JP2007266471A - 半導体製造装置及び半導体装置の製造方法 - Google Patents
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- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
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- 238000011084 recovery Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/324—Thermal treatment for modifying the properties of semiconductor bodies, e.g. annealing, sintering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67115—Apparatus for thermal treatment mainly by radiation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
- H01L21/82—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
- H01L21/822—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
- H01L21/8232—Field-effect technology
- H01L21/8234—MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
- H01L21/8238—Complementary field-effect transistors, e.g. CMOS
- H01L21/823814—Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the source or drain structures, e.g. specific source or drain implants or silicided source or drain structures or raised source or drain structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66568—Lateral single gate silicon transistors
- H01L29/66575—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate
- H01L29/6659—Lateral single gate silicon transistors where the source and drain or source and drain extensions are self-aligned to the sides of the gate with both lightly doped source and drain extensions and source and drain self-aligned to the sides of the gate, e.g. lightly doped drain [LDD] MOSFET, double diffused drain [DDD] MOSFET
Abstract
【解決手段】 被処理基体1を配置する処理室30と、処理室30の上方に配置された複数のランプ35a〜35jと、被処理基体1の方向に対して複数のランプ35a〜35jの後方に位置し、複数のランプ35a〜35jの光に対する反射率の面内分布を空間的に制御して、複数のランプ35a〜35jの光を被処理基体に照射する反射手段36とを備える。
【選択図】 図1
Description
本発明の実施の形態に係る半導体製造装置は、図1に示すように、被処理基体1を配置する処理室30と、処理室30の上方に配置された複数のランプ35a,35b,35c,35d,35e,35f,35g,35h,35i,35jと、被処理基体1の方向に対して複数のランプ35a〜35jの後方に位置し、複数のランプ35a〜35jの光に対する反射率の面内分布を空間的に制御して、複数のランプ35a〜35jの光を被処理基体に照射する反射手段(反射板36)とを備える。
本発明の実施の形態に係る半導体装置の製造方法を、半導体装置の基本素子の1つである相補型MOS(CMOS)トランジスタの製造工程を例に、図11〜図20を参照しながら説明する。なお、半導体装置の基本素子は、CMOSトランジスタに限定されない。例えば、pMOSトランジスタやnMOSトランジスタ等であってもよい。また、酸化膜だけでなく、窒化膜、酸窒化膜等の金属・絶縁膜・半導体(MIS)トランジスタであってもよいことは勿論である。
次にフラッシュランプ処理を行なうが、ここで均一性調整を行なうため調整用基板を用意する。加工前のパターンのないシリコン単結晶基板に、図18に示す半導体基板1のpMOSあるいはnMOSのエクステンションあるいはソース・ドレインと同様のイオン注入を行なったウエハを複数枚用意する。
実施の形態の変形例に係る半導体製造装置は、図22に示すように、複数のランプ35a〜35jの光に対する反射率の面内分布を空間的に制御して、複数のランプ35a〜35jの光を被処理基体1に照射する反射手段として、処理室30の内壁に配置され、複数の開口部460a,460xを有する反射部材46と、開口部460a,460cのそれぞれに埋め込まれた複数の反射抑止部材38a,38xと、反射抑止部材38a,38xのそれぞれを覆う可動式の複数の遮光板37a,37xとを備える点が、図1に示す半導体製造装置と異なる。
30…処理室
31…加熱源
32…サセプタ
33…透明窓
34…ランプハウジング
35a〜35j…ランプ
36…反射板
37a,37b,37c,…遮光板
38a,38x…反射抑止部材
40…冷却水
46…反射部材
55…絶縁膜
Claims (5)
- 被処理基体を配置する処理室と、
前記処理室の上方に配置された複数のランプと、
前記被処理基体の方向に対して前記複数のランプの後方に位置し、前記複数のランプの光に対する反射率の面内分布を空間的に制御して、前記複数のランプの光を前記被処理基体に照射する反射手段
とを備えることを特徴とする半導体製造装置。 - 前記反射手段が、
複数の開口部を有する反射板と、
前記開口部のそれぞれを覆う可動式の複数の遮光板
とを備えることを特徴とする請求項1に記載の半導体製造装置。 - 前記反射手段が、
前記処理室の内壁に配置され、複数の開口部を有する反射部材と、
前記開口部のそれぞれに埋め込まれた複数の反射抑止部材と、
前記反射抑止部材のそれぞれを覆う可動式の複数の遮光板
とを備えることを特徴とする請求項1に記載の半導体製造装置。 - 第1及び第2の半導体基板に不純物のイオンを注入し、第1及び第2の被処理基体をそれぞれ形成するステップと、
前記第1の被処理基体を処理室に搬入し、前記処理室の上方及び内壁のいずれかに配置された反射手段の複数の開口部を複数の遮光板で覆い、前記第1の被処理基体を複数のランプにより光照射して、前記第1の半導体基板に注入されたイオンを活性化して第1の不純物拡散層を形成するステップと、
前記第1の被処理基体に形成された前記第1の不純物拡散層の電気的特性を測定するステップと、
前記処理結果に基づいて前記遮光板を動かして前記開口部の開度を調節するステップと、
前記調節後に、前記第2の被処理基体を前記ランプにより光照射して前記第2の半導体基板に注入されたイオンを活性化して第2の不純物拡散層を形成するステップ
とを含むことを特徴とする不純物拡散層を備えた半導体装置の製造方法。 - 前記開口部の開度を調節するステップが、前記反射板の全面にマトリクス状に形成された前記開口部を覆う前記遮光板を選択的に動かすことを特徴とする請求項4に記載の不純物拡散層を備えた半導体装置の製造方法。
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JP2006091812A JP4896555B2 (ja) | 2006-03-29 | 2006-03-29 | 半導体製造装置及び半導体装置の製造方法 |
US11/727,519 US7643736B2 (en) | 2006-03-29 | 2007-03-27 | Apparatus and method for manufacturing semiconductor devices |
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JP2006091812A JP4896555B2 (ja) | 2006-03-29 | 2006-03-29 | 半導体製造装置及び半導体装置の製造方法 |
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JP2007266471A true JP2007266471A (ja) | 2007-10-11 |
JP4896555B2 JP4896555B2 (ja) | 2012-03-14 |
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JP (1) | JP4896555B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009272399A (ja) * | 2008-05-02 | 2009-11-19 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JP2016181656A (ja) * | 2015-03-25 | 2016-10-13 | 株式会社Screenホールディングス | 熱処理装置、および熱処理装置の調整方法 |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2009164525A (ja) * | 2008-01-10 | 2009-07-23 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
US20100096569A1 (en) * | 2008-10-21 | 2010-04-22 | Applied Materials, Inc. | Ultraviolet-transmitting microwave reflector comprising a micromesh screen |
US7964858B2 (en) | 2008-10-21 | 2011-06-21 | Applied Materials, Inc. | Ultraviolet reflector with coolant gas holes and method |
JP2010199419A (ja) * | 2009-02-26 | 2010-09-09 | Toshiba Corp | 半導体処理装置 |
US9337059B2 (en) | 2011-08-23 | 2016-05-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus and methods for annealing wafers |
KR102416569B1 (ko) * | 2015-08-27 | 2022-07-04 | 삼성디스플레이 주식회사 | 레이저 결정화 장치 |
JP6849368B2 (ja) * | 2016-09-30 | 2021-03-24 | 芝浦メカトロニクス株式会社 | 基板処理装置 |
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JP2003077852A (ja) | 2001-09-03 | 2003-03-14 | Dainippon Screen Mfg Co Ltd | 熱処理装置および熱処理方法 |
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2006
- 2006-03-29 JP JP2006091812A patent/JP4896555B2/ja not_active Expired - Fee Related
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2007
- 2007-03-27 US US11/727,519 patent/US7643736B2/en not_active Expired - Fee Related
Patent Citations (8)
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JPS632318A (ja) * | 1986-06-23 | 1988-01-07 | Hitachi Ltd | ランプ加熱装置 |
JPH02285338A (ja) * | 1989-04-27 | 1990-11-22 | Asahi Optical Co Ltd | 照明装置 |
JPH06318558A (ja) * | 1991-02-26 | 1994-11-15 | Hitachi Vlsi Eng Corp | ランプアニール装置 |
JP2000505961A (ja) * | 1996-12-20 | 2000-05-16 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 急速熱処理用炉 |
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JP2005108967A (ja) * | 2003-09-29 | 2005-04-21 | Hitachi Kokusai Electric Inc | 基板処理装置 |
JP2005347704A (ja) * | 2004-06-07 | 2005-12-15 | Toshiba Corp | 熱処理装置、熱処理方法及び半導体装置の製造方法 |
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JP2009272399A (ja) * | 2008-05-02 | 2009-11-19 | Dainippon Screen Mfg Co Ltd | 熱処理装置 |
JP2016181656A (ja) * | 2015-03-25 | 2016-10-13 | 株式会社Screenホールディングス | 熱処理装置、および熱処理装置の調整方法 |
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US7643736B2 (en) | 2010-01-05 |
US20070232083A1 (en) | 2007-10-04 |
JP4896555B2 (ja) | 2012-03-14 |
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