JP2007318134A - 半導体移送装備（Ｓｅｍｉｃｏｎｄｕｃｔｏｒｍａｔｅｒｉａｌｈａｎｄｌｉｎｇｓｙｓｔｅｍ） - Google Patents

半導体移送装備（Ｓｅｍｉｃｏｎｄｕｃｔｏｒｍａｔｅｒｉａｌｈａｎｄｌｉｎｇｓｙｓｔｅｍ） Download PDF

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Publication number
JP2007318134A
JP2007318134A JP2007133371A JP2007133371A JP2007318134A JP 2007318134 A JP2007318134 A JP 2007318134A JP 2007133371 A JP2007133371 A JP 2007133371A JP 2007133371 A JP2007133371 A JP 2007133371A JP 2007318134 A JP2007318134 A JP 2007318134A
Authority
JP
Japan
Prior art keywords
wafer
hand
roller
transfer equipment
driven
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007133371A
Other languages
English (en)
Japanese (ja)
Inventor
Won Geyung Kim
ウォンキョン キム
Hyung-Seok Jang
ヒョンソク チャン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Naontech Co Ltd
Original Assignee
Naontech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Naontech Co Ltd filed Critical Naontech Co Ltd
Publication of JP2007318134A publication Critical patent/JP2007318134A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J9/00—Programme-controlled manipulators
    • B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
    • B25J9/04—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type by rotating at least one arm, excluding the head movement itself, e.g. cylindrical coordinate type or polar coordinate type
    • B25J9/041—Cylindrical coordinate type
    • B25J9/042—Cylindrical coordinate type comprising an articulated arm
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/141—Associated with semiconductor wafer handling includes means for gripping wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)
JP2007133371A 2006-05-22 2007-05-18 半導体移送装備（Ｓｅｍｉｃｏｎｄｕｃｔｏｒｍａｔｅｒｉａｌｈａｎｄｌｉｎｇｓｙｓｔｅｍ） Pending JP2007318134A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020060045536A KR100832772B1 (ko) 2006-05-22 2006-05-22 반도체이송장비

Publications (1)

Publication Number Publication Date
JP2007318134A true JP2007318134A (ja) 2007-12-06

Family

ID=38712147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007133371A Pending JP2007318134A (ja) 2006-05-22 2007-05-18 半導体移送装備（Ｓｅｍｉｃｏｎｄｕｃｔｏｒｍａｔｅｒｉａｌｈａｎｄｌｉｎｇｓｙｓｔｅｍ）

Country Status (3)

Country Link
US (1) US7661921B2 (ko)
JP (1) JP2007318134A (ko)
KR (1) KR100832772B1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013042112A (ja) * 2011-07-15 2013-02-28 Tokyo Electron Ltd 基板搬送装置、基板処理システムおよび基板搬送方法、ならびに記憶媒体
JP2013165241A (ja) * 2012-02-13 2013-08-22 Yaskawa Electric Corp 搬送装置
JP2014086472A (ja) * 2012-10-19 2014-05-12 Sinfonia Technology Co Ltd クランプ装置及びワーク搬送ロボット
TWI739350B (zh) * 2020-03-19 2021-09-11 樂華科技股份有限公司 半導體移載機之校正裝置及其方法

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JP5155517B2 (ja) * 2005-04-21 2013-03-06 株式会社荏原製作所 ウエハ受渡装置及びポリッシング装置
US7604449B1 (en) * 2005-06-27 2009-10-20 Kla-Tencor Technologies Corporation Equipment front end module
WO2011148560A1 (ja) * 2010-05-26 2011-12-01 株式会社アルバック 搬送方法
KR20130009700A (ko) * 2011-07-15 2013-01-23 도쿄엘렉트론가부시키가이샤 기판 반송 장치, 기판 처리 시스템, 기판 반송 방법, 및 기억 매체
JP5549655B2 (ja) * 2011-09-26 2014-07-16 株式会社安川電機 ハンドおよびロボット
US9431282B2 (en) * 2011-12-27 2016-08-30 Rudolph Technologies, Inc. Wafer inversion mechanism
US8944739B2 (en) * 2012-06-01 2015-02-03 Taiwan Semiconductor Manufacturing Co., Ltd. Loadport bridge for semiconductor fabrication tools
JP5989416B2 (ja) * 2012-06-20 2016-09-07 株式会社ディスコ ロボットハンド
US10363665B2 (en) 2012-07-10 2019-07-30 Persimmon Technologies Corporation Linear robot arm with multiple end effectors
US9076834B2 (en) * 2012-09-28 2015-07-07 United Microelectronics Corp. Spacer for thermal plate in semiconductor processing
US10199256B2 (en) 2013-09-28 2019-02-05 Applied Materials, Inc. Methods and systems for improved mask processing
CN105097623A (zh) * 2014-05-07 2015-11-25 盛美半导体设备（上海）有限公司 晶圆装载端口结构
CN104617025A (zh) * 2015-01-12 2015-05-13 北京七星华创电子股份有限公司 多腔室堆栈式晶圆处理设备及晶圆处理方法
US10399231B2 (en) 2017-05-22 2019-09-03 Taiwan Semiconductor Manufacturing Company, Ltd. Substrate handling contacts and methods
US10406562B2 (en) * 2017-07-21 2019-09-10 Applied Materials, Inc. Automation for rotary sorters
US11426783B2 (en) * 2019-03-12 2022-08-30 Nsk Ltd. Workpiece changer, workpiece conveyor device, processing device, method for manufacturing ring bearing, method for manufacturing machine, and method for manufacturing vehicle
TWI749802B (zh) * 2020-10-08 2021-12-11 南亞科技股份有限公司 輸送裝置
KR20230032399A (ko) 2021-08-31 2023-03-07 삼성전자주식회사 기판 분석 설비 및 방법
CN114121745B (zh) * 2021-11-26 2022-10-11 上海果纳半导体技术有限公司 一种用于晶圆装载盒门体的摆放系统

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JP2005525688A (ja) * 2001-08-31 2005-08-25 アシスト テクノロジーズ インコーポレイテッド 半導体材料取扱いシステムのための統一型フレーム

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JPH0596478A (ja) * 1991-10-03 1993-04-20 Seiko Seiki Co Ltd 磁気浮上型搬送装置
JP2867194B2 (ja) * 1992-02-05 1999-03-08 東京エレクトロン株式会社 処理装置及び処理方法
US5667353A (en) * 1995-03-31 1997-09-16 Inspex Inc. Robot system
US5765444A (en) * 1995-07-10 1998-06-16 Kensington Laboratories, Inc. Dual end effector, multiple link robot arm system with corner reacharound and extended reach capabilities
FR2778496B1 (fr) * 1998-05-05 2002-04-19 Recif Sa Procede et dispositif de changement de position d'une plaque de semi-conducteur
US6623235B2 (en) * 2001-04-11 2003-09-23 Pri Automation, Inc. Robot arm edge gripping device for handling substrates using two four-bar linkages
US7066707B1 (en) * 2001-08-31 2006-06-27 Asyst Technologies, Inc. Wafer engine
JP2003203963A (ja) * 2002-01-08 2003-07-18 Tokyo Electron Ltd 搬送機構、処理システム及び搬送方法
FR2835337B1 (fr) * 2002-01-29 2004-08-20 Recif Sa Procede et dispositif d'identification de caracteres inscrits sur une plaque de semi-conducteur comportant au moins une marque d'orientation
US6769861B2 (en) * 2002-10-08 2004-08-03 Brooks Automation Inc. Apparatus for alignment and orientation of a wafer for processing
US20050035046A1 (en) * 2003-06-06 2005-02-17 Hanson Kyle M. Wet chemical processing chambers for processing microfeature workpieces
JP2005191464A (ja) * 2003-12-26 2005-07-14 Harmotec Corp アライメント機構およびウェハ搬送ハンド

Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JP2005525688A (ja) * 2001-08-31 2005-08-25 アシスト テクノロジーズ インコーポレイテッド 半導体材料取扱いシステムのための統一型フレーム

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2013042112A (ja) * 2011-07-15 2013-02-28 Tokyo Electron Ltd 基板搬送装置、基板処理システムおよび基板搬送方法、ならびに記憶媒体
JP2013165241A (ja) * 2012-02-13 2013-08-22 Yaskawa Electric Corp 搬送装置
JP2014086472A (ja) * 2012-10-19 2014-05-12 Sinfonia Technology Co Ltd クランプ装置及びワーク搬送ロボット
TWI739350B (zh) * 2020-03-19 2021-09-11 樂華科技股份有限公司 半導體移載機之校正裝置及其方法

Also Published As

Publication number Publication date
US20070269302A1 (en) 2007-11-22
KR20070112527A (ko) 2007-11-27
US7661921B2 (en) 2010-02-16
KR100832772B1 (ko) 2008-05-27

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