TW200515851A - Patterned circuit layer of semiconductor package substrate and method for fabricating the same - Google Patents

Patterned circuit layer of semiconductor package substrate and method for fabricating the same

Info

Publication number
TW200515851A
TW200515851A TW092128799A TW92128799A TW200515851A TW 200515851 A TW200515851 A TW 200515851A TW 092128799 A TW092128799 A TW 092128799A TW 92128799 A TW92128799 A TW 92128799A TW 200515851 A TW200515851 A TW 200515851A
Authority
TW
Taiwan
Prior art keywords
layer
circuit layer
conductive metal
fabricating
patterned circuit
Prior art date
Application number
TW092128799A
Other languages
Chinese (zh)
Other versions
TWI223579B (en
Inventor
Ruei-Chih Chang
Original Assignee
Phoenix Prec Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Phoenix Prec Technology Corp filed Critical Phoenix Prec Technology Corp
Priority to TW92128799A priority Critical patent/TWI223579B/en
Application granted granted Critical
Publication of TWI223579B publication Critical patent/TWI223579B/en
Publication of TW200515851A publication Critical patent/TW200515851A/en

Links

Landscapes

  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

A patterned circuit layer of a semiconductor package substrate and a method for fabricating the same are proposed. A substrate formed with an inner circuit layer thereon is proposed, and an insulating layer is formed thereon with a plurality of openings penetrating therethrough to expose the inner circuit layer. A conductive metal layer is formed on the surface of the insulating layer and the opening and a patterned resist layer is formed thereon to expose the conductive metal layer. After a patterned circuit layer is formed on the conductive metal layer by an electroplating process, the resist layer and the conductive metal layer underneath the resist layer are removed. Since the etching rate of the conductive metal layer is faster than the patterned circuit layer, the etching process for removing the conductive metal layer will not damage the circuit layer, so as to maintain the uniformity of the circuit layer dimension.
TW92128799A 2003-10-17 2003-10-17 Patterned circuit layer of semiconductor package substrate and method for fabricating the same TWI223579B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW92128799A TWI223579B (en) 2003-10-17 2003-10-17 Patterned circuit layer of semiconductor package substrate and method for fabricating the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW92128799A TWI223579B (en) 2003-10-17 2003-10-17 Patterned circuit layer of semiconductor package substrate and method for fabricating the same

Publications (2)

Publication Number Publication Date
TWI223579B TWI223579B (en) 2004-11-01
TW200515851A true TW200515851A (en) 2005-05-01

Family

ID=34546341

Family Applications (1)

Application Number Title Priority Date Filing Date
TW92128799A TWI223579B (en) 2003-10-17 2003-10-17 Patterned circuit layer of semiconductor package substrate and method for fabricating the same

Country Status (1)

Country Link
TW (1) TWI223579B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425895B (en) * 2008-12-11 2014-02-01 Unimicron Technology Corp Manufacturing process of circuit substrate
US9113562B2 (en) 2009-07-24 2015-08-18 Ibiden Co., Ltd. Manufacturing method for printed wiring board

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200731477A (en) 2005-11-10 2007-08-16 Int Rectifier Corp Semiconductor package including a semiconductor die having redistributed pads

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI425895B (en) * 2008-12-11 2014-02-01 Unimicron Technology Corp Manufacturing process of circuit substrate
US9113562B2 (en) 2009-07-24 2015-08-18 Ibiden Co., Ltd. Manufacturing method for printed wiring board

Also Published As

Publication number Publication date
TWI223579B (en) 2004-11-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees