JP2008160160A - 配線基板および半導体装置 - Google Patents

配線基板および半導体装置 Download PDF

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Publication number
JP2008160160A
JP2008160160A JP2008075704A JP2008075704A JP2008160160A JP 2008160160 A JP2008160160 A JP 2008160160A JP 2008075704 A JP2008075704 A JP 2008075704A JP 2008075704 A JP2008075704 A JP 2008075704A JP 2008160160 A JP2008160160 A JP 2008160160A
Authority
JP
Japan
Prior art keywords
capacitor
layer
wiring
wiring board
cavity
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2008075704A
Other languages
English (en)
Japanese (ja)
Other versions
JP2008160160A5 (https=
Inventor
Hiroyuki Nishikawa
洋行 西川
Shigeo Tanahashi
成夫 棚橋
Katsura Hayashi
桂 林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Original Assignee
Kyocera Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp filed Critical Kyocera Corp
Priority to JP2008075704A priority Critical patent/JP2008160160A/ja
Publication of JP2008160160A publication Critical patent/JP2008160160A/ja
Publication of JP2008160160A5 publication Critical patent/JP2008160160A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/185—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components encapsulated in the insulating substrate of the PCBs; associated with components incorporated in internal layers of multilayer circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]
    • H05K1/183—Printed circuits structurally associated with non-printed electric components associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC] associated with components mounted in and supported by recessed areas of the PCBs
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4602—Manufacturing multilayer circuits characterized by a special circuit board as base or central core whereon additional circuit layers are built or additional circuit boards are laminated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/90—Bond pads, in general
    • H10W72/941—Dispositions of bond pads
    • H10W72/9415—Dispositions of bond pads relative to the surface, e.g. recessed, protruding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/728—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked discrete passive device, e.g. resistors, capacitors or inductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
JP2008075704A 2003-08-28 2008-03-24 配線基板および半導体装置 Pending JP2008160160A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008075704A JP2008160160A (ja) 2003-08-28 2008-03-24 配線基板および半導体装置

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003304518 2003-08-28
JP2003304519 2003-08-28
JP2003337504 2003-09-29
JP2008075704A JP2008160160A (ja) 2003-08-28 2008-03-24 配線基板および半導体装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2004249091A Division JP2005129899A (ja) 2003-08-28 2004-08-27 配線基板および半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2011023844A Division JP5404668B2 (ja) 2003-08-28 2011-02-07 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2008160160A true JP2008160160A (ja) 2008-07-10
JP2008160160A5 JP2008160160A5 (https=) 2008-12-25

Family

ID=34527574

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2008075704A Pending JP2008160160A (ja) 2003-08-28 2008-03-24 配線基板および半導体装置
JP2011023844A Expired - Fee Related JP5404668B2 (ja) 2003-08-28 2011-02-07 半導体装置の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2011023844A Expired - Fee Related JP5404668B2 (ja) 2003-08-28 2011-02-07 半導体装置の製造方法

Country Status (2)

Country Link
US (2) US7271476B2 (https=)
JP (2) JP2008160160A (https=)

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JP4185499B2 (ja) * 2005-02-18 2008-11-26 富士通マイクロエレクトロニクス株式会社 半導体装置
US7999299B2 (en) * 2005-06-23 2011-08-16 Samsung Electronics Co., Ltd. Semiconductor memory device having capacitor for peripheral circuit
WO2007000578A2 (en) * 2005-06-25 2007-01-04 Omni-Id Limited Electromagnetic radiation decoupler
US7292450B2 (en) * 2006-01-31 2007-11-06 Microsoft Corporation High density surface mount part array layout and assembly technique
GB0611983D0 (en) 2006-06-16 2006-07-26 Qinetiq Ltd Electromagnetic radiation decoupler
JP5183893B2 (ja) * 2006-08-01 2013-04-17 新光電気工業株式会社 配線基板及びその製造方法、及び半導体装置
KR100840790B1 (ko) * 2006-11-29 2008-06-23 삼성전자주식회사 반도체 모듈 및 그의 제조 방법
GB0624915D0 (en) * 2006-12-14 2007-01-24 Qinetiq Ltd Switchable radiation decoupling
GB0625342D0 (en) * 2006-12-20 2007-01-24 Qinetiq Ltd Radiation decoupling
TWI452661B (zh) * 2007-01-30 2014-09-11 全懋精密科技股份有限公司 線路直接連接晶片之封裝結構
US20080217748A1 (en) * 2007-03-08 2008-09-11 International Business Machines Corporation Low cost and low coefficient of thermal expansion packaging structures and processes
US20080239685A1 (en) * 2007-03-27 2008-10-02 Tadahiko Kawabe Capacitor built-in wiring board
TW200906263A (en) * 2007-05-29 2009-02-01 Matsushita Electric Industrial Co Ltd Circuit board and method for manufacturing the same
EP2259669A4 (en) * 2008-03-24 2011-12-28 Ngk Spark Plug Co COMPONENT WITH PCB
JP4811437B2 (ja) * 2008-08-11 2011-11-09 日本テキサス・インスツルメンツ株式会社 Ｉｃチップ上への電子部品の実装
US8794533B2 (en) * 2008-08-20 2014-08-05 Omni-Id Cayman Limited One and two-part printable EM tags
US10283443B2 (en) * 2009-11-10 2019-05-07 Taiwan Semiconductor Manufacturing Co., Ltd. Chip package having integrated capacitor
KR101710178B1 (ko) * 2010-06-29 2017-02-24 삼성전자 주식회사 임베디이드 칩 온 칩 패키지 및 이를 포함하는 패키지 온 패키지
TWI504322B (zh) * 2012-03-29 2015-10-11 Taiwan Green Point Entpr Co 雙面電路板及其製備方法
JP5474127B2 (ja) * 2012-05-14 2014-04-16 株式会社野田スクリーン 半導体装置
US20130313720A1 (en) * 2012-05-25 2013-11-28 Leilei Zhang Packaging substrate with reliable via structure
US9035194B2 (en) * 2012-10-30 2015-05-19 Intel Corporation Circuit board with integrated passive devices
US20140167900A1 (en) 2012-12-14 2014-06-19 Gregorio R. Murtagian Surface-mount inductor structures for forming one or more inductors with substrate traces
US9337182B2 (en) * 2012-12-28 2016-05-10 Taiwan Semiconductor Manufacturing Co., Ltd. Method to integrate different function devices fabricated by different process technologies
TWI578451B (zh) * 2013-05-22 2017-04-11 野田士克林股份有限公司 Semiconductor device
KR101863462B1 (ko) * 2013-08-21 2018-05-31 인텔 코포레이션 범프리스 빌드업 층을 위한 범프리스 다이 패키지 인터페이스
KR102052761B1 (ko) * 2013-11-21 2019-12-09 삼성전기주식회사 칩 내장 기판 및 그 제조 방법
US9345142B2 (en) * 2013-11-21 2016-05-17 Samsung Electro-Mechanics Co., Ltd. Chip embedded board and method of manufacturing the same
TWI526129B (zh) * 2014-11-05 2016-03-11 Elite Material Co Ltd Multilayer printed circuit boards with dimensional stability
US20170170109A1 (en) * 2015-06-25 2017-06-15 Intel Corporation Integrated circuit structures with interposers having recesses
CN107646141A (zh) 2015-06-25 2018-01-30 英特尔公司 用于堆叠封装的具有凹陷导电接触部的集成电路结构
US10159152B2 (en) * 2015-12-21 2018-12-18 Intel Corporation Development of the advanced component in cavity technology
WO2018063150A1 (en) * 2016-09-27 2018-04-05 Intel Corporation Frame embedded components
US10672715B2 (en) 2018-04-16 2020-06-02 Amkor Technology, Inc. Semiconductor package using cavity substrate and manufacturing methods
DE102018127075B4 (de) * 2018-10-30 2021-12-30 Auto-Kabel Management Gmbh Hochstromschaltung
US11710726B2 (en) 2019-06-25 2023-07-25 Microsoft Technology Licensing, Llc Through-board power control arrangements for integrated circuit devices
US11444400B2 (en) * 2020-12-21 2022-09-13 Dell Products L.P. Information handling system with a printed circuit board having an embedded interconnect

Citations (5)

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JPH09321442A (ja) * 1996-05-30 1997-12-12 Nec Corp 高周波デバイス用多層配線基板
JPH11317490A (ja) * 1997-10-16 1999-11-16 Hitachi Ltd 半導体素子搭載基板
JP2000349225A (ja) * 1999-03-30 2000-12-15 Ngk Spark Plug Co Ltd コンデンサ付属配線基板、配線基板、及びコンデンサ
JP2002084071A (ja) * 2000-06-22 2002-03-22 Ngk Spark Plug Co Ltd 配線基板
JP2002348441A (ja) * 2000-12-26 2002-12-04 Ngk Spark Plug Co Ltd 埋め込み樹脂及びそれを用いた配線基板

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JP2544976B2 (ja) * 1989-09-08 1996-10-16 三菱電機株式会社 半導体集積回路モジュ―ル
US5034850A (en) 1990-02-12 1991-07-23 Rogers Corporation Thin decoupling capacitor for mounting under integrated circuit package
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JP2001345234A (ja) 2000-03-29 2001-12-14 Kyocera Corp 薄膜電子部品および積層薄膜電子部品並びに基板
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Patent Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH09321442A (ja) * 1996-05-30 1997-12-12 Nec Corp 高周波デバイス用多層配線基板
JPH11317490A (ja) * 1997-10-16 1999-11-16 Hitachi Ltd 半導体素子搭載基板
JP2000349225A (ja) * 1999-03-30 2000-12-15 Ngk Spark Plug Co Ltd コンデンサ付属配線基板、配線基板、及びコンデンサ
JP2002084071A (ja) * 2000-06-22 2002-03-22 Ngk Spark Plug Co Ltd 配線基板
JP2002348441A (ja) * 2000-12-26 2002-12-04 Ngk Spark Plug Co Ltd 埋め込み樹脂及びそれを用いた配線基板

Also Published As

Publication number Publication date
US7271476B2 (en) 2007-09-18
US20050087850A1 (en) 2005-04-28
US20070285907A1 (en) 2007-12-13
JP5404668B2 (ja) 2014-02-05
JP2011091448A (ja) 2011-05-06

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