JP2008241718A - メモリ集積化を用いる高感度光走査 - Google Patents
メモリ集積化を用いる高感度光走査 Download PDFInfo
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- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N3/00—Scanning details of television systems; Combination thereof with generation of supply voltages
- H04N3/10—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical
- H04N3/14—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices
- H04N3/15—Scanning details of television systems; Combination thereof with generation of supply voltages by means not exclusively optical-mechanical by means of electrically scanned solid-state devices for picture signal generation
- H04N3/155—Control of the image-sensor operation, e.g. image processing within the image-sensor
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
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- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
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- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
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- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
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Abstract
【解決手段】非連続の照明を提供する光源と、検査すべき対象物の複数の少なくとも部分的に重なり合う二次元画像フレームを、あるフレーム速度で取得するように動作する二次元の光センサアレイと、前記二次元画像フレームを受信し、検査すべき前記対象物の表現を生成するために重なり合った部分を結合するように、前記表現の検査に基づいて検査すべき前記対象物上の欠陥の報告を提供するよう動作する欠陥分析器と、を備える検査システムであって、前記非連続の照明と、前記フレーム速度とが、概ね同期している、検査システム。
【選択図】図1B
Description
22 プリント回路基板
24 カメラ
26 画像化素子
28 対物レンズ
30 カメラ制御部
32 平行移動ステージ
34 プロセッサ
36 ディスプレイ
Claims (14)
- 非連続的な照明を提供する光源と、
検査すべき対象物の、少なくとも部分的に重なり合う複数の二次元画像フレームを、あるフレーム速度で取得するように動作する二次元の光センサアレイを有し、前記非連続の照明と、前記フレーム速度とが、概ね同期しており、
さらに、前記二次元画像フレームを受信し、重なり合った部分を結合して、検査すべき前記対象物の表象を生成し、前記表象を検査して、検査すべき前記対象物上の欠陥の報告を提供するよう動作する欠陥分析器、を備える検査システム。 - 前記二次元の光センサアレイがCMOS集積回路上に配置されている請求項1に記載の検査システム。
- 前記二次元の光センサアレイが、複数のディジタル画像を提供し、各ディジタル画像は、複数のピクセルにより構成される、請求項1に記載の検査システム。
- 前記対象物の前記表象が複数のピクセルで構成されたディジタル表象を含み、前記表象が、異なる二次元画像フレームの重なり合った部分の対応するピクセルを結合することにより形成される、請求項3に記載の検査システム。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の二次元画像フレームのうちの別の二次元画像フレームと少なくとも部分的に、少なくともピクセルの単一の列において重なり合う、請求項1に記載の検査システム。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、実質的に、前記複数の画像フレームのうちの別の二次元画像フレームと重なり合う、請求項5に記載の検査システム。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、 実質的に前記複数の二次元画像フレームのうちの別の二次元画像フレームと重なり合うが、少なくともピクセルの単一の列は重ならない、請求項6に記載の検査システム。
- 対象物を検査する方法であって、
非連続的な照明で検査すべき対象物を照射することと、
前記検査すべき対象物の複数の少なくとも部分的に重なり合う二次元画像フレームを、あるフレーム速度で取得することと、
前記二次元画像フレームの重なり合った部分を結合することにより、前記検査すべき対象の表象を生成することと、
前記表象の検査に基づいて検査すべき前記対象物上の欠陥を報告することと、
を含み、
前記非連続な照明と前記フレーム速度での取得とが、概ね同期している、方法。 - 取得することが、CMOS集積回路上に配置された二次元の光センサアレイを用いて行われる、請求項8に記載の方法。
- 前記二次元画像フレームを取得することは、複数のディジタル画像を取得することを含み、各ディジタル画像が複数のピクセルにより構成されている、請求項8に記載の方法。
- 前記対象物の表象を生成することが、複数のピクセルで構成されたディジタル表象を生成することを含み、前記表象が、異なる二次元画像フレームの重なり合った部分における対応するピクセルを結合することにより生成される、請求項10に記載の方法。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の二次元画像フレームのうちの別の二次元画像フレームと、少なくとも部分的に、少なくともピクセルの単一の列において、重なり合う、請求項8に記載の方法。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の画像フレームのなかの別の二次元画像フレームとほぼ重なり合う、請求項12に記載の方法。
- 前記複数の二次元画像フレームのうちの各二次元画像フレームが、前記複数の二次元画像フレームのうちの別の二次元画像フレームとほぼ重なり合うが、少なくともピクセルの単一の列では重ならない、請求項13に記載の方法。
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US29976601P | 2001-06-22 | 2001-06-22 | |
US60/299,766 | 2001-06-22 |
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JP2003507534A Division JP2005520123A (ja) | 2001-06-22 | 2002-06-23 | メモリ集積化を用いる高感度光走査 |
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JP2008241718A true JP2008241718A (ja) | 2008-10-09 |
JP4966243B2 JP4966243B2 (ja) | 2012-07-04 |
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JP2003507534A Pending JP2005520123A (ja) | 2001-06-22 | 2002-06-23 | メモリ集積化を用いる高感度光走査 |
JP2008106077A Expired - Fee Related JP4966242B2 (ja) | 2001-06-22 | 2008-04-15 | メモリ集積化を用いる高感度光走査 |
JP2008106115A Expired - Fee Related JP4966243B2 (ja) | 2001-06-22 | 2008-04-15 | メモリ集積化を用いる高感度光走査 |
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JP2003507534A Pending JP2005520123A (ja) | 2001-06-22 | 2002-06-23 | メモリ集積化を用いる高感度光走査 |
JP2008106077A Expired - Fee Related JP4966242B2 (ja) | 2001-06-22 | 2008-04-15 | メモリ集積化を用いる高感度光走査 |
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US (8) | US7009163B2 (ja) |
JP (3) | JP2005520123A (ja) |
IL (1) | IL159200A0 (ja) |
TW (1) | TW583868B (ja) |
WO (1) | WO2003001189A1 (ja) |
Cited By (1)
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JP4966243B2 (ja) | 2012-07-04 |
JP2005520123A (ja) | 2005-07-07 |
US7897902B2 (en) | 2011-03-01 |
US8119969B2 (en) | 2012-02-21 |
US20060006311A1 (en) | 2006-01-12 |
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WO2003001189A1 (en) | 2003-01-03 |
US7417243B2 (en) | 2008-08-26 |
US9232114B2 (en) | 2016-01-05 |
US20120206634A1 (en) | 2012-08-16 |
US8536506B2 (en) | 2013-09-17 |
US20070012865A1 (en) | 2007-01-18 |
US20160094760A1 (en) | 2016-03-31 |
JP4966242B2 (ja) | 2012-07-04 |
US20080278775A1 (en) | 2008-11-13 |
US7009163B2 (en) | 2006-03-07 |
JP2008275611A (ja) | 2008-11-13 |
TW583868B (en) | 2004-04-11 |
US7129509B2 (en) | 2006-10-31 |
US20130329103A1 (en) | 2013-12-12 |
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