TW200515851A - Patterned circuit layer of semiconductor package substrate and method for fabricating the same - Google Patents
Patterned circuit layer of semiconductor package substrate and method for fabricating the sameInfo
- Publication number
- TW200515851A TW200515851A TW092128799A TW92128799A TW200515851A TW 200515851 A TW200515851 A TW 200515851A TW 092128799 A TW092128799 A TW 092128799A TW 92128799 A TW92128799 A TW 92128799A TW 200515851 A TW200515851 A TW 200515851A
- Authority
- TW
- Taiwan
- Prior art keywords
- layer
- circuit layer
- conductive metal
- fabricating
- patterned circuit
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Abstract
A patterned circuit layer of a semiconductor package substrate and a method for fabricating the same are proposed. A substrate formed with an inner circuit layer thereon is proposed, and an insulating layer is formed thereon with a plurality of openings penetrating therethrough to expose the inner circuit layer. A conductive metal layer is formed on the surface of the insulating layer and the opening and a patterned resist layer is formed thereon to expose the conductive metal layer. After a patterned circuit layer is formed on the conductive metal layer by an electroplating process, the resist layer and the conductive metal layer underneath the resist layer are removed. Since the etching rate of the conductive metal layer is faster than the patterned circuit layer, the etching process for removing the conductive metal layer will not damage the circuit layer, so as to maintain the uniformity of the circuit layer dimension.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92128799A TWI223579B (en) | 2003-10-17 | 2003-10-17 | Patterned circuit layer of semiconductor package substrate and method for fabricating the same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW92128799A TWI223579B (en) | 2003-10-17 | 2003-10-17 | Patterned circuit layer of semiconductor package substrate and method for fabricating the same |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI223579B TWI223579B (en) | 2004-11-01 |
TW200515851A true TW200515851A (en) | 2005-05-01 |
Family
ID=34546341
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW92128799A TWI223579B (en) | 2003-10-17 | 2003-10-17 | Patterned circuit layer of semiconductor package substrate and method for fabricating the same |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI223579B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI425895B (en) * | 2008-12-11 | 2014-02-01 | Unimicron Technology Corp | Manufacturing process of circuit substrate |
US9113562B2 (en) | 2009-07-24 | 2015-08-18 | Ibiden Co., Ltd. | Manufacturing method for printed wiring board |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9633951B2 (en) | 2005-11-10 | 2017-04-25 | Infineon Technologies Americas Corp. | Semiconductor package including a semiconductor die having redistributed pads |
-
2003
- 2003-10-17 TW TW92128799A patent/TWI223579B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI425895B (en) * | 2008-12-11 | 2014-02-01 | Unimicron Technology Corp | Manufacturing process of circuit substrate |
US9113562B2 (en) | 2009-07-24 | 2015-08-18 | Ibiden Co., Ltd. | Manufacturing method for printed wiring board |
Also Published As
Publication number | Publication date |
---|---|
TWI223579B (en) | 2004-11-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |