TWI432520B - 可固化之聚矽氧組合物及其固化體 - Google Patents
可固化之聚矽氧組合物及其固化體 Download PDFInfo
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- TWI432520B TWI432520B TW096130215A TW96130215A TWI432520B TW I432520 B TWI432520 B TW I432520B TW 096130215 A TW096130215 A TW 096130215A TW 96130215 A TW96130215 A TW 96130215A TW I432520 B TWI432520 B TW I432520B
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- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- CCEFMUBVSUDRLG-UHFFFAOYSA-N limonene-1,2-epoxide Chemical compound C1C(C(=C)C)CCC2(C)OC21 CCEFMUBVSUDRLG-UHFFFAOYSA-N 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 238000000465 moulding Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 150000002902 organometallic compounds Chemical class 0.000 description 1
- 150000002903 organophosphorus compounds Chemical class 0.000 description 1
- 125000005429 oxyalkyl group Chemical group 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 229920002098 polyfluorene Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910001285 shape-memory alloy Inorganic materials 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
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- 238000006277 sulfonation reaction Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- USFPINLPPFWTJW-UHFFFAOYSA-N tetraphenylphosphonium Chemical compound C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 USFPINLPPFWTJW-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- AUOZNINQGUNWOV-UHFFFAOYSA-N triphenyl borate;triphenylphosphane Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C=1C=CC=CC=1OB(OC=1C=CC=CC=1)OC1=CC=CC=C1 AUOZNINQGUNWOV-UHFFFAOYSA-N 0.000 description 1
- IUURMAINMLIZMX-UHFFFAOYSA-N tris(2-nonylphenyl)phosphane Chemical compound CCCCCCCCCC1=CC=CC=C1P(C=1C(=CC=CC=1)CCCCCCCCC)C1=CC=CC=C1CCCCCCCCC IUURMAINMLIZMX-UHFFFAOYSA-N 0.000 description 1
- WXAZIUYTQHYBFW-UHFFFAOYSA-N tris(4-methylphenyl)phosphane Chemical compound C1=CC(C)=CC=C1P(C=1C=CC(C)=CC=1)C1=CC=C(C)C=C1 WXAZIUYTQHYBFW-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- 125000005023 xylyl group Chemical group 0.000 description 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/17—Amines; Quaternary ammonium compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/16—Polysiloxanes containing silicon bound to oxygen-containing groups to hydroxyl groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
- C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006265955A JP5388409B2 (ja) | 2006-09-28 | 2006-09-28 | 硬化性シリコーン組成物およびその硬化物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW200817473A TW200817473A (en) | 2008-04-16 |
| TWI432520B true TWI432520B (zh) | 2014-04-01 |
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| TW096130215A TWI432520B (zh) | 2006-09-28 | 2007-08-15 | 可固化之聚矽氧組合物及其固化體 |
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| Country | Link |
|---|---|
| US (1) | US20100022704A1 (enExample) |
| EP (1) | EP2079802B1 (enExample) |
| JP (1) | JP5388409B2 (enExample) |
| KR (1) | KR101383128B1 (enExample) |
| CN (1) | CN101517004B (enExample) |
| TW (1) | TWI432520B (enExample) |
| WO (1) | WO2008041459A1 (enExample) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105229495A (zh) * | 2013-02-28 | 2016-01-06 | Hoya株式会社 | 眼镜镜片的制造方法及眼镜镜片基材用涂敷液涂敷装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012057000A (ja) * | 2010-09-07 | 2012-03-22 | Shin-Etsu Chemical Co Ltd | シリコーン樹脂組成物、半導体装置の封止材、及び半導体装置 |
| KR101376999B1 (ko) * | 2012-06-28 | 2014-03-26 | 장암칼스 주식회사 | 전자 소자 절연 봉지용 실리콘 조성물 |
| EP3023467B1 (de) * | 2014-11-20 | 2017-05-10 | BYK-Chemie GmbH | Formmasse, thermoplast oder beschichtungsmittel enthaltend polysiloxane als anti-adhäsive und schmutzabweisende zusätze |
| KR20220110767A (ko) | 2019-11-29 | 2022-08-09 | 쇼와덴코머티리얼즈가부시끼가이샤 | 폴리옥시알킬렌쇄를 갖는 화합물을 함유하는 조성물 세트 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61195129A (ja) * | 1985-02-22 | 1986-08-29 | Toray Silicone Co Ltd | 有機けい素重合体の製造方法 |
| US5011870A (en) * | 1989-02-08 | 1991-04-30 | Dow Corning Corporation | Thermally conductive organosiloxane compositions |
| US5102960A (en) * | 1989-09-11 | 1992-04-07 | Bayer Aktiengesellschaft | Silicon-epoxy resin composition |
| US5206312A (en) * | 1989-11-20 | 1993-04-27 | The Dow Chemical Company | Aromatic hydroxyl-containing compounds containing organosiloxane moieties, epoxy compounds and cured products thereof |
| US5362775A (en) * | 1991-03-27 | 1994-11-08 | Nippondenso Co., Ltd. | Epoxy resin composition and cured product thereof |
| JP3161786B2 (ja) * | 1991-11-20 | 2001-04-25 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| JP3367964B2 (ja) * | 1992-04-21 | 2003-01-20 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| JP3251655B2 (ja) * | 1992-08-05 | 2002-01-28 | 東レ・ダウコーニング・シリコーン株式会社 | ジオルガノポリシロキサンおよびその製造方法 |
| JP3406646B2 (ja) * | 1993-06-29 | 2003-05-12 | 東レ・ダウコーニング・シリコーン株式会社 | オルガノポリシロキサンおよびその製造方法 |
| JP3466239B2 (ja) * | 1993-08-18 | 2003-11-10 | 東レ・ダウコーニング・シリコーン株式会社 | 硬化性樹脂組成物 |
| US6069201A (en) * | 1997-09-12 | 2000-05-30 | Shin-Etsu Chemical Co., Ltd. | Zinc oxide-filled addition-curable silicone rubber compositions |
| JP4727017B2 (ja) * | 1999-11-15 | 2011-07-20 | 東レ・ダウコーニング株式会社 | 熱伝導性シリコーンゴム組成物 |
| JP2002020586A (ja) * | 2000-07-05 | 2002-01-23 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JP5166677B2 (ja) * | 2005-03-15 | 2013-03-21 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物および電子部品 |
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2006
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-
2007
- 2007-08-15 TW TW096130215A patent/TWI432520B/zh not_active IP Right Cessation
- 2007-09-05 CN CN2007800345804A patent/CN101517004B/zh not_active Expired - Fee Related
- 2007-09-05 WO PCT/JP2007/067770 patent/WO2008041459A1/en not_active Ceased
- 2007-09-05 US US12/443,286 patent/US20100022704A1/en not_active Abandoned
- 2007-09-05 KR KR1020097006458A patent/KR101383128B1/ko not_active Expired - Fee Related
- 2007-09-05 EP EP07807177.6A patent/EP2079802B1/en not_active Not-in-force
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105229495A (zh) * | 2013-02-28 | 2016-01-06 | Hoya株式会社 | 眼镜镜片的制造方法及眼镜镜片基材用涂敷液涂敷装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2008081676A (ja) | 2008-04-10 |
| EP2079802A1 (en) | 2009-07-22 |
| KR20090068223A (ko) | 2009-06-25 |
| US20100022704A1 (en) | 2010-01-28 |
| JP5388409B2 (ja) | 2014-01-15 |
| TW200817473A (en) | 2008-04-16 |
| WO2008041459A1 (en) | 2008-04-10 |
| CN101517004A (zh) | 2009-08-26 |
| EP2079802B1 (en) | 2014-05-21 |
| CN101517004B (zh) | 2011-06-22 |
| KR101383128B1 (ko) | 2014-04-09 |
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| MM4A | Annulment or lapse of patent due to non-payment of fees |