JP2006019313A - Led表示器用筐体、led表示器及びled表示器連接部材 - Google Patents
Led表示器用筐体、led表示器及びled表示器連接部材 Download PDFInfo
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- JP2006019313A JP2006019313A JP2004192412A JP2004192412A JP2006019313A JP 2006019313 A JP2006019313 A JP 2006019313A JP 2004192412 A JP2004192412 A JP 2004192412A JP 2004192412 A JP2004192412 A JP 2004192412A JP 2006019313 A JP2006019313 A JP 2006019313A
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- H—ELECTRICITY
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- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2924/01—Chemical elements
- H01L2924/01004—Beryllium [Be]
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- H01L2924/01057—Lanthanum [La]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01078—Platinum [Pt]
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
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- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
【解決手段】底面S1と、光を出射する開口部2aを備える正面S2と、正面S2に隣接する一対の側面S3、S4とを備える筐体1aと、一対のリード端子11、12とを備え、一対のリード端子11、12の各々を筐体1aの一対の側面S3、S4の各々から導出するようにした。
【選択図】図1
Description
1R LED表示器用筐体
1a 筐体
2a 開口部
3 リードワイヤー
11、12 リード端子
11A、12A リード端子の電極部
14 凹所
51 LED表示器連接部材
S1 筐体の底面
S2 筐体の正面
S3、S4 筐体の側面
S6 筐体の上面
P1、P2 筐体の段差部
C1A、C2A、C1B、C2B 凹部
21 発光素子(LED)
30 導電性部材
31A、32A 下部ハンガー部材
31B、32B 上部ハンガー部材
Claims (5)
- 底面と、光を出射する開口部を備える正面と、前記正面に隣接する一対の側面とを備える筐体と、一対のリード端子とを備え、前記一対のリード端子の各々を前記筐体の一対の側面の各々から導出するようにしたLED表示器用筐体。
- 前記一対の側面の各々から導出するようにした一対のリード端子の各々を、対応する前記一対の側面の各々に沿って正面方向に折り曲げ、次いで、前記一対のリード端子の各々の端部部分を前記底面に沿って折り曲げ、前記底面の両端部の各々にリード端子の電極部を位置させるようにした請求項1に記載のLED表示器用筐体。
- 前記底面の、前記リード端子の電極部の各々が位置する場所に段差部を設け、前記一対のリード端子の電極部の各々を、前記底面に設けた段差部の各々に位置させるようにした請求項1又は請求項2に記載のLED表示器用筐体。
- 請求項1〜3のいずれかに記載のLED表示器用筐体の、一対のリード端子のいずれか一方の筐体の開口部の凹所内の露出部に発光素子(LED)を備えるLED表示器。
- 複数個のLED表示器用筐体又はLED表示器が連接されたLED表示器連接部材であって、前記複数個のLED表示器用筐体の各々の一対のリード端子に対応するように、一対のリード端子の各々の一方側に、光を出射する開口部を備える正面を備える筐体正面側半体部を形成し、一対のリード端子の各々の他方側に、背面を備える筐体背面側半体部を形成し、前記筐体正面側半体部と前記筐体背面側半体部とにより構成される筐体の各々の隣接する筐体と筐体との間を、隣接する筐体の一方の筐体の上面と、隣接する筐体の他方の筐体の底面との間を、前記複数個のLED表示器用筐体の各々のリード端子を作成した導電性部材をハンガー部材として用いて連接したLED表示器連接部材。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004192412A JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
US11/631,343 US7994532B2 (en) | 2004-06-30 | 2005-06-29 | LED indicator casing, LED indicator, and LED indicator joint member comprising hanger members |
PCT/JP2005/011899 WO2006003908A1 (ja) | 2004-06-30 | 2005-06-29 | Led表示器用筐体、led表示器及びled表示器連接部材 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004192412A JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2006019313A true JP2006019313A (ja) | 2006-01-19 |
JP4789433B2 JP4789433B2 (ja) | 2011-10-12 |
Family
ID=35782716
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004192412A Expired - Fee Related JP4789433B2 (ja) | 2004-06-30 | 2004-06-30 | Led表示器用筺体及びled表示器 |
Country Status (3)
Country | Link |
---|---|
US (1) | US7994532B2 (ja) |
JP (1) | JP4789433B2 (ja) |
WO (1) | WO2006003908A1 (ja) |
Cited By (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007207986A (ja) * | 2006-02-01 | 2007-08-16 | Nichia Chem Ind Ltd | 半導体装置及びその製造方法 |
JP2008218763A (ja) * | 2007-03-06 | 2008-09-18 | Toyoda Gosei Co Ltd | 発光装置 |
JP2008218762A (ja) * | 2007-03-06 | 2008-09-18 | Toyoda Gosei Co Ltd | 発光装置 |
JP2009054990A (ja) * | 2007-05-31 | 2009-03-12 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 放熱の向上を伴う側面発光ledパッケージ |
JP2009111140A (ja) * | 2007-10-30 | 2009-05-21 | Sanyo Electric Co Ltd | 発光装置及びその製造方法 |
JP2010016358A (ja) * | 2008-07-01 | 2010-01-21 | Alti Electronics Co Ltd | サイドビュー発光ダイオードパッケージ。 |
JP2010067770A (ja) * | 2008-09-10 | 2010-03-25 | Nichia Corp | 発光装置 |
KR100961231B1 (ko) | 2007-07-23 | 2010-06-03 | 노밸리트 옵트로닉스 코포레이션 | 초미세 사이드뷰 발광다이오드 패키지 및 그 제조방법 |
US7982235B2 (en) | 2007-02-14 | 2011-07-19 | Nichia Corporation | Light emitting device, package and lead frame |
US7993038B2 (en) | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
JP2012151479A (ja) * | 2011-01-20 | 2012-08-09 | Samsung Led Co Ltd | 発光ダイオード・パッケージ用モールド構造体 |
JP2016162867A (ja) * | 2015-02-27 | 2016-09-05 | 日亜化学工業株式会社 | 側面発光型発光装置の製造方法 |
JP2017201729A (ja) * | 2006-05-11 | 2017-11-09 | エルジー イノテック カンパニー リミテッド | 側面発光型発光装置 |
JP2019201232A (ja) * | 2019-08-30 | 2019-11-21 | 日亜化学工業株式会社 | 発光装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101326888B1 (ko) * | 2007-06-20 | 2013-11-11 | 엘지이노텍 주식회사 | 반도체 발광소자 패키지 |
TWM337834U (en) * | 2007-12-10 | 2008-08-01 | Everlight Electronics Co Ltd | Package structure for light emitting diode |
KR101705700B1 (ko) * | 2010-07-01 | 2017-02-10 | 엘지이노텍 주식회사 | 발광 소자 |
KR101957884B1 (ko) * | 2012-05-14 | 2019-03-13 | 엘지이노텍 주식회사 | 발광 소자, 발광 소자 제조방법 및 조명 장치 |
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JP2000312033A (ja) * | 1999-02-25 | 2000-11-07 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたドットマトリックスディスプレイ |
JP2002223003A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体とその製造方法及び発光装置 |
JP2002344030A (ja) * | 2001-05-18 | 2002-11-29 | Stanley Electric Co Ltd | 横方向発光型面実装led及びその製造方法 |
JP2003031748A (ja) * | 2001-07-17 | 2003-01-31 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
JP2003078172A (ja) * | 2001-09-03 | 2003-03-14 | Toyoda Gosei Co Ltd | Ledリードフレーム |
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JP2004134699A (ja) * | 2002-10-15 | 2004-04-30 | Toyoda Gosei Co Ltd | 発光装置 |
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JP4009097B2 (ja) * | 2001-12-07 | 2007-11-14 | 日立電線株式会社 | 発光装置及びその製造方法、ならびに発光装置の製造に用いるリードフレーム |
JP4222017B2 (ja) | 2001-12-18 | 2009-02-12 | 日亜化学工業株式会社 | 発光装置 |
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2004
- 2004-06-30 JP JP2004192412A patent/JP4789433B2/ja not_active Expired - Fee Related
-
2005
- 2005-06-29 WO PCT/JP2005/011899 patent/WO2006003908A1/ja active Application Filing
- 2005-06-29 US US11/631,343 patent/US7994532B2/en not_active Expired - Fee Related
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JPS63159859U (ja) * | 1987-04-07 | 1988-10-19 | ||
JP2000312033A (ja) * | 1999-02-25 | 2000-11-07 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたドットマトリックスディスプレイ |
JP2002223003A (ja) * | 2001-01-26 | 2002-08-09 | Nichia Chem Ind Ltd | パッケージ成形体とその製造方法及び発光装置 |
JP2002344030A (ja) * | 2001-05-18 | 2002-11-29 | Stanley Electric Co Ltd | 横方向発光型面実装led及びその製造方法 |
JP2003031748A (ja) * | 2001-07-17 | 2003-01-31 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
JP2003078172A (ja) * | 2001-09-03 | 2003-03-14 | Toyoda Gosei Co Ltd | Ledリードフレーム |
JP2003188422A (ja) * | 2001-12-20 | 2003-07-04 | Alps Electric Co Ltd | 発光装置及びその製造方法 |
JP2004134699A (ja) * | 2002-10-15 | 2004-04-30 | Toyoda Gosei Co Ltd | 発光装置 |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007207986A (ja) * | 2006-02-01 | 2007-08-16 | Nichia Chem Ind Ltd | 半導体装置及びその製造方法 |
US8198108B2 (en) | 2006-02-01 | 2012-06-12 | Nichia Corporation | Semiconductor device and method for manufacturing the same |
JP2017201729A (ja) * | 2006-05-11 | 2017-11-09 | エルジー イノテック カンパニー リミテッド | 側面発光型発光装置 |
US10580943B2 (en) | 2006-05-11 | 2020-03-03 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
US10243112B2 (en) | 2006-05-11 | 2019-03-26 | Lg Innotek Co., Ltd. | Light emitting device and method for fabricating the same |
US7982235B2 (en) | 2007-02-14 | 2011-07-19 | Nichia Corporation | Light emitting device, package and lead frame |
JP2008218763A (ja) * | 2007-03-06 | 2008-09-18 | Toyoda Gosei Co Ltd | 発光装置 |
JP2008218762A (ja) * | 2007-03-06 | 2008-09-18 | Toyoda Gosei Co Ltd | 発光装置 |
US7993038B2 (en) | 2007-03-06 | 2011-08-09 | Toyoda Gosei Co., Ltd. | Light-emitting device |
JP2009054990A (ja) * | 2007-05-31 | 2009-03-12 | Avago Technologies Ecbu Ip (Singapore) Pte Ltd | 放熱の向上を伴う側面発光ledパッケージ |
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JP4789433B2 (ja) | 2011-10-12 |
US7994532B2 (en) | 2011-08-09 |
US20070183159A1 (en) | 2007-08-09 |
WO2006003908A1 (ja) | 2006-01-12 |
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