JP2008078347A - 半導体装置の製造方法および半導体装置 - Google Patents
半導体装置の製造方法および半導体装置 Download PDFInfo
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 45
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 37
- 238000000034 method Methods 0.000 title claims abstract description 27
- 239000000758 substrate Substances 0.000 claims abstract description 45
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 34
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000010703 silicon Substances 0.000 claims abstract description 30
- 238000005530 etching Methods 0.000 claims abstract description 27
- 239000013078 crystal Substances 0.000 claims description 15
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 claims description 3
- 229910052732 germanium Inorganic materials 0.000 claims description 2
- 230000005669 field effect Effects 0.000 claims 1
- 229910000577 Silicon-germanium Inorganic materials 0.000 abstract description 42
- 239000010410 layer Substances 0.000 description 61
- 230000000694 effects Effects 0.000 description 8
- 229910004298 SiO 2 Inorganic materials 0.000 description 7
- 239000012535 impurity Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- 229910052581 Si3N4 Inorganic materials 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 5
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 5
- 125000006850 spacer group Chemical group 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 229910052796 boron Inorganic materials 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 3
- 229920005591 polysilicon Polymers 0.000 description 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 description 2
- 238000000231 atomic layer deposition Methods 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 229910000449 hafnium oxide Inorganic materials 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 229910021332 silicide Inorganic materials 0.000 description 2
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- ZOCHARZZJNPSEU-UHFFFAOYSA-N diboron Chemical compound B#B ZOCHARZZJNPSEU-UHFFFAOYSA-N 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6656—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using multiple spacer layers, e.g. multiple sidewall spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/28008—Making conductor-insulator-semiconductor electrodes
- H01L21/28017—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon
- H01L21/28026—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor
- H01L21/28114—Making conductor-insulator-semiconductor electrodes the insulator being formed after the semiconductor body, the semiconductor being silicon characterised by the conductor characterised by the sectional shape, e.g. T, inverted-T
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/04—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes
- H01L29/045—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their crystalline structure, e.g. polycrystalline, cubic or particular orientation of crystalline planes by their particular orientation of crystalline planes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/6653—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using the removal of at least part of spacer, e.g. disposable spacer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66545—Unipolar field-effect transistors with an insulated gate, i.e. MISFET using a dummy, i.e. replacement gate in a process wherein at least a part of the final gate is self aligned to the dummy gate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66613—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation
- H01L29/66628—Lateral single gate silicon transistors with a gate recessing step, e.g. using local oxidation recessing the gate by forming single crystalline semiconductor material at the source or drain location
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- H—ELECTRICITY
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66636—Lateral single gate silicon transistors with source or drain recessed by etching or first recessed by etching and then refilled
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Abstract
【解決手段】まず、シリコン基板11上にゲート絶縁膜12を介してゲート電極13を形成する工程を行う。次に、ゲート電極13をマスクにした異方性のリセスエッチングにより、シリコン基板11を掘り下げて、リセス領域18を形成する。リセス領域18の表面に、SiGe層19をエピタキシャル成長させる工程とを行うことを特徴とする半導体装置の製造方法およびこれにより得られる半導体装置である。
【選択図】図2
Description
Claims (7)
- シリコン基板上にゲート絶縁膜を介してゲート電極を形成する第1工程と、
前記ゲート電極をマスクにした異方性のリセスエッチングにより、前記シリコン基板を掘り下げてリセス領域を形成する第2工程と、
前記リセス領域の表面に、シリコンとシリコンとは格子定数の異なる原子とからなる混晶層をエピタキシャル成長させる第3工程とを行う
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記半導体装置はp型の電界効果トランジスタであり、前記混晶層はシリコンとゲルマ
ニウムとからなる
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記シリコン基板の面方位は(110)である
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第1工程と前記第2工程との間に、前記ゲート電極の両側にサイドウォールを形成する工程を行い、
前記第2工程では、前記サイドウォールが設けられた前記ゲート電極をマスクにした異方性のリセスエッチングを行う
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第2工程と前記第3工程との間に、
前記ゲート電極の両側にサイドウォールを形成する工程と、
前記サイドウォールが設けられた前記ゲート電極をマスクにした異方性のリセスエッチングにより、前記リセス領域を掘り下げる工程とを行う
ことを特徴とする半導体装置の製造方法。 - 請求項1記載の半導体装置の製造方法において、
前記第3工程の後に、
前記ゲート電極を覆う状態で、前記混晶層上に、絶縁膜を形成し、当該ゲート電極の表面が露出するまで、当該絶縁膜を除去する工程と、
露出された前記ゲート電極と前記ゲート絶縁膜とをダミーとして除去することで、前記絶縁膜にシリコン基板を露出する凹部を形成する工程と、
前記凹部内に、新たにゲート絶縁膜を介してゲート電極を形成する工程とを行う
ことを特徴とする半導体装置の製造方法。 - シリコン基板上にゲート絶縁膜を介してゲート電極が設けられた半導体装置であって、
前記ゲート電極側の側壁が略垂直となるように、当該ゲート電極の両側の前記シリコン基板が掘り下げられたリセス領域に、シリコンとシリコンとは格子定数の異なる原子とからなる混晶層が設けられている
ことを特徴とする半導体装置。
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JP2006255259A JP5070779B2 (ja) | 2006-09-21 | 2006-09-21 | 半導体装置の製造方法および半導体装置 |
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JP2006255259A JP5070779B2 (ja) | 2006-09-21 | 2006-09-21 | 半導体装置の製造方法および半導体装置 |
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JP2008078347A true JP2008078347A (ja) | 2008-04-03 |
JP5070779B2 JP5070779B2 (ja) | 2012-11-14 |
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JP (1) | JP5070779B2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009076907A (ja) * | 2007-09-19 | 2009-04-09 | Asm America Inc | チャンネルに対して設計されたひずみを与えるストレッサー |
JP2009117429A (ja) * | 2007-11-01 | 2009-05-28 | Fujitsu Microelectronics Ltd | 半導体装置及びその製造方法 |
WO2011052108A1 (ja) * | 2009-10-26 | 2011-05-05 | パナソニック株式会社 | 半導体装置及びその製造方法 |
CN102779752A (zh) * | 2011-05-12 | 2012-11-14 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
Citations (7)
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JPS63153863A (ja) * | 1986-12-18 | 1988-06-27 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH08153688A (ja) * | 1994-09-13 | 1996-06-11 | Toshiba Corp | 半導体装置の製造方法および半導体装置 |
JP2006013082A (ja) * | 2004-06-24 | 2006-01-12 | Fujitsu Ltd | 半導体装置とその製造方法、及び半導体装置の評価方法 |
JP2006186240A (ja) * | 2004-12-28 | 2006-07-13 | Fujitsu Ltd | 半導体装置およびその製造方法 |
WO2006074438A1 (en) * | 2005-01-06 | 2006-07-13 | Intel Corporation | Device with stepped source/drain region profile |
JP2006303501A (ja) * | 2005-04-18 | 2006-11-02 | Toshiba Corp | PFETの移動度を強化したステップ埋め込みSiGe構造 |
JP2007103654A (ja) * | 2005-10-04 | 2007-04-19 | Toshiba Corp | 半導体装置およびその製造方法 |
-
2006
- 2006-09-21 JP JP2006255259A patent/JP5070779B2/ja not_active Expired - Fee Related
Patent Citations (7)
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JPS63153863A (ja) * | 1986-12-18 | 1988-06-27 | Fujitsu Ltd | 半導体装置の製造方法 |
JPH08153688A (ja) * | 1994-09-13 | 1996-06-11 | Toshiba Corp | 半導体装置の製造方法および半導体装置 |
JP2006013082A (ja) * | 2004-06-24 | 2006-01-12 | Fujitsu Ltd | 半導体装置とその製造方法、及び半導体装置の評価方法 |
JP2006186240A (ja) * | 2004-12-28 | 2006-07-13 | Fujitsu Ltd | 半導体装置およびその製造方法 |
WO2006074438A1 (en) * | 2005-01-06 | 2006-07-13 | Intel Corporation | Device with stepped source/drain region profile |
JP2006303501A (ja) * | 2005-04-18 | 2006-11-02 | Toshiba Corp | PFETの移動度を強化したステップ埋め込みSiGe構造 |
JP2007103654A (ja) * | 2005-10-04 | 2007-04-19 | Toshiba Corp | 半導体装置およびその製造方法 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009076907A (ja) * | 2007-09-19 | 2009-04-09 | Asm America Inc | チャンネルに対して設計されたひずみを与えるストレッサー |
JP2009117429A (ja) * | 2007-11-01 | 2009-05-28 | Fujitsu Microelectronics Ltd | 半導体装置及びその製造方法 |
US9214524B2 (en) | 2007-11-01 | 2015-12-15 | Fujitsu Semiconductor Limited | Method of manufacturing a semiconductor device |
WO2011052108A1 (ja) * | 2009-10-26 | 2011-05-05 | パナソニック株式会社 | 半導体装置及びその製造方法 |
CN102779752A (zh) * | 2011-05-12 | 2012-11-14 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
CN108281358A (zh) * | 2011-05-12 | 2018-07-13 | 中芯国际集成电路制造(上海)有限公司 | 半导体器件及其制造方法 |
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