JP2008081676A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2008081676A5 JP2008081676A5 JP2006265955A JP2006265955A JP2008081676A5 JP 2008081676 A5 JP2008081676 A5 JP 2008081676A5 JP 2006265955 A JP2006265955 A JP 2006265955A JP 2006265955 A JP2006265955 A JP 2006265955A JP 2008081676 A5 JP2008081676 A5 JP 2008081676A5
- Authority
- JP
- Japan
- Prior art keywords
- sio
- nmr
- component
- group
- single bond
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- -1 n-decyl group Chemical group 0.000 description 18
- 229920005645 diorganopolysiloxane polymer Polymers 0.000 description 10
- 238000005481 NMR spectroscopy Methods 0.000 description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 6
- 229920000647 polyepoxide Polymers 0.000 description 6
- 229920001296 polysiloxane Polymers 0.000 description 6
- 238000001644 13C nuclear magnetic resonance spectroscopy Methods 0.000 description 5
- 238000005160 1H NMR spectroscopy Methods 0.000 description 5
- 229910004283 SiO 4 Inorganic materials 0.000 description 5
- 238000012916 structural analysis Methods 0.000 description 5
- 238000004458 analytical method Methods 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- MXRIRQGCELJRSN-UHFFFAOYSA-N O.O.O.[Al] Chemical compound O.O.O.[Al] MXRIRQGCELJRSN-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000002775 capsule Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006265955A JP5388409B2 (ja) | 2006-09-28 | 2006-09-28 | 硬化性シリコーン組成物およびその硬化物 |
| TW096130215A TWI432520B (zh) | 2006-09-28 | 2007-08-15 | 可固化之聚矽氧組合物及其固化體 |
| US12/443,286 US20100022704A1 (en) | 2006-09-28 | 2007-09-05 | Curable Silicone Composition And Cured Body Thereof |
| PCT/JP2007/067770 WO2008041459A1 (en) | 2006-09-28 | 2007-09-05 | Curable silicone composition and cured body thereof |
| KR1020097006458A KR101383128B1 (ko) | 2006-09-28 | 2007-09-05 | 경화성 실리콘 조성물 및 이의 경화물 |
| CN2007800345804A CN101517004B (zh) | 2006-09-28 | 2007-09-05 | 可固化的硅氧烷组合物及其固化体 |
| EP07807177.6A EP2079802B1 (en) | 2006-09-28 | 2007-09-05 | Curable silicone composition and cured body thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006265955A JP5388409B2 (ja) | 2006-09-28 | 2006-09-28 | 硬化性シリコーン組成物およびその硬化物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2008081676A JP2008081676A (ja) | 2008-04-10 |
| JP2008081676A5 true JP2008081676A5 (enExample) | 2009-10-15 |
| JP5388409B2 JP5388409B2 (ja) | 2014-01-15 |
Family
ID=38874981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006265955A Expired - Fee Related JP5388409B2 (ja) | 2006-09-28 | 2006-09-28 | 硬化性シリコーン組成物およびその硬化物 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20100022704A1 (enExample) |
| EP (1) | EP2079802B1 (enExample) |
| JP (1) | JP5388409B2 (enExample) |
| KR (1) | KR101383128B1 (enExample) |
| CN (1) | CN101517004B (enExample) |
| TW (1) | TWI432520B (enExample) |
| WO (1) | WO2008041459A1 (enExample) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012057000A (ja) * | 2010-09-07 | 2012-03-22 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物、半導体装置の封止材、及び半導体装置 |
| KR101376999B1 (ko) * | 2012-06-28 | 2014-03-26 | 장암칼스 주식회사 | 전자 소자 절연 봉지용 실리콘 조성물 |
| CA2902802A1 (en) * | 2013-02-28 | 2014-09-04 | Hoya Corporation | Method for manufacturing spectacle lens and coating solution coating apparatus for spectacle lens substrate |
| EP3023467B1 (de) * | 2014-11-20 | 2017-05-10 | BYK-Chemie GmbH | Formmasse, thermoplast oder beschichtungsmittel enthaltend polysiloxane als anti-adhäsive und schmutzabweisende zusätze |
| KR20220110767A (ko) | 2019-11-29 | 2022-08-09 | 쇼와덴코머티리얼즈가부시끼가이샤 | 폴리옥시알킬렌쇄를 갖는 화합물을 함유하는 조성물 세트 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195129A (ja) * | 1985-02-22 | 1986-08-29 | Toray Silicone Co Ltd | 有機けい素重合体の製造方法 |
| US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
| US5102960A (en) * | 1989-09-11 | 1992-04-07 | Bayer Aktiengesellschaft | Silicon-epoxy resin composition |
| US5206312A (en) * | 1989-11-20 | 1993-04-27 | The Dow Chemical Company | Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof |
| US5362775A (en) * | 1991-03-27 | 1994-11-08 | Nippondenso Co., Ltd. | Epoxy resin composition and cured product thereof |
| JP3161786B2 (ja) * | 1991-11-20 | 2001-04-25 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| JP3367964B2 (ja) * | 1992-04-21 | 2003-01-20 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| JP3251655B2 (ja) * | 1992-08-05 | 2002-01-28 | 東レ・ダウコーニング・シリコーン株式会社 | ジオルガノポリシロキサンおよびその製造方法 |
| JP3406646B2 (ja) * | 1993-06-29 | 2003-05-12 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| JP3466239B2 (ja) * | 1993-08-18 | 2003-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US6069201A (en) * | 1997-09-12 | 2000-05-30 | Shin-Etsu Chemical Co., Ltd. | Zinc oxide-filled addition-curable silicone rubber compositions |
| JP4727017B2 (ja) * | 1999-11-15 | 2011-07-20 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP2002020586A (ja) * | 2000-07-05 | 2002-01-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JP5166677B2 (ja) * | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
-
2006
- 2006-09-28 JP JP2006265955A patent/JP5388409B2/ja not_active Expired - Fee Related
-
2007
- 2007-08-15 TW TW096130215A patent/TWI432520B/zh not_active IP Right Cessation
- 2007-09-05 CN CN2007800345804A patent/CN101517004B/zh not_active Expired - Fee Related
- 2007-09-05 WO PCT/JP2007/067770 patent/WO2008041459A1/en not_active Ceased
- 2007-09-05 US US12/443,286 patent/US20100022704A1/en not_active Abandoned
- 2007-09-05 KR KR1020097006458A patent/KR101383128B1/ko not_active Expired - Fee Related
- 2007-09-05 EP EP07807177.6A patent/EP2079802B1/en not_active Not-in-force
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5304588B2 (ja) | 熱伝導性シリコーン組成物及びその硬化物 | |
| JP5247979B2 (ja) | 透明な硬化物を与えるポリオルガノシロキサン組成物 | |
| KR102477726B1 (ko) | 충전제를 포함하는 실리콘 조성물 | |
| JP5422109B2 (ja) | 硬化性シリコーン組成物およびその硬化物 | |
| JP2018119167A (ja) | 硬化性シリコーン組成物 | |
| TW201816071A (zh) | 熱傳導性聚有機矽氧烷組成物 | |
| JP5004433B2 (ja) | 硬化性シリコーン組成物およびその硬化物 | |
| JP2013535561A5 (enExample) | ||
| US20160369150A1 (en) | Single crystal alumina filled die attach paste | |
| JP2008063542A5 (enExample) | ||
| TW200948846A (en) | Epoxy-silicon mixed resin composition for sealing of light semiconductor element and transfer molding plate formed thereof | |
| JP2016503236A (ja) | 電子デバイスの製造方法 | |
| JP2006306954A5 (enExample) | ||
| TW201248938A (en) | Silicone composition for sealing semiconductor | |
| JP2008081676A5 (enExample) | ||
| JP2008156474A5 (enExample) | ||
| JP2009040989A5 (enExample) | ||
| TW201821544A (zh) | 熱傳導性聚矽氧樹脂組成物及其硬化方法 | |
| MY155700A (en) | Organopolysiloxane, method of manufacturing thereof, curable silicone composition, and cured product thereof | |
| CN101517004B (zh) | 可固化的硅氧烷组合物及其固化体 | |
| JP2018184525A (ja) | 低温硬化型液状エポキシ樹脂組成物 | |
| KR20140049477A (ko) | 열전도성 수지 조성물 | |
| CN1944441A (zh) | 含苯并噁嗪基团的倍半硅氧烷和其组合物及制备方法 | |
| CN102167908B (zh) | 一种有机聚硅氧烷组合物、其固化方法及其应用 | |
| TWI818154B (zh) | 非硬化型導熱性矽氧組成物 |