JP2008156474A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008156474A5 JP2008156474A5 JP2006346865A JP2006346865A JP2008156474A5 JP 2008156474 A5 JP2008156474 A5 JP 2008156474A5 JP 2006346865 A JP2006346865 A JP 2006346865A JP 2006346865 A JP2006346865 A JP 2006346865A JP 2008156474 A5 JP2008156474 A5 JP 2008156474A5
- Authority
- JP
- Japan
- Prior art keywords
- mass
- parts
- formula
- curable silicone
- silicone composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 14
- 229920001296 polysiloxane Polymers 0.000 claims description 12
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000000962 organic group Chemical group 0.000 claims 2
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 1
- 125000005375 organosiloxane group Chemical group 0.000 claims 1
- 239000002245 particle Substances 0.000 description 8
- 239000007822 coupling agent Substances 0.000 description 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000002775 capsule Substances 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 2
- 239000004205 dimethyl polysiloxane Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical group C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical group CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 1
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006346865A JP5238157B2 (ja) | 2006-12-25 | 2006-12-25 | 硬化性シリコーン組成物および電子部品 |
| TW096146566A TWI426106B (zh) | 2006-12-25 | 2007-12-06 | 可固化之聚矽氧組合物及電子組件 |
| DE602007006345T DE602007006345D1 (de) | 2006-12-25 | 2007-12-14 | Härtbare silikonzusammensetzung und elektronikbauteil |
| KR1020097013185A KR101410337B1 (ko) | 2006-12-25 | 2007-12-14 | 경화성 실리콘 조성물 및 전자 부품 |
| US12/520,899 US7994246B2 (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition and electronic component |
| PCT/JP2007/074607 WO2008078663A1 (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition and electronic component |
| CN2007800469756A CN101563425B (zh) | 2006-12-25 | 2007-12-14 | 可固化的硅氧烷组合物和电子组件 |
| MYPI20092673A MY148111A (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition and electronic component |
| EP07851014A EP2099867B1 (en) | 2006-12-25 | 2007-12-14 | Curable silicone composition and electronic component |
| AT07851014T ATE466903T1 (de) | 2006-12-25 | 2007-12-14 | Härtbare silikonzusammensetzung und elektronikbauteil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006346865A JP5238157B2 (ja) | 2006-12-25 | 2006-12-25 | 硬化性シリコーン組成物および電子部品 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008156474A JP2008156474A (ja) | 2008-07-10 |
| JP2008156474A5 true JP2008156474A5 (cg-RX-API-DMAC7.html) | 2011-02-17 |
| JP5238157B2 JP5238157B2 (ja) | 2013-07-17 |
Family
ID=39135290
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006346865A Expired - Fee Related JP5238157B2 (ja) | 2006-12-25 | 2006-12-25 | 硬化性シリコーン組成物および電子部品 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7994246B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2099867B1 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5238157B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR101410337B1 (cg-RX-API-DMAC7.html) |
| CN (1) | CN101563425B (cg-RX-API-DMAC7.html) |
| AT (1) | ATE466903T1 (cg-RX-API-DMAC7.html) |
| DE (1) | DE602007006345D1 (cg-RX-API-DMAC7.html) |
| MY (1) | MY148111A (cg-RX-API-DMAC7.html) |
| TW (1) | TWI426106B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2008078663A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4931366B2 (ja) * | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5207591B2 (ja) * | 2006-02-23 | 2013-06-12 | 東レ・ダウコーニング株式会社 | 半導体装置の製造方法および半導体装置 |
| JP5285846B2 (ja) * | 2006-09-11 | 2013-09-11 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP5547369B2 (ja) * | 2007-09-28 | 2014-07-09 | 東レ・ダウコーニング株式会社 | 硬化性液状エポキシ樹脂組成物およびその硬化物 |
| KR101195674B1 (ko) * | 2009-01-29 | 2012-10-30 | 야마하 가부시키가이샤 | 열교환 유닛 |
| US20130338265A1 (en) * | 2010-12-27 | 2013-12-19 | Dow Corning Toray Co., Ltd. | Curable Epoxy Resin Composition |
| KR101518104B1 (ko) | 2011-06-17 | 2015-05-06 | 주식회사 엘지화학 | 경화성 조성물 |
| US9902855B2 (en) | 2012-12-07 | 2018-02-27 | Cheil Industries, Inc. | Curable polysiloxane composition for optical device, encapsulating material and optical device |
| KR101556274B1 (ko) | 2012-12-28 | 2015-09-30 | 제일모직 주식회사 | 봉지재 조성물, 봉지재 및 전자 소자 |
| US20180016475A1 (en) * | 2015-01-21 | 2018-01-18 | Shin-Etsu Chemical Co., Ltd. | Room temperature-curable organopolysiloxane composition |
| US9659844B2 (en) * | 2015-08-31 | 2017-05-23 | Texas Instruments Incorporated | Semiconductor die substrate with integral heat sink |
| TWI871377B (zh) * | 2019-12-18 | 2025-02-01 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| JP7321081B2 (ja) * | 2019-12-26 | 2023-08-04 | 株式会社藤商事 | 遊技機 |
| US12302491B2 (en) | 2022-03-31 | 2025-05-13 | University Of Massachusetts | Electrical system with hook-and-loop busbars |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3251655B2 (ja) | 1992-08-05 | 2002-01-28 | 東レ・ダウコーニング・シリコーン株式会社 | ジオルガノポリシロキサンおよびその製造方法 |
| DE60013527T2 (de) * | 1999-03-11 | 2005-09-22 | Toray Industries, Inc. | Expoxidharzzusammensetzung, expoxidharzzusammensetzung für faserverstärkte verbundwerkstoffe und diese enthaltende faserverstärkte verbundstoffe |
| US6512031B1 (en) * | 1999-04-15 | 2003-01-28 | Shin-Etsu Chemical Co., Ltd. | Epoxy resin composition, laminate film using the same, and semiconductor device |
| JP3796648B2 (ja) | 1999-04-15 | 2006-07-12 | 信越化学工業株式会社 | エポキシ樹脂組成物並びにこのエポキシ樹脂組成物を用いた積層フィルム及び半導体装置 |
| TWI345576B (en) | 2003-11-07 | 2011-07-21 | Dow Corning Toray Silicone | Curable silicone composition and cured product thereof |
| JP2005146104A (ja) * | 2003-11-14 | 2005-06-09 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
| JP5166677B2 (ja) * | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP2006316250A (ja) * | 2005-04-12 | 2006-11-24 | Shin Etsu Chem Co Ltd | 液状エポキシ樹脂組成物及び半導体装置 |
| JP5004433B2 (ja) | 2005-04-27 | 2012-08-22 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物およびその硬化物 |
| JP4931366B2 (ja) * | 2005-04-27 | 2012-05-16 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
| JP4017645B2 (ja) * | 2005-12-22 | 2007-12-05 | 横浜ゴム株式会社 | 湿気硬化性樹脂組成物 |
-
2006
- 2006-12-25 JP JP2006346865A patent/JP5238157B2/ja not_active Expired - Fee Related
-
2007
- 2007-12-06 TW TW096146566A patent/TWI426106B/zh not_active IP Right Cessation
- 2007-12-14 EP EP07851014A patent/EP2099867B1/en not_active Not-in-force
- 2007-12-14 KR KR1020097013185A patent/KR101410337B1/ko not_active Expired - Fee Related
- 2007-12-14 US US12/520,899 patent/US7994246B2/en not_active Expired - Fee Related
- 2007-12-14 DE DE602007006345T patent/DE602007006345D1/de active Active
- 2007-12-14 CN CN2007800469756A patent/CN101563425B/zh not_active Expired - Fee Related
- 2007-12-14 MY MYPI20092673A patent/MY148111A/en unknown
- 2007-12-14 AT AT07851014T patent/ATE466903T1/de not_active IP Right Cessation
- 2007-12-14 WO PCT/JP2007/074607 patent/WO2008078663A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101142280B (zh) | 可固化的有机硅组合物和由其生产的电子器件 | |
| JP5283346B2 (ja) | 熱伝導性硬化物及びその製造方法 | |
| KR101696485B1 (ko) | 열 계면 물질 | |
| JP5304588B2 (ja) | 熱伝導性シリコーン組成物及びその硬化物 | |
| JP2004352947A (ja) | 室温硬化型熱伝導性シリコーンゴム組成物 | |
| JP6202475B2 (ja) | 熱伝導性複合シリコーンゴムシート | |
| JP5004433B2 (ja) | 硬化性シリコーン組成物およびその硬化物 | |
| JP2008156474A5 (cg-RX-API-DMAC7.html) | ||
| KR20090057244A (ko) | 경화성 실리콘 조성물 및 전자 부품 | |
| KR20160084808A (ko) | 열전도성 실리콘 조성물 및 경화물, 및 복합 시트 | |
| TW201428057A (zh) | 熱傳導性聚矽氧組合物及熱傳導性部件 | |
| JP6314915B2 (ja) | 放熱パテシート | |
| JP2013222836A (ja) | 放熱性及びリワーク性に優れる電子装置及びその製造方法 | |
| WO2020217634A1 (ja) | 熱伝導性シリコーン組成物及びその製造方法、並びに熱伝導性シリコーン硬化物 | |
| JP2021503017A (ja) | 熱伝導性組成物 | |
| US20160040048A1 (en) | Liquid epoxy resin composition and adhesive agent for heatsink and stiffener | |
| WO2021225059A1 (ja) | 熱伝導性シリコーン組成物及びその硬化物 | |
| JP4787128B2 (ja) | 室温硬化型熱伝導性シリコーンゴム組成物 | |
| JP4931366B2 (ja) | 硬化性シリコーン組成物および電子部品 | |
| JP2017039802A (ja) | 半導体素子保護用材料及び半導体装置 | |
| JP5238157B2 (ja) | 硬化性シリコーン組成物および電子部品 | |
| TW201821544A (zh) | 熱傳導性聚矽氧樹脂組成物及其硬化方法 | |
| CN112714784B (zh) | 导热性有机硅组合物及其固化物 | |
| JP2011138857A (ja) | 放熱性及びリワーク性に優れる電子装置の製造方法及び電子装置 | |
| JP6985166B2 (ja) | 放熱性樹脂組成物 |