a front surface S2 including an opening 2a for emitting light, a pair of side surfaces S3 and S4 adjacent to the front surface S2, a back surface S5, and an upper surface S6.
- the bottom surface SI has a pair of C1A and C2A recesses
- the top surface S6 has a pair of C1B and C2B recesses. These four recesses are traces embedded in the hanger member force casing la described later.
- the lead terminals 11 and 12 are partially embedded in the housing la.
- the LED display 1 is characterized in that each of the pair of lead terminals 11 and 12 also derives the force of each of the pair of side surfaces S3 and S4.
- each of the pair of lead terminals 11, 12 that is adapted to derive the force of each of the pair of side surfaces S3, S4 is provided along each of the corresponding pair of side surfaces S3, S4. Front face Bent in the S2 direction.
- the end portions of each of the pair of lead terminals 11 and 12 are bent inward along the bottom surface S1, and the electrode portions 11 and 12A of the lead terminals 11 and 12 are formed at both ends of the bottom surface S1, respectively. Is located.
- the LED display 1 is provided with stepped portions Pl and P2 at both ends of the bottom surface S1, and the electrode portions 11A and 12A are positioned at the stepped portions Pl and P2, respectively.
- This LED display 1 is obtained by mounting a light emitting element (LED) 21 on one of a pair of lead terminals 11 and 12 on an LED display housing 1R.
- LED light emitting element
- the light emitting element (LED) 21 has one end fixedly connected to the exposed portion of the lead terminal 12 in the recess 14 of the opening 2a of the housing la, and the other end connected to the lead wire. 3 is connected to the exposed portion of the lead terminal 11 in the recess 14 of the opening 2a of the housing la.
- the light emitting element 21 is an element in which a semiconductor P layer and an N layer are stacked, and a semiconductor light emitting element that emits light at a bonding surface force between the P layer and the N layer by flowing a direct current. (LED) is used.
- the lead wire 3 is a thin wire such as a gold wire, and is bonded to the light emitting element 21 and the lead terminal 11 by bonding.
- the lead terminals 11, 12 are also made of iron, copper or copper alloy material having a thickness of about 0.10 mm to 0.15 mm, and the surface thereof is subjected to silver plating.
- the case la has heat resistance such as polyphthalamide resin, liquid crystal polymer, nylon resin, etc. Select a material that has a high coefficient of thermal expansion, a low coefficient of thermal expansion, a low moisture absorption, and a good moldability.
- the opening 2a of the recess 14 of the housing la has a shape enlarged toward the front surface S2.
- Light emitted from the light emitting element (LED) 21 is reflected by the wall surface 15 and emitted in the front S2 direction.
- the recess 14 of the opening 2a of the housing la is filled and sealed with a sealing resin at the end of the manufacturing process.
- the sealing resin 16 is a translucent epoxy resin or translucent silicon, or a translucent epoxy resin or translucent silicon mixed with a fluorescent material or the like.
- the bottom surface S1 of the LED display 1 is opposed to a circuit board (not shown).
- the electrode portions 11A and 12A of the lead terminals 11 and 12 are soldered to a circuit board (not shown), and the LED display 1 is mounted on the circuit board.
- each of the pair of lead terminals 11, 12 is led out from both side surfaces S3, S4 of the casing la, so that a pair of lead terminals 111 as shown in FIG. 112 can be made longer than the electrode portion 11A, 12A and the lead-out portion from each case la of each of the pair of lead terminals 11, 12, compared to the case where each of the first and second lead terminals 11, 12 is derived from the bottom surface S101 of the housing 101a.
- the LED indicator 1 when the LED indicator 1 is mounted on a circuit board (not shown), the heat of soldering is applied to the lead-out portions from the housing la of each of the pair of lead terminals 11 and 12. It becomes difficult to conduct, and the lead terminals 11 and 12 of the housing la are not easily heated by the lead terminals 11 and 12, so that deformation of the lead portions of the lead terminals 11 and 12 of the housing la can be prevented. it can. That is, in the LED display 1, after the LED display 1 is mounted on a circuit board (not shown), the airtightness between the lead terminals 11 and 12 and the housing la is not impaired. As a result, the LED display 1 is highly reliable after being mounted on a circuit board (not shown).
- the bending force of the lead terminals 11 and 12 and the casing la is not a back surface as shown in FIG. 8 and is positioned on a pair of side surfaces S3 and S4 and perpendicular to a circuit board (not shown) surface. Therefore, after mounting on a circuit board (not shown), even if an external force as shown in Fig. 7 (d) is applied, the mounting accuracy is such that the opening 2a does not tilt with respect to the plane of the mounting circuit board. Can be maintained.
- the LED indicator 1 includes a pair of lead terminals 11, 12 force side surfaces S3, S4 and a bottom surface S1. Since the electrode portions 11A and 12A of the respective lead terminals 11 and 12 are positioned in the lower part, the outer dimensions thereof are almost the same as the case la, and can be made compact.
- the LED indicator 1 is provided with stepped portions Pl and P2 at both ends of the bottom surface S1 of the casing la, and the electrodes of the lead terminals 11 and 12 are provided at the pair of stepped portions Pl and P2, respectively. Since each of the portions 11A and 12A is positioned, the height of the housing la can be lowered by the height of the electrode portions 11A and 12A of the lead terminals 11 and 12 while ensuring the height of the opening 2a. it can. In addition, since the bottom surface S1 of the housing la and the bottom surfaces of the electrode portions 11A and 12A are the same surface, when the LED display 1 is mounted on a circuit board (not shown), the LED display 1 Fixing is stable and height variation after mounting is unlikely to occur.
- FIG. 4, FIG. 5 and FIG. 6 are process diagrams illustratively explaining the manufacturing process of the LED display connecting member 51 according to the present invention.
- FIG. 4, FIG. 5, and FIG. 6, the hatching indicated by the two-dot chain line at 45 degrees indicates a portion where the material of the plate material exists in order to facilitate understanding of the present invention.
- FIG. 4 (a) is a front view showing a plate-like conductive member 30 cut to a predetermined dimension.
- a conductive member 30 is prepared.
- This conductive member 30 is made of iron, copper, or a copper alloy material having a thickness of about 0.10 mm to 0.15 mm, and the surface thereof is subjected to a silver plating treatment.
- FIG. 4 (c) is an enlarged front view of one LED display housing 1R among the plurality of punched LED display housings 1R in FIG. 4 (b).
- a portion indicated by H indicates a hole in which the conductive member 30 is punched.
- a plurality of LED display housings 1R or LED displays 1 are connected by a portion of the conductive member 30 around the hole.
- hanger members 31A and 32A are provided on the conductive member 30 outside the lower surfaces of the pair of terminal forming portions 11E and 12E at a predetermined distance, so that the pair of terminal forming portions 11 Hanger members 31B and 32B are provided outside the upper side surfaces of E and 12E at a predetermined distance.
- the hanger members 31A, 32A and the hanger members 31B, 32B can maintain a narrow gap between their tips located between the pair of terminal forming portions 11E, 12E (the height of the LED indicator 1 ( In order to reduce (thin) the thickness), the pair of terminal forming portions 11E and 12E are arranged at asymmetric positions.
- the hanger members 31A, 32A located on one side are hung on the inner side of the hanger members 31A, 32A by making the interval between the hanger members 31B, 32B located on the other side longer.
- Members 31B and 32B are arranged.
- the interval between the hanger members 31A and 32A is made longer than the interval between the hanger members 31B and 32B. ing.
- the shape of the terminal forming portions 11E and 12E is devised. That is, as shown in FIG. 4 (c), recesses are formed in the terminal forming portions 11E and 12E that face the tips of the hanger members 31A and 32A and the noninger members 31B and 32B. By this depression, it is possible to secure an area for receiving the tips of the hanger members 31 A and 32 A and the hanger members 31 B and 32 B without increasing (thickening) the height (thickness) of the LED display 1. .
- the pair of terminal forming portions 11E and 12E are formed into a substantially S-shape having a predetermined width by forming a recess, and the shapes of the hanger members 31A and 32A and the noinger members 31B and 32B are bypassed. It becomes.
- a long heat dissipation path can be secured.
- FIG. 5 (a) is an enlarged front view of one LED indicator housing 1R among the multiple LED indicator housings 1R in Fig. 5 (a).
- Fig. 5 (c) 5 (b) schematically shows a VV cross-sectional view.
- a housing front side member lal having a front surface including an opening 2a for emitting light and a recess 14 is provided. It is formed.
- the body back side member la2 is formed.
- the case la is formed by the case front side member lal and the case back side member la2.
- the adjacent case la The force between the upper surface S6 of one housing la and the bottom surface S1 of the other housing la of the adjacent housing la Conductive member 30 that created the lead terminals 11 and 12 of each of the plurality of LED indicators 30 are connected as noninger members 31A, 32A, 31B and 32B.
- the force hanger members 31A, 32A, 31B, and 32B are connected to each other between the housing la and the housing la adjacent to the housing la.
- the position of the hanger member will be described. As shown in Fig. 5 (b), the pair of lower hanger members 31A, 32A are provided with stepped portions PI, It is in position P2.
- the upper hanger members 31B and 32B are provided from the center of the upper hanger members 31B and 32B outside the range of the recess 14 of the opening 2a of the housing la.
- each hanger member 31A, 32A, 31B, 32B is embedded in the casing la by a predetermined dimension and is molded with a resin, and the LED display casing 1R or LED indicator 1 can be held.
- Traces from which the tips of the embedded hanger members 31A, 32A, 31B, and 32B are removed are a pair of C1A and C2A recesses on the bottom surface S1 and a pair of C1B and C2B on the top surface S6 shown in FIGS. It is a recessed part.
- burrs are formed on the traces where the tips of the hanger members 31A and 32A are removed. Even if it occurs, it is possible to prevent the LED display 1 from being hindered by the burr.
- the lead terminal forming portions 11E and 12E of each of the plurality of LED display housings 1R are sequentially cut at a predetermined position F, and the pair of lead terminals 11 , 12 is formed.
- each of the pair of lead terminals 11, 12 from which the lateral force of each housing la of each of the plurality of LED display housings 1A is derived is shown in FIG. 1 and FIG. As shown, it is bent in the front S2 direction along a pair of side surfaces S3 and S4 corresponding to each case la. Then , End portion partial force of each of the pair of lead terminals 11 and 12 is bent inward along the bottom surface SI, and the electrode portions 11A and 12A of the lead terminals 11 and 12 are positioned at both ends of the bottom surface S1, respectively. Is done.
- the light emitting element (LED) 21 is one of the pair of lead terminals 11 and 12 of each of the plurality of LED indicators, and one lead terminal in the recess 14 of the housing la. The other end is connected and fixed to the exposed portion of the lead terminal 11 in the recess 14 of the housing la via the lead wire 3.
- Fig. 6 (b) is a perspective view showing the state of the plurality of LED indicators 1 after lead terminal bending and mounting of the light emitting element (LED), and Fig. 6 (c) An enlarged perspective view of one LED indicator 1 among the LED indicators 1 is shown.
- each of the plurality of LED indicators 1 is held on each hanger member 31A, 32A, 31B, 32B, each lead terminal forming portion 11E, 12E is separated from the conductive member 30. Later, the plurality of LED indicators 1 will not fall apart.
- the LED display connecting member 51 includes a plurality of LED display housings 1R or conductive members 30 in which the respective lead terminals 11 and 12 of the LED display 1 are formed as a noninger member 31A, Since it is used as 32A, 31B, and 32B and the force between adjacent cases la is adjacent, there is no need to prepare a special hanger member. That is, the LED display connecting member 51 has an advantage when resources are effectively used.
- the LED indicator connecting member 51 is transferred to a target location until the inspection process is completed, and in this state, quality inspection is performed.
- each LED indicator 1 is separated from the LED indicator connecting member 51.
- the hanger members 31A, 32A, 31B, and 32B force connecting the LED indicators 1 of the housing la Each force is extracted.
- the LED display according to the present invention does not impair the airtightness between the lead terminal and the housing after mounting on the circuit board, the LED display has high reliability after mounting on the circuit board.
- the LED display according to the present invention can be suitably used widely as a thin and highly reliable LED display, as a backlight light source for liquid crystal displays of small devices such as mobile phones. .
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/631,343 US7994532B2 (en) | 2004-06-30 | 2005-06-29 | LED indicator casing, LED indicator, and LED indicator joint member comprising hanger members |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004192412A JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
JP2004-192412 | 2004-06-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006003908A1 true WO2006003908A1 (ja) | 2006-01-12 |
Family
ID=35782716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/011899 WO2006003908A1 (ja) | 2004-06-30 | 2005-06-29 | Led表示器用筐体、led表示器及びled表示器連接部材 |
Country Status (3)
Country | Link |
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US (1) | US7994532B2 (ja) |
JP (1) | JP4789433B2 (ja) |
WO (1) | WO2006003908A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2158617A2 (en) * | 2007-06-20 | 2010-03-03 | LG Innotek Co., Ltd. | Light emitting device package and manufacturing method thereof |
Families Citing this family (17)
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---|---|---|---|---|
JP4857791B2 (ja) | 2006-02-01 | 2012-01-18 | 日亜化学工業株式会社 | 半導体装置の製造方法 |
KR100820529B1 (ko) * | 2006-05-11 | 2008-04-08 | 엘지이노텍 주식회사 | 발광 장치 및 그 제조방법, 면 발광 장치 |
JP2008198807A (ja) | 2007-02-14 | 2008-08-28 | Nichia Corp | 半導体装置 |
JP4976168B2 (ja) * | 2007-03-06 | 2012-07-18 | 豊田合成株式会社 | 発光装置 |
JP4976167B2 (ja) * | 2007-03-06 | 2012-07-18 | 豊田合成株式会社 | 発光装置 |
US7993038B2 (en) | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
US7566159B2 (en) * | 2007-05-31 | 2009-07-28 | Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. | Side-emitting LED package with improved heat dissipation |
US20090026470A1 (en) | 2007-07-23 | 2009-01-29 | Novalite Optronics Corp. | Super thin side-view light-emitting diode (led) package and fabrication method thereof |
JP2009111140A (ja) * | 2007-10-30 | 2009-05-21 | Sanyo Electric Co Ltd | 発光装置及びその製造方法 |
TWM337834U (en) * | 2007-12-10 | 2008-08-01 | Everlight Electronics Co Ltd | Package structure for light emitting diode |
KR100986202B1 (ko) * | 2008-07-01 | 2010-10-07 | 알티전자 주식회사 | 사이드 뷰 발광 다이오드 패키지 |
JP5359135B2 (ja) * | 2008-09-10 | 2013-12-04 | 日亜化学工業株式会社 | 発光装置 |
KR101705700B1 (ko) * | 2010-07-01 | 2017-02-10 | 엘지이노텍 주식회사 | 발광 소자 |
KR101725221B1 (ko) * | 2011-01-20 | 2017-04-11 | 삼성전자 주식회사 | 발광 다이오드 패키지용 몰드 구조체 |
KR101957884B1 (ko) * | 2012-05-14 | 2019-03-13 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 조명 장치 |
JP6651699B2 (ja) * | 2015-02-27 | 2020-02-19 | 日亜化学工業株式会社 | 側面発光型発光装置の製造方法 |
JP7057512B2 (ja) * | 2019-08-30 | 2022-04-20 | 日亜化学工業株式会社 | 発光装置 |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5745982A (en) * | 1980-09-02 | 1982-03-16 | Toshiba Corp | Light emission indicator |
JPS63159859U (ja) * | 1987-04-07 | 1988-10-19 | ||
JP2000312033A (ja) * | 1999-02-25 | 2000-11-07 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたドットマトリックスディスプレイ |
JP2002134699A (ja) * | 2000-10-27 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
JP2002223003A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体とその製造方法及び発光装置 |
JP2002344030A (ja) * | 2001-05-18 | 2002-11-29 | Stanley Electric Co Ltd | 横方向発光型面実装led及びその製造方法 |
JP2003031748A (ja) * | 2001-07-17 | 2003-01-31 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
JP2003078172A (ja) * | 2001-09-03 | 2003-03-14 | Toyoda Gosei Co Ltd | Ledリードフレーム |
JP2003188422A (ja) * | 2001-12-20 | 2003-07-04 | Alps Electric Co Ltd | 発光装置及びその製造方法 |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63159859A (ja) | 1986-12-23 | 1988-07-02 | Konica Corp | 電子写真感光体 |
JPH01175164A (ja) | 1987-12-28 | 1989-07-11 | Toshiba Battery Co Ltd | 密閉形電池 |
JPH01175166A (ja) | 1987-12-28 | 1989-07-11 | Shin Kobe Electric Mach Co Ltd | 鉛蓄電池用極柱の製造方法 |
US4959761A (en) * | 1989-12-21 | 1990-09-25 | Dialight Corporation | Surface mounted led package |
US5519596A (en) * | 1995-05-16 | 1996-05-21 | Hewlett-Packard Company | Moldable nesting frame for light emitting diode array |
JP3618534B2 (ja) * | 1997-11-28 | 2005-02-09 | 同和鉱業株式会社 | 光通信用ランプ装置とその製造方法 |
DE69936704T2 (de) * | 1998-11-17 | 2007-12-06 | Ichikoh Industries Ltd. | Montagestruktur für Leuchtdioden |
US6812481B2 (en) | 2001-09-03 | 2004-11-02 | Toyoda Gosei Co., Ltd. | LED device and manufacturing method thereof |
JP2003168824A (ja) | 2001-11-30 | 2003-06-13 | Sanyo Electric Co Ltd | Led表示器及びその製造方法 |
JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
JP4222017B2 (ja) | 2001-12-18 | 2009-02-12 | 日亜化学工業株式会社 | 発光装置 |
TWI292961B (en) * | 2002-09-05 | 2008-01-21 | Nichia Corp | Semiconductor device and an optical device using the semiconductor device |
JP2004134699A (ja) * | 2002-10-15 | 2004-04-30 | Toyoda Gosei Co Ltd | 発光装置 |
-
2004
- 2004-06-30 JP JP2004192412A patent/JP4789433B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-29 WO PCT/JP2005/011899 patent/WO2006003908A1/ja active Application Filing
- 2005-06-29 US US11/631,343 patent/US7994532B2/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5745982A (en) * | 1980-09-02 | 1982-03-16 | Toshiba Corp | Light emission indicator |
JPS63159859U (ja) * | 1987-04-07 | 1988-10-19 | ||
JP2000312033A (ja) * | 1999-02-25 | 2000-11-07 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたドットマトリックスディスプレイ |
JP2002134699A (ja) * | 2000-10-27 | 2002-05-10 | Matsushita Electric Ind Co Ltd | 半導体集積回路装置 |
JP2002223003A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体とその製造方法及び発光装置 |
JP2002344030A (ja) * | 2001-05-18 | 2002-11-29 | Stanley Electric Co Ltd | 横方向発光型面実装led及びその製造方法 |
JP2003031748A (ja) * | 2001-07-17 | 2003-01-31 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
JP2003078172A (ja) * | 2001-09-03 | 2003-03-14 | Toyoda Gosei Co Ltd | Ledリードフレーム |
JP2003188422A (ja) * | 2001-12-20 | 2003-07-04 | Alps Electric Co Ltd | 発光装置及びその製造方法 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2158617A2 (en) * | 2007-06-20 | 2010-03-03 | LG Innotek Co., Ltd. | Light emitting device package and manufacturing method thereof |
EP2158617A4 (en) * | 2007-06-20 | 2013-08-07 | Lg Innotek Co Ltd | PHOTOEMETTER DEVICE HOUSING AND METHOD FOR MANUFACTURING THE SAME |
US8587118B2 (en) | 2007-06-20 | 2013-11-19 | Lg Innotek Co., Ltd. | Light emitting device package and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
US20070183159A1 (en) | 2007-08-09 |
JP2006019313A (ja) | 2006-01-19 |
US7994532B2 (en) | 2011-08-09 |
JP4789433B2 (ja) | 2011-10-12 |
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