JP2007522531A5 - - Google Patents
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- Publication number
- JP2007522531A5 JP2007522531A5 JP2006553295A JP2006553295A JP2007522531A5 JP 2007522531 A5 JP2007522531 A5 JP 2007522531A5 JP 2006553295 A JP2006553295 A JP 2006553295A JP 2006553295 A JP2006553295 A JP 2006553295A JP 2007522531 A5 JP2007522531 A5 JP 2007522531A5
- Authority
- JP
- Japan
- Prior art keywords
- cured product
- process step
- composition
- photoresist
- hardened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 claims description 25
- 229920002120 photoresistant polymer Polymers 0.000 claims description 23
- 229910052739 hydrogen Inorganic materials 0.000 claims description 6
- 239000001257 hydrogen Substances 0.000 claims description 6
- 239000002904 solvent Substances 0.000 claims description 6
- 239000012952 cationic photoinitiator Substances 0.000 claims description 5
- 239000003822 epoxy resin Substances 0.000 claims description 5
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 5
- 229920000647 polyepoxide Polymers 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004432 carbon atom Chemical group C* 0.000 claims description 4
- 150000002431 hydrogen Chemical class 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims description 2
- 229920003986 novolac Polymers 0.000 claims description 2
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 25
- 239000000758 substrate Substances 0.000 claims 11
- 239000000463 material Substances 0.000 claims 10
- 239000010408 film Substances 0.000 claims 8
- 238000004519 manufacturing process Methods 0.000 claims 8
- 238000010438 heat treatment Methods 0.000 claims 6
- 238000004132 cross linking Methods 0.000 claims 4
- -1 arylsulfonium hexafluoroantimonate salts Chemical class 0.000 claims 2
- 150000001875 compounds Chemical class 0.000 claims 2
- 239000003989 dielectric material Substances 0.000 claims 2
- 238000010894 electron beam technology Methods 0.000 claims 2
- 238000001704 evaporation Methods 0.000 claims 2
- 239000012212 insulator Substances 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 239000000178 monomer Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 239000003504 photosensitizing agent Substances 0.000 claims 2
- 229920006254 polymer film Polymers 0.000 claims 2
- 230000005855 radiation Effects 0.000 claims 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 claims 1
- SURWYRGVICLUBJ-UHFFFAOYSA-N 2-ethyl-9,10-dimethoxyanthracene Chemical group C1=CC=CC2=C(OC)C3=CC(CC)=CC=C3C(OC)=C21 SURWYRGVICLUBJ-UHFFFAOYSA-N 0.000 claims 1
- MECNWXGGNCJFQJ-UHFFFAOYSA-N 3-piperidin-1-ylpropane-1,2-diol Chemical group OCC(O)CN1CCCCC1 MECNWXGGNCJFQJ-UHFFFAOYSA-N 0.000 claims 1
- 239000002318 adhesion promoter Substances 0.000 claims 1
- 238000012742 biochemical analysis Methods 0.000 claims 1
- 239000012620 biological material Substances 0.000 claims 1
- 229910052799 carbon Inorganic materials 0.000 claims 1
- 230000010261 cell growth Effects 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000013039 cover film Substances 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 229920001451 polypropylene glycol Polymers 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US54440304P | 2004-02-13 | 2004-02-13 | |
| US60/544,403 | 2004-02-13 | ||
| US11/054,651 US20050260522A1 (en) | 2004-02-13 | 2005-02-09 | Permanent resist composition, cured product thereof, and use thereof |
| US11/054,651 | 2005-02-09 | ||
| PCT/US2005/004504 WO2005079330A2 (en) | 2004-02-13 | 2005-02-10 | Permanent resist composition, cured product thereof, and use thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007522531A JP2007522531A (ja) | 2007-08-09 |
| JP2007522531A5 true JP2007522531A5 (https=) | 2010-01-14 |
| JP4691047B2 JP4691047B2 (ja) | 2011-06-01 |
Family
ID=34889822
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006553295A Expired - Lifetime JP4691047B2 (ja) | 2004-02-13 | 2005-02-10 | 永久レジスト組成物、その硬化生成物、及びその使用 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US20050260522A1 (https=) |
| EP (1) | EP1730592A4 (https=) |
| JP (1) | JP4691047B2 (https=) |
| KR (1) | KR20070007080A (https=) |
| CA (1) | CA2555544A1 (https=) |
| IL (1) | IL177325A0 (https=) |
| TW (1) | TW200628540A (https=) |
| WO (1) | WO2005079330A2 (https=) |
Families Citing this family (67)
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| CN1849560B (zh) * | 2004-03-26 | 2011-12-07 | 东京応化工业株式会社 | 感光性树脂组合物及使用该组合物的图案形成方法 |
| US7423073B2 (en) * | 2004-11-23 | 2008-09-09 | Lexmark International, Inc. | Radiation curable compositions having improved flexibility |
| US8052828B2 (en) * | 2005-01-21 | 2011-11-08 | Tokyo Okha Kogyo Co., Ltd. | Photosensitive laminate film for forming top plate portion of precision fine space and method of forming precision fine space |
| US20060257785A1 (en) * | 2005-05-13 | 2006-11-16 | Johnson Donald W | Method of forming a photoresist element |
| KR100764416B1 (ko) * | 2005-08-17 | 2007-10-05 | 주식회사 하이닉스반도체 | 이머젼 리소그라피 공정을 이용한 반도체 소자 제조방법 |
| EP1760121B1 (en) * | 2005-08-31 | 2009-10-07 | FUJIFILM Corporation | Radiation curable ink comprising a condensed polycyclic aromatic photosensitizer |
| JP4511439B2 (ja) * | 2005-09-28 | 2010-07-28 | 日東電工株式会社 | 感光性エポキシ樹脂接着性フィルム |
| US20070243662A1 (en) * | 2006-03-17 | 2007-10-18 | Johnson Donald W | Packaging of MEMS devices |
| US7622244B2 (en) * | 2006-04-20 | 2009-11-24 | Texas Instruments Incorporated | Method for contaminant removal |
| KR20070105040A (ko) * | 2006-04-25 | 2007-10-30 | 엘지.필립스 엘시디 주식회사 | 레지스트 조성물, 이를 이용한 레지스트 패턴 형성방법 및이를 이용하여 제조된 어레이 기판 |
| JP4382791B2 (ja) | 2006-05-16 | 2009-12-16 | Nec液晶テクノロジー株式会社 | 光線方向制御素子の製造方法 |
| JP4913141B2 (ja) * | 2006-07-14 | 2012-04-11 | 日本化薬株式会社 | 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法(2) |
| JP4913142B2 (ja) * | 2006-07-14 | 2012-04-11 | 日本化薬株式会社 | 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法(3) |
| JP4789725B2 (ja) * | 2006-07-14 | 2011-10-12 | 日本化薬株式会社 | 感光性樹脂組成物、その積層体、その硬化物及び該組成物を用いたパターン形成方法 |
| KR101435195B1 (ko) * | 2007-01-05 | 2014-08-29 | 삼성전자주식회사 | 감광성 고분자 복합체 형성용 조성물 및 상기 조성물을 이용한 은 나노입자를 함유하는 감광성 고분자 복합체의 제조방법 |
| JP5269449B2 (ja) * | 2007-03-24 | 2013-08-21 | 株式会社ダイセル | ナノインプリント用硬化性樹脂組成物 |
| JP2008299165A (ja) * | 2007-06-01 | 2008-12-11 | Nippon Kayaku Co Ltd | 中空構造を有する成形体の製造法 |
| WO2009041510A1 (ja) * | 2007-09-25 | 2009-04-02 | Panasonic Electric Works Co., Ltd. | 樹脂成形体の製造方法、その製造方法により得られる樹脂成形体、光デバイス、マイクロレンズ、マイクロレンズアレイ、及びマイクロ流体デバイス |
| KR101403187B1 (ko) * | 2008-02-19 | 2014-06-02 | 삼성전자주식회사 | 감광성 조성물, 이를 이용한 미세 가공 방법 및 그에 의해형성된 미세 가공물 |
| US20090233225A1 (en) * | 2008-03-12 | 2009-09-17 | Johnson Donald W | Low chlorine epoxy resin formulations |
| TW201013311A (en) * | 2008-06-10 | 2010-04-01 | Nippon Kayaku Kk | A photosensitive resin composition for cavity packaging, a cured product thereof, and a laminated body and a micro device using the resin composition |
| JP5349854B2 (ja) * | 2008-06-30 | 2013-11-20 | 株式会社日立製作所 | 微細構造体およびその製造方法 |
| WO2010001538A1 (ja) * | 2008-06-30 | 2010-01-07 | 株式会社日立製作所 | 微細構造体およびインプリント用スタンパ |
| JP5247396B2 (ja) | 2008-07-02 | 2013-07-24 | 日本化薬株式会社 | Mems用感光性樹脂組成物及びその硬化物 |
| JP5465453B2 (ja) | 2009-03-26 | 2014-04-09 | パナソニック株式会社 | 光導波路形成用エポキシ樹脂組成物、光導波路形成用硬化性フィルム、光伝送用フレキシブルプリント配線板、及び電子情報機器 |
| JP4617387B2 (ja) * | 2009-06-17 | 2011-01-26 | キヤノン株式会社 | 微細構造体の製造方法 |
| US20120040288A1 (en) * | 2010-08-11 | 2012-02-16 | Microchem Corp. | Epoxy formulations with controllable photospeed |
| JP5691987B2 (ja) | 2010-10-13 | 2015-04-01 | 信越化学工業株式会社 | 光硬化性樹脂組成物、そのドライフィルム、パターン形成方法及び電気・電子部品保護用皮膜 |
| EP2447773B1 (en) | 2010-11-02 | 2013-07-10 | Fujifilm Corporation | Method for producing a pattern, method for producing a MEMS structure, use of a cured film of a photosensitive composition as a sacrificial layer or as a component of a MEMS structure |
| JP5804726B2 (ja) * | 2011-02-24 | 2015-11-04 | キヤノン株式会社 | 微細構造体の製造方法 |
| KR20130133304A (ko) * | 2011-04-08 | 2013-12-06 | 다이요 잉키 세이조 가부시키가이샤 | 감광성 조성물, 그의 경화 피막, 및 그것들을 사용한 프린트 배선판 |
| JP2012227318A (ja) * | 2011-04-19 | 2012-11-15 | Tokyo Electron Ltd | 基板処理方法、プログラム、コンピュータ記憶媒体、基板処理装置及びインプリントシステム |
| JP5700547B2 (ja) | 2011-05-30 | 2015-04-15 | 国立大学法人京都大学 | バイオチップ形成用感光性樹脂組成物、及びバイオチップ |
| WO2012173721A1 (en) * | 2011-06-13 | 2012-12-20 | Microchem Corp. | Epoxy formulations and processes for fabrication of opaque structures |
| WO2013008072A2 (en) * | 2011-07-08 | 2013-01-17 | Indian Institute Of Technology, Bombay | A process for preparing polymer composition of functionalized epoxy resist, polymer composition and applications thereof |
| EP2753662B1 (en) * | 2011-09-07 | 2020-06-24 | MicroChem Corp. | Epoxy formulations and processes for fabrication of relief patterns on low surface energy substrates |
| JP2013061647A (ja) | 2011-09-09 | 2013-04-04 | Rohm & Haas Electronic Materials Llc | フォトリソグラフィ方法 |
| US11635688B2 (en) * | 2012-03-08 | 2023-04-25 | Kayaku Advanced Materials, Inc. | Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates |
| KR20150003158A (ko) * | 2012-04-09 | 2015-01-08 | 아사히 가라스 가부시키가이샤 | 미세 패턴을 표면에 갖는 물품의 제조 방법 |
| JP6071255B2 (ja) * | 2012-06-04 | 2017-02-01 | キヤノン株式会社 | 光硬化物 |
| JP5894943B2 (ja) | 2012-08-31 | 2016-03-30 | 富士フイルム株式会社 | 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、マイクロレンズの製造方法、及び固体撮像素子 |
| JP5934682B2 (ja) | 2012-08-31 | 2016-06-15 | 富士フイルム株式会社 | マイクロレンズ形成用又はカラーフィルターの下塗り膜形成用硬化性組成物、透明膜、マイクロレンズ、固体撮像素子、及び、硬化性組成物の製造方法 |
| JP5909468B2 (ja) | 2012-08-31 | 2016-04-26 | 富士フイルム株式会社 | 分散組成物、これを用いた硬化性組成物、透明膜、マイクロレンズ、及び固体撮像素子 |
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| CN103981485B (zh) * | 2014-05-09 | 2016-07-06 | 合肥鑫晟光电科技有限公司 | 掩膜板及其制造方法 |
| JP6571585B2 (ja) | 2015-06-08 | 2019-09-04 | 信越化学工業株式会社 | 半導体装置、積層型半導体装置、封止後積層型半導体装置、及びこれらの製造方法 |
| JP2018091939A (ja) * | 2016-11-30 | 2018-06-14 | 株式会社Adeka | ネガ型感光性組成物、その硬化物およびその硬化方法 |
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| US20210124265A1 (en) * | 2017-04-21 | 2021-04-29 | Nipppon Kayaku Kabushiki Kaisha | Photosensitive Resin Composition And Cured Product Therefrom |
| US11520226B2 (en) * | 2017-05-12 | 2022-12-06 | Canon Kabushiki Kaisha | Imprint method, imprint apparatus, imprint system, and method of manufacturing article |
| JP2019038964A (ja) * | 2017-08-28 | 2019-03-14 | 住友ベークライト株式会社 | 感光性樹脂組成物および電子装置 |
| KR102660240B1 (ko) | 2017-12-06 | 2024-04-23 | 닛뽄 가야쿠 가부시키가이샤 | 감광성 수지 조성물, 드라이 필름 레지스트 및 그들의 경화물 |
| AU2019305036B2 (en) * | 2018-07-20 | 2025-01-23 | Illumina Cambridge Limited | Resin composition and flow cells incorporating the same |
| CN112673315B (zh) * | 2018-07-20 | 2025-02-25 | 伊鲁米那股份有限公司 | 树脂组合物和并入树脂组合物的流动池 |
| JP7093406B2 (ja) * | 2018-08-28 | 2022-06-29 | 住友ベークライト株式会社 | 半導体装置 |
| JP7339111B2 (ja) * | 2018-10-01 | 2023-09-05 | 旭化成株式会社 | マイクロ流路デバイス用感光性樹脂積層体 |
| JP7213675B2 (ja) * | 2018-12-21 | 2023-01-27 | 東京応化工業株式会社 | ネガ型感光性樹脂組成物、感光性レジストフィルム、パターン形成方法 |
| US12032286B2 (en) | 2019-06-17 | 2024-07-09 | Asahi Kasei Kabushiki Kaisha | Method for producing multi-layered type microchannel device using photosensitive resin laminate |
| JP7621072B2 (ja) * | 2020-07-21 | 2025-01-24 | 東京応化工業株式会社 | 中空構造体の製造方法、及び中空パッケージの製造方法 |
| JP7546395B2 (ja) * | 2020-07-21 | 2024-09-06 | 東京応化工業株式会社 | 中空構造体の製造方法、及び中空パッケージの製造方法 |
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-
2005
- 2005-02-09 US US11/054,651 patent/US20050260522A1/en not_active Abandoned
- 2005-02-10 KR KR1020067016287A patent/KR20070007080A/ko not_active Withdrawn
- 2005-02-10 EP EP05713440A patent/EP1730592A4/en not_active Withdrawn
- 2005-02-10 CA CA002555544A patent/CA2555544A1/en not_active Abandoned
- 2005-02-10 JP JP2006553295A patent/JP4691047B2/ja not_active Expired - Lifetime
- 2005-02-10 WO PCT/US2005/004504 patent/WO2005079330A2/en not_active Ceased
- 2005-07-08 TW TW094123278A patent/TW200628540A/zh unknown
-
2006
- 2006-08-07 IL IL177325A patent/IL177325A0/en unknown
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