JP2007500919A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2007500919A5 JP2007500919A5 JP2006521256A JP2006521256A JP2007500919A5 JP 2007500919 A5 JP2007500919 A5 JP 2007500919A5 JP 2006521256 A JP2006521256 A JP 2006521256A JP 2006521256 A JP2006521256 A JP 2006521256A JP 2007500919 A5 JP2007500919 A5 JP 2007500919A5
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- layer
- forming
- patterned
- organic layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000012044 organic layer Substances 0.000 claims 16
- 239000010410 layer Substances 0.000 claims 14
- 238000001312 dry etching Methods 0.000 claims 9
- 239000000758 substrate Substances 0.000 claims 8
- 239000007789 gas Substances 0.000 claims 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims 4
- 238000000034 method Methods 0.000 claims 4
- 239000011368 organic material Substances 0.000 claims 4
- 239000001301 oxygen Substances 0.000 claims 4
- 229910052760 oxygen Inorganic materials 0.000 claims 4
- 239000011261 inert gas Substances 0.000 claims 2
- 238000005240 physical vapour deposition Methods 0.000 claims 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 229910052731 fluorine Inorganic materials 0.000 claims 1
- 239000011737 fluorine Substances 0.000 claims 1
- 230000005525 hole transport Effects 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/625,112 US6953705B2 (en) | 2003-07-22 | 2003-07-22 | Process for removing an organic layer during fabrication of an organic electronic device |
| US10/890,360 US7235420B2 (en) | 2003-07-22 | 2004-07-13 | Process for removing an organic layer during fabrication of an organic electronic device and the organic electronic device formed by the process |
| PCT/US2004/023671 WO2005057681A1 (en) | 2003-07-22 | 2004-07-22 | Process for removing an organic layer during fabrication of an organic electronic device and the organic electronic device formed by the process |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007500919A JP2007500919A (ja) | 2007-01-18 |
| JP2007500919A5 true JP2007500919A5 (enExample) | 2007-09-13 |
| JP4634379B2 JP4634379B2 (ja) | 2011-02-16 |
Family
ID=34681718
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006521256A Expired - Fee Related JP4634379B2 (ja) | 2003-07-22 | 2004-07-22 | 有機電子デバイス製造の際の有機層の除去方法およびその方法によって形成される有機電子デバイス |
Country Status (4)
| Country | Link |
|---|---|
| EP (1) | EP1647064B1 (enExample) |
| JP (1) | JP4634379B2 (enExample) |
| KR (1) | KR101207073B1 (enExample) |
| WO (1) | WO2005057681A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007220360A (ja) * | 2006-02-14 | 2007-08-30 | Tokyo Electron Ltd | 発光素子、発光素子の製造方法および基板処理装置 |
| US8115326B2 (en) * | 2006-11-30 | 2012-02-14 | Corning Incorporated | Flexible substrates having a thin-film barrier |
| JP2008311037A (ja) * | 2007-06-13 | 2008-12-25 | Panasonic Electric Works Co Ltd | 面発光体の製造方法 |
| US7833074B2 (en) | 2007-09-04 | 2010-11-16 | Global Oled Technology Llc | Method of making a top-emitting OLED device having improved power distribution |
| JP2010009779A (ja) * | 2008-06-24 | 2010-01-14 | Tokyo Electron Ltd | プラズマ処理装置、プラズマ処理方法及び有機電子デバイス |
| JP5699064B2 (ja) * | 2011-09-29 | 2015-04-08 | 富士フイルム株式会社 | カラーフィルタの製造方法 |
| WO2016172740A2 (en) * | 2015-11-10 | 2016-10-27 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Etching reactants and plasma-free oxide etching processes using the same |
| EP3605587A4 (en) * | 2017-03-27 | 2020-12-30 | Kanto Denka Kogyo Co., Ltd. | DRY ENGRAVING OR DRY CLEANING PROCESS |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000512428A (ja) * | 1996-06-12 | 2000-09-19 | ザ トラスティーズ オブ プリンストン ユニバーシテイ | 有機多色表示器製造のための薄膜パターン化 |
| JP3653942B2 (ja) * | 1997-07-24 | 2005-06-02 | 松下電器産業株式会社 | 有機発光素子及びその製造方法 |
| US6153254A (en) * | 1998-09-30 | 2000-11-28 | U.S. Philips Corporation | Method and device for manufacturing an electroluminescent display screen |
| GB9928014D0 (en) * | 1999-11-26 | 2000-01-26 | Cambridge Display Tech Ltd | Method of producing an organic light-emissive device |
| US6699728B2 (en) * | 2000-09-06 | 2004-03-02 | Osram Opto Semiconductors Gmbh | Patterning of electrodes in oled devices |
| SG115381A1 (en) * | 2001-06-20 | 2005-10-28 | Univ Singapore | Removal of organic layers from organic electronic devices |
| JP2003017251A (ja) * | 2001-06-28 | 2003-01-17 | Canon Electronics Inc | 有機エレクトロルミネセンス表示装置の製造方法 |
-
2004
- 2004-07-22 KR KR1020067001422A patent/KR101207073B1/ko not_active Expired - Fee Related
- 2004-07-22 EP EP04820346A patent/EP1647064B1/en not_active Expired - Lifetime
- 2004-07-22 JP JP2006521256A patent/JP4634379B2/ja not_active Expired - Fee Related
- 2004-07-22 WO PCT/US2004/023671 patent/WO2005057681A1/en not_active Ceased
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW200509740A (en) | Process for removing an organic layer during fabrication of an organic electronic device and the organic electronic device formed by the process | |
| US6579757B2 (en) | Method for fabricating semiconductor device which prevents gates of a peripheral region from being oxidized | |
| KR100842753B1 (ko) | 스페이서를 이용한 반도체소자의 패턴 형성방법 | |
| US6548401B1 (en) | Semiconductor processing methods, and semiconductor constructions | |
| JP2006524436A5 (enExample) | ||
| US20090230484A1 (en) | Method of fabricating a semiconductor device | |
| JP2008072085A (ja) | 半導体素子の微細パターン形成方法 | |
| JP6370139B2 (ja) | Ｆｉｎｆｅｔ構造のドーパント注入方法 | |
| JP2007500919A5 (enExample) | ||
| KR100843553B1 (ko) | 유기 전자 소자의 유기 물질층 패터닝 방법과 상기 방법을이용하여 제작된 유기 박막 트랜지스터 및 유기 전계 발광디바이스 | |
| JP2008500727A (ja) | 分離相補型マスクパターン転写方法 | |
| WO2005057681A8 (en) | Process for removing an organic layer during fabrication of an organic electronic device and the organic electronic device formed by the process | |
| KR20040066156A (ko) | Ｅｌ 디스플레이 장치와 그 제조 방법 | |
| JP3585039B2 (ja) | ホール形成方法 | |
| US6890813B2 (en) | Polymer film metalization | |
| JP2007180475A (ja) | 非晶質カーボンを利用する半導体素子の製造方法 | |
| JP3728615B2 (ja) | 電界発光素子及びその製造方法 | |
| KR20060015949A (ko) | 금속 패턴 형성 방법 | |
| TW200535991A (en) | Composite layer method for minimizing ped effect | |
| TW201322369A (zh) | 接觸窗開口的形成方法 | |
| KR100904735B1 (ko) | 반도체소자의 컨택홀 형성방법 | |
| KR100723289B1 (ko) | 박막 트랜지스터 및 그 제조방법 | |
| KR100814910B1 (ko) | 유기 박막 트랜지스터 및 그 제조 방법 | |
| WO2003001851A1 (en) | Metal cap for encapsulating organic light-emitting device and method for producing the same | |
| TW200515851A (en) | Patterned circuit layer of semiconductor package substrate and method for fabricating the same |