JP2008060144A - 電子部品取出装置、表面実装機、および電子部品取り出し方法 - Google Patents
電子部品取出装置、表面実装機、および電子部品取り出し方法 Download PDFInfo
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- JP2008060144A JP2008060144A JP2006232225A JP2006232225A JP2008060144A JP 2008060144 A JP2008060144 A JP 2008060144A JP 2006232225 A JP2006232225 A JP 2006232225A JP 2006232225 A JP2006232225 A JP 2006232225A JP 2008060144 A JP2008060144 A JP 2008060144A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/02—Feeding of components
- H05K13/021—Loading or unloading of containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53039—Means to assemble or disassemble with control means energized in response to activator stimulated by condition sensor
- Y10T29/53048—Multiple station assembly or disassembly apparatus
- Y10T29/53052—Multiple station assembly or disassembly apparatus including position sensor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53087—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer
- Y10T29/53091—Means to assemble or disassemble with signal, scale, illuminator, or optical viewer for work-holder for assembly or disassembly
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/5313—Means to assemble electrical device
- Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
- Y10T29/53178—Chip component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/53—Means to assemble or disassemble
- Y10T29/53274—Means to disassemble electrical device
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
【解決手段】あらかじめマーキングされた複数の基準電子部品M1、M2を識別認識するとともに、取り出すべき電子部品2aの近傍に位置する複数の基準電子部品M1、M2の位置と、記憶手段に記憶されたウエハマッピングファイルの部品配列情報とから、取り出すべき電子部品2aの位置を演算するように構成されている。
【選択図】図7
Description
Yc=Y1+(Y2−Y1)×(MYc−MY1)/(MY2−MY1)
再び図6を参照して、上記部品取出工程(ステップS14〜ステップS17)は、この演算された電子部品2aの位置において、電子部品2aを取り出すように部品取出手段7aを制御する工程であり、ステップS14においてウエハカメラ7hの中心に部品の補正位置が位置するようにウエハステージ7dが移動され、ステップS15において部品を画像認識し、正確な位置Cを求める。また、ステップS16において位置Cへ部品移載用ヘッド7gが移動され、部品が取り出される(ステップS17)。
2 電子部品
2a 取り出すべき電子部品
3 電子部品集合体
5 基板
6 ウエハ
6a ウエハ保持部
7 電子部品取出装置
7a 部品取出手段
7b 認識手段
9 基板配置部
10 ヘッドユニット
11 制御手段
11f 記憶手段
M1、M2 基準電子部品
MF ウエハマッピングファイル(部品配列情報)
Claims (5)
- ウエハに規則的に配列された電子部品がウエハ保持部にダイシングされた状態で保持されている電子部品集合体の中から電子部品を取り出すように構成された電子部品取出装置であって、
上記電子部品集合体の中から電子部品を取り出す部品取出手段と、
上記電子部品集合体の部品配列情報を記憶する記憶手段と、
上記部品配列情報に基づき電子部品集合体の中から取り出すべき電子部品を特定して、その電子部品を取り出すように部品取出手段を制御する制御手段と、
上記ウエハ保持部に保持されている電子部品集合体を撮像してその画像の認識を行なう認識手段と、
を備え、
上記制御手段は、ウエハ上の電子部品のうち、他の電子部品との識別のためにあらかじめマーキングされた複数の基準電子部品を識別認識するとともに、取り出すべき電子部品の近傍に位置する複数の基準電子部品の位置と、記憶手段に記憶された部品配列情報とから、取り出すべき電子部品の位置を演算するように構成されていることを特徴とする電子部品取出装置。 - 上記基準電子部品は、ウエハ上において規則的な格子状に配列されてマトリックスを形成していることを特徴とする請求項1に記載の電子部品取出装置。
- 上記基準電子部品は、他の電子部品とは回路パターンが異なることをマーキングとするものであり、認識手段は、この他の電子部品とは回路パターンが異なる基準電子部品を識別認識するように構成されていることを特徴とする請求項1または2に記載の電子部品取出装置。
- 請求項1ないし請求項3のいずれかに記載の電子部品取出装置と、
基板が配置される基板配置部と、
上記電子部品を吸着するヘッドを有する部品実装用のヘッドユニットと、
を備え、
上記部品取出手段により上記電子部品集合体から取り出された電子部品が、上記部品実装用のヘッドユニットにより基板配置部へ搬送されて、基板に装着されるように構成されていることを特徴とする表面実装機。 - ウエハに規則的に配列された電子部品がウエハ保持部にダイシングされた状態で保持されている電子部品集合体において、この電子部品集合体を画像認識するとともに、この画像認識された電子部品集合体の中から電子部品を部品取出手段により取り出すように構成された電子部品取り出し方法であって、
取り出すべき電子部品の近傍に位置する複数の基準電子部品の位置を識別認識する基準電子部品認識工程と、
この複数の基準電子部品の位置と、ウエハに規則的に配列された電子部品の部品配列情報とから、取り出すべき電子部品の位置を演算する位置演算工程と、
この演算された電子部品の位置において、電子部品を取り出すように部品取出手段を制御する部品取出工程と、
を含むことを特徴とする電子部品取り出し方法。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006232225A JP4828356B2 (ja) | 2006-08-29 | 2006-08-29 | 電子部品取出装置、表面実装機、および電子部品取り出し方法 |
CN200780032602.3A CN101513154B (zh) | 2006-08-29 | 2007-08-28 | 电子元件取出装置、表面安装机、电子元件取出方法 |
US12/439,566 US7918017B2 (en) | 2006-08-29 | 2007-08-28 | Electronic component taking out apparatus |
PCT/JP2007/066611 WO2008026565A1 (fr) | 2006-08-29 | 2007-08-28 | Appareil de retrait de composant électronique, appareil de montage de surface et procédé permettant de retirer un composant électronique |
EP07793055.0A EP2059112B1 (en) | 2006-08-29 | 2007-08-28 | Electronic component taking out apparatus, surface mounting apparatus and method for taking out electronic component |
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JP2006232225A JP4828356B2 (ja) | 2006-08-29 | 2006-08-29 | 電子部品取出装置、表面実装機、および電子部品取り出し方法 |
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Publication Number | Publication Date |
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JP2008060144A true JP2008060144A (ja) | 2008-03-13 |
JP4828356B2 JP4828356B2 (ja) | 2011-11-30 |
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Country | Link |
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US (1) | US7918017B2 (ja) |
EP (1) | EP2059112B1 (ja) |
JP (1) | JP4828356B2 (ja) |
CN (1) | CN101513154B (ja) |
WO (1) | WO2008026565A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012190879A (ja) * | 2011-03-09 | 2012-10-04 | Fuji Mach Mfg Co Ltd | 電子部品実装装置及び電子部品実装方法 |
JP5999855B2 (ja) * | 2012-12-20 | 2016-09-28 | 富士機械製造株式会社 | ダイ供給装置 |
JP2018147983A (ja) * | 2017-03-03 | 2018-09-20 | 株式会社Fuji | ダイ供給装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP5774968B2 (ja) * | 2011-11-15 | 2015-09-09 | ヤマハ発動機株式会社 | 部品移載装置および部品移載装置における吸着位置調整方法 |
CN103476237B (zh) * | 2013-08-27 | 2018-01-12 | 深圳Tcl新技术有限公司 | Led、led灯条及led灯条贴附二次透镜的方法 |
DE102015112962B4 (de) | 2015-08-06 | 2021-07-22 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Verfahren zum Anordnen einer Vielzahl von Halbleiterstrukturelementen auf einem Träger und Träger mit einer Vielzahl von Halbleiterstrukturelementen |
TWI682492B (zh) * | 2018-03-23 | 2020-01-11 | 旺矽科技股份有限公司 | 晶粒挑揀總成及晶粒移動方法 |
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JP2006080105A (ja) * | 2004-09-07 | 2006-03-23 | Yamaha Motor Co Ltd | 電子部品供給方法、同装置および表面実装機 |
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- 2007-08-28 CN CN200780032602.3A patent/CN101513154B/zh active Active
- 2007-08-28 WO PCT/JP2007/066611 patent/WO2008026565A1/ja active Application Filing
- 2007-08-28 US US12/439,566 patent/US7918017B2/en active Active
- 2007-08-28 EP EP07793055.0A patent/EP2059112B1/en active Active
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JP2002026041A (ja) * | 2000-07-12 | 2002-01-25 | Nec Machinery Corp | ダイボンダ |
JP2006080105A (ja) * | 2004-09-07 | 2006-03-23 | Yamaha Motor Co Ltd | 電子部品供給方法、同装置および表面実装機 |
Cited By (3)
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JP2012190879A (ja) * | 2011-03-09 | 2012-10-04 | Fuji Mach Mfg Co Ltd | 電子部品実装装置及び電子部品実装方法 |
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JP2018147983A (ja) * | 2017-03-03 | 2018-09-20 | 株式会社Fuji | ダイ供給装置 |
Also Published As
Publication number | Publication date |
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CN101513154A (zh) | 2009-08-19 |
US7918017B2 (en) | 2011-04-05 |
WO2008026565A1 (fr) | 2008-03-06 |
US20100083488A1 (en) | 2010-04-08 |
CN101513154B (zh) | 2011-07-27 |
EP2059112B1 (en) | 2013-07-31 |
JP4828356B2 (ja) | 2011-11-30 |
EP2059112A1 (en) | 2009-05-13 |
EP2059112A4 (en) | 2011-08-31 |
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