JP2008218440A - GaN系LED素子および発光装置 - Google Patents
GaN系LED素子および発光装置 Download PDFInfo
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- JP2008218440A JP2008218440A JP2007032965A JP2007032965A JP2008218440A JP 2008218440 A JP2008218440 A JP 2008218440A JP 2007032965 A JP2007032965 A JP 2007032965A JP 2007032965 A JP2007032965 A JP 2007032965A JP 2008218440 A JP2008218440 A JP 2008218440A
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- pad electrode
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- 239000000758 substrate Substances 0.000 claims description 68
- 239000004065 semiconductor Substances 0.000 claims description 28
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 6
- 230000031700 light absorption Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 153
- 229910002601 GaN Inorganic materials 0.000 description 77
- 239000010408 film Substances 0.000 description 77
- 238000000034 method Methods 0.000 description 38
- 239000000463 material Substances 0.000 description 14
- 239000010409 thin film Substances 0.000 description 11
- 239000013078 crystal Substances 0.000 description 9
- 238000001020 plasma etching Methods 0.000 description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 8
- 230000000694 effects Effects 0.000 description 8
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 239000010931 gold Substances 0.000 description 7
- 239000010936 titanium Substances 0.000 description 7
- 239000011701 zinc Substances 0.000 description 7
- 239000010949 copper Substances 0.000 description 6
- 239000012535 impurity Substances 0.000 description 6
- 230000001681 protective effect Effects 0.000 description 6
- 239000011777 magnesium Substances 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 238000002834 transmittance Methods 0.000 description 5
- 238000001771 vacuum deposition Methods 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005219 brazing Methods 0.000 description 4
- 238000000605 extraction Methods 0.000 description 4
- PQXKHYXIUOZZFA-UHFFFAOYSA-M lithium fluoride Chemical compound [Li+].[F-] PQXKHYXIUOZZFA-UHFFFAOYSA-M 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 229910052814 silicon oxide Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 229910052596 spinel Inorganic materials 0.000 description 4
- 239000011029 spinel Substances 0.000 description 4
- 229910052719 titanium Inorganic materials 0.000 description 4
- 229910052725 zinc Inorganic materials 0.000 description 4
- 239000011787 zinc oxide Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 229910005540 GaP Inorganic materials 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000004888 barrier function Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 229910001195 gallium oxide Inorganic materials 0.000 description 3
- HZXMRANICFIONG-UHFFFAOYSA-N gallium phosphide Chemical compound [Ga]#P HZXMRANICFIONG-UHFFFAOYSA-N 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 3
- 238000009832 plasma treatment Methods 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 3
- 229910052721 tungsten Inorganic materials 0.000 description 3
- 239000010937 tungsten Substances 0.000 description 3
- 229910002704 AlGaN Inorganic materials 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 2
- 229910052581 Si3N4 Inorganic materials 0.000 description 2
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 229910052797 bismuth Inorganic materials 0.000 description 2
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 description 2
- 238000005253 cladding Methods 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 230000005496 eutectics Effects 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 2
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 2
- 229910001512 metal fluoride Inorganic materials 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000001451 molecular beam epitaxy Methods 0.000 description 2
- 238000001579 optical reflectometry Methods 0.000 description 2
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 description 2
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 2
- 229910052594 sapphire Inorganic materials 0.000 description 2
- 239000010980 sapphire Substances 0.000 description 2
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 2
- 239000002893 slag Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001936 tantalum oxide Inorganic materials 0.000 description 2
- 229910052720 vanadium Inorganic materials 0.000 description 2
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- 229910001928 zirconium oxide Inorganic materials 0.000 description 2
- QYEXBYZXHDUPRC-UHFFFAOYSA-N B#[Ti]#B Chemical compound B#[Ti]#B QYEXBYZXHDUPRC-UHFFFAOYSA-N 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 229920006223 adhesive resin Polymers 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- 238000002248 hydride vapour-phase epitaxy Methods 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000007735 ion beam assisted deposition Methods 0.000 description 1
- 238000007733 ion plating Methods 0.000 description 1
- 229910052741 iridium Inorganic materials 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 229910052762 osmium Inorganic materials 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000001902 propagating effect Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000005546 reactive sputtering Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007032965A JP2008218440A (ja) | 2007-02-09 | 2007-02-14 | GaN系LED素子および発光装置 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007031354 | 2007-02-09 | ||
| JP2007032965A JP2008218440A (ja) | 2007-02-09 | 2007-02-14 | GaN系LED素子および発光装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2008218440A true JP2008218440A (ja) | 2008-09-18 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007032965A Pending JP2008218440A (ja) | 2007-02-09 | 2007-02-14 | GaN系LED素子および発光装置 |
| JP2007057110A Pending JP2008218878A (ja) | 2007-02-09 | 2007-03-07 | GaN系LED素子および発光装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007057110A Pending JP2008218878A (ja) | 2007-02-09 | 2007-03-07 | GaN系LED素子および発光装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (2) | JP2008218440A (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010219521A (ja) * | 2009-03-13 | 2010-09-30 | Lg Innotek Co Ltd | 発光素子及びその製造方法 |
| JP2012511249A (ja) * | 2008-12-04 | 2012-05-17 | エピヴァレー カンパニー リミテッド | 半導体発光素子 |
| TWI453955B (zh) * | 2008-12-25 | 2014-09-21 | 豐田合成股份有限公司 | 半導體發光元件及半導體發光元件之製造方法、燈 |
| KR101750397B1 (ko) * | 2009-06-30 | 2017-06-23 | 루미레즈 엘엘씨 | Ⅲ-p 반도체 발광 장치용 p-콘택층 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010131458A1 (ja) | 2009-05-14 | 2010-11-18 | 昭和電工株式会社 | 半導体発光素子、その製造方法、ランプ、照明装置、電子機器、機械装置、及び電極 |
| JP2010267797A (ja) * | 2009-05-14 | 2010-11-25 | Showa Denko Kk | 半導体発光素子、ランプ、照明装置、電子機器及び電極 |
| JP5793292B2 (ja) * | 2010-02-17 | 2015-10-14 | 豊田合成株式会社 | 半導体発光素子 |
| KR101039939B1 (ko) | 2010-04-28 | 2011-06-09 | 엘지이노텍 주식회사 | 발광소자, 발광소자의 제조방법, 발광소자 패키지 및 이를 포함하는 조명시스템 |
| KR20120015651A (ko) | 2010-08-12 | 2012-02-22 | 서울옵토디바이스주식회사 | 개선된 광 추출 효율을 갖는 발광 다이오드 |
| JP5258853B2 (ja) | 2010-08-17 | 2013-08-07 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| JP5479391B2 (ja) * | 2011-03-08 | 2014-04-23 | 株式会社東芝 | 半導体発光素子及びその製造方法 |
| JP2015109332A (ja) * | 2013-12-04 | 2015-06-11 | シャープ株式会社 | 半導体発光素子 |
| JP6711588B2 (ja) * | 2015-10-29 | 2020-06-17 | 旭化成株式会社 | 窒化物半導体発光素子及び窒化物半導体発光装置 |
| CN106159075B (zh) * | 2016-09-05 | 2018-11-27 | 江苏新广联半导体有限公司 | 一种具有低热阻绝缘层结构的倒装led芯片及制作方法 |
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| JPH10242516A (ja) * | 1997-02-21 | 1998-09-11 | Sharp Corp | 窒化ガリウム系化合物半導体発光素子及びその製造方法 |
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| JP2000077726A (ja) * | 1998-08-27 | 2000-03-14 | Seiwa Electric Mfg Co Ltd | 半導体素子とその製造方法 |
| JP2004193338A (ja) * | 2002-12-11 | 2004-07-08 | Sharp Corp | 窒化物系化合物半導体発光素子およびその製造方法 |
| JP2005045038A (ja) * | 2003-07-23 | 2005-02-17 | Nichia Chem Ind Ltd | 窒化物半導体発光素子 |
| JP2006013034A (ja) * | 2004-06-24 | 2006-01-12 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子及び半導体発光素子の製造方法 |
| JP2006120927A (ja) * | 2004-10-22 | 2006-05-11 | Sharp Corp | 発光ダイオード及びその製造方法 |
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| JP5143977B2 (ja) * | 2000-11-09 | 2013-02-13 | 星和電機株式会社 | 窒化ガリウム系化合物半導体発光素子及びその製造方法 |
| JP2003017748A (ja) * | 2001-06-27 | 2003-01-17 | Seiwa Electric Mfg Co Ltd | 窒化ガリウム系化合物半導体発光素子及びその製造方法 |
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- 2007-02-14 JP JP2007032965A patent/JP2008218440A/ja active Pending
- 2007-03-07 JP JP2007057110A patent/JP2008218878A/ja active Pending
Patent Citations (7)
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| JPH10242516A (ja) * | 1997-02-21 | 1998-09-11 | Sharp Corp | 窒化ガリウム系化合物半導体発光素子及びその製造方法 |
| WO1998042030A1 (fr) * | 1997-03-19 | 1998-09-24 | Sharp Kabushiki Kaisha | Element emetteur de lumiere semi-conducteur |
| JP2000077726A (ja) * | 1998-08-27 | 2000-03-14 | Seiwa Electric Mfg Co Ltd | 半導体素子とその製造方法 |
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| JP2006013034A (ja) * | 2004-06-24 | 2006-01-12 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子及び半導体発光素子の製造方法 |
| JP2006120927A (ja) * | 2004-10-22 | 2006-05-11 | Sharp Corp | 発光ダイオード及びその製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012511249A (ja) * | 2008-12-04 | 2012-05-17 | エピヴァレー カンパニー リミテッド | 半導体発光素子 |
| TWI453955B (zh) * | 2008-12-25 | 2014-09-21 | 豐田合成股份有限公司 | 半導體發光元件及半導體發光元件之製造方法、燈 |
| US8969905B2 (en) | 2008-12-25 | 2015-03-03 | Toyoda Gosei Co., Ltd. | Semiconductor light emitting device and method for manufacturing semiconductor light emitting device, and lamp |
| JP2010219521A (ja) * | 2009-03-13 | 2010-09-30 | Lg Innotek Co Ltd | 発光素子及びその製造方法 |
| KR101750397B1 (ko) * | 2009-06-30 | 2017-06-23 | 루미레즈 엘엘씨 | Ⅲ-p 반도체 발광 장치용 p-콘택층 |
| KR20170075018A (ko) * | 2009-06-30 | 2017-06-30 | 루미레즈 엘엘씨 | Ⅲ-p 반도체 발광 장치용 p-콘택층 |
| KR101886733B1 (ko) | 2009-06-30 | 2018-08-09 | 루미리즈 홀딩 비.브이. | Ⅲ-p 반도체 발광 장치용 p-콘택층 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008218878A (ja) | 2008-09-18 |
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