JP2007234930A - 電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法 - Google Patents
電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法 Download PDFInfo
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Abstract
【解決手段】電子部品内蔵モジュール10は、樹脂配線基板11と、樹脂配線基板11の表面に搭載される複数の電子部品15,15,…と、各電子部品15を樹脂配線基板11に電気的に接続する半田22と、各電子部品15および半田22を封止する封止樹脂21とを備えている。そして、封止樹脂21の平均線膨張係数αが17×10-6以上110×10-6/℃以下であり、平均線膨張係数αはその樹脂のガラス転移温度と、ガラス転移温度以下の線膨張係数α1と、ガラス転移温度以上の線膨張係数α2と、室内の温度と、リフロー時のピーク温度とを用いて算出される。
【選択図】図1
Description
ここで、数式1において、
α1;ガラス転移温度以下の温度における封止樹脂の線膨張係数の値
α2;ガラス転位温度以上の温度における封止樹脂の線膨張係数の値
Tg;封止樹脂のガラス転移温度
Tr;室内温度
Tp;リフローにおけるピーク温度、である。
ここで、数式1において、
α1;ガラス転移温度以下の温度における封止樹脂の線膨張係数の値
α2;ガラス転位温度以上の温度における封止樹脂の線膨張係数の値
Tg;封止樹脂のガラス転移温度
Tr;室内温度
Tp;リフローにおけるピーク温度、である。
数式1において、α1は封止樹脂のガラス転移温度以下での線膨張係数であり、α2は封止樹脂のガラス転移温度以上での線膨張係数である。また、Tgは封止樹脂のガラス転移温度であり、Trは室内温度であり、Tpはリフロー時の一般的なピーク温度である。
11 樹脂配線基板(配線基板)
14 接続端子
15 チップ部品(表面実装型電子部品)
16 端子電極(電極部)
17 ICチップ(半導体素子)
18 素子電極(電極部)
21 封止樹脂
22 半田接続部(半田)
Claims (12)
- リフローにより実装基板に実装される電子部品内蔵モジュールであって、
配線基板と、
前記配線基板の表面に搭載された複数個の電子部品と、
前記複数個の電子部品のそれぞれを前記配線基板の表面に電気的に接続する半田と、
前記配線基板の表面に設けられ、前記電子部品および前記半田を封止する封止樹脂とを備え、
以下の数式1を用いて算出された前記封止樹脂の平均線膨張係数αが、17×10-6/℃以上110×10-6/ ℃以下であることを特徴とする電子部品内蔵モジュール。
α={α1×(Tg−Tr)+α2×(Tp−Tg)}/(Tp−Tr)・・・数式1
ここで、数式1において、
α1;ガラス転移温度以下の温度における前記封止樹脂の線膨張係数の値
α2;ガラス転位温度以上の温度における前記封止樹脂の線膨張係数の値
Tg;前記封止樹脂のガラス転移温度
Tr;室内温度
Tp;前記リフローにおけるピーク温度、である - 前記電子部品は、それぞれ、チップ状の表面実装型電子部品であり、コンデンサ、抵抗およびコイルから選択された少なくとも1つである請求項1に記載の電子部品内蔵モジュール。
- 前記封止樹脂には、無機フィラーが含まれており、
前記封止樹脂に対する前記無機フィラーの含有量は、質量に換算して、70%以上90%以下である請求項1または2に記載の電子部品内蔵モジュール。 - 前記無機フィラーは、Al2O3、MgO、BN、AlNおよびSiO2から選択された少なくとも1つを含んでいる請求項3に記載の電子部品内蔵モジュール。
- 前記封止樹脂の粘度が、25℃において50Pa・s以上100Pa・s以下であり、
前記封止樹脂のチクソ比が、25℃において0.8以上1.5以下である請求項1から4のいずれか1項に記載の電子部品内蔵モジュール。 - 前記封止樹脂は、エポキシ樹脂およびシリコーン樹脂から選択された少なくとも1つを含む請求項1から5のいずれか1項に記載の電子部品内蔵モジュール。
- 前記配線基板は、樹脂配線基板である請求項1から6のいずれか1項に記載の電子部品内蔵モジュール。
- 前記配線基板は、セラミック配線基板である請求項1から6のいずれか1項に記載の電子部品内蔵モジュール。
- リフローにより実装基板に実装される電子部品内蔵モジュールを製造する方法であって、
半田を用いて、配線基板の表面に電子部品を電気的に接続する接続工程と、
酸素およびアルゴンガスから選択された少なくとも1つを含むガスを用いてプラズマを発生させ、該プラズマを用いて前記配線基板の表面を洗浄する洗浄工程と、
前記配線基板の表面に封止樹脂を設け、前記電子部品および前記半田を封止する封止工程とを備え
前記封止工程では、前記封止樹脂として、以下の数式1を用いて算出された平均線膨張係数αが17×10-6/ ℃以上110×10-6/ ℃以下である樹脂を用いることを特徴とする電子部品内蔵モジュールの製造方法。
α={α1×(Tg−Tr)+α2×(Tp−Tg)}/(Tp−Tr)・・・数式1
ここで、数式1において、
α1;ガラス転移温度以下の温度における前記封止樹脂の線膨張係数の値
α2;ガラス転位温度以上の温度における前記封止樹脂の線膨張係数の値
Tg;前記封止樹脂のガラス転移温度
Tr;室内温度
Tp;前記リフローにおけるピーク温度、である - 前記封止工程では、印刷法により前記配線基板の表面に前記封止樹脂を設けることを特徴とする請求項9に記載の電子部品内蔵モジュールの製造方法。
- 前記封止工程では、減圧下で前記電子部品および前記半田を封止することを特徴とする請求項9に記載の電子部品内蔵モジュールの製造方法。
- 前記接続工程では、所定形状の配線が形成された領域が表面に複数存在する母材基板を前記配線基板として用い、複数の該領域内の該所定形状の配線にそれぞれ複数個の前記電子部品を電気的に接続し、
前記封止工程の後に、前記母材基板を前記領域ごとに分割して一枚の前記母材基板から複数個の電子部品内蔵モジュールを製造する分割工程をさらに備えていることを特徴とする請求項9から11のいずれか1項に記載の電子部品内蔵モジュールの製造方法。
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JP2006055922A JP4484831B2 (ja) | 2006-03-02 | 2006-03-02 | 電子部品内蔵モジュールおよび電子部品内蔵モジュールの製造方法 |
CN2007100850720A CN101034700B (zh) | 2006-03-02 | 2007-02-28 | 内藏电子部件型模块及内藏电子部件型模块的制作方法 |
US11/712,904 US8023277B2 (en) | 2006-03-02 | 2007-03-02 | Electronic component integrated module |
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JP2009130230A (ja) * | 2007-11-27 | 2009-06-11 | Kyocera Corp | 電力制御モジュール |
JP2018142967A (ja) * | 2012-07-11 | 2018-09-13 | スカイワークスフィルターソリューションズジャパン株式会社 | 電子部品 |
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US9171818B2 (en) * | 2011-12-13 | 2015-10-27 | Cyntec Co., Ltd. | Package structure and the method to manufacture thereof |
CN106449370A (zh) * | 2016-11-24 | 2017-02-22 | 广东美的制冷设备有限公司 | 等离子体清洗方法、封装方法、功率模块和空调器 |
CN106449371B (zh) * | 2016-11-24 | 2019-11-12 | 广东美的制冷设备有限公司 | 等离子体清洗方法、封装方法、功率模块和空调器 |
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US5264065A (en) * | 1990-06-08 | 1993-11-23 | Amp-Akzo Corporation | Printed circuits and base materials having low Z-axis thermal expansion |
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US6534346B2 (en) * | 2000-05-16 | 2003-03-18 | Nippon Electric Glass Co., Ltd. | Glass and glass tube for encapsulating semiconductors |
WO2002024808A1 (en) * | 2000-09-25 | 2002-03-28 | Hitachi Chemical Co., Ltd. | Epoxy resin molding material for sealing |
JP2002190564A (ja) | 2000-12-20 | 2002-07-05 | Taiyo Yuden Co Ltd | ハイブリッドic及びその製造方法 |
JP2002208668A (ja) * | 2001-01-10 | 2002-07-26 | Hitachi Ltd | 半導体装置およびその製造方法 |
JP3952143B2 (ja) | 2001-12-25 | 2007-08-01 | 信越化学工業株式会社 | 液状エポキシ樹脂組成物及び半導体装置 |
WO2004060034A1 (ja) * | 2002-12-24 | 2004-07-15 | Matsushita Electric Industrial Co., Ltd. | 電子部品内蔵モジュール |
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JP2005144522A (ja) | 2003-11-19 | 2005-06-09 | Murata Mfg Co Ltd | はんだ付け方法およびこのはんだ付け方法を用いた実装物品 |
JP2005167100A (ja) | 2003-12-05 | 2005-06-23 | Matsushita Electric Ind Co Ltd | 半導体装置の製造方法およびそのためのマスク |
JP2005197422A (ja) | 2004-01-07 | 2005-07-21 | Renesas Technology Corp | 半導体装置及び電子装置 |
JP2004143466A (ja) | 2004-02-04 | 2004-05-20 | Hitachi Chem Co Ltd | 封止用エポキシ樹脂成形材料及び電子部品装置 |
-
2006
- 2006-03-02 JP JP2006055922A patent/JP4484831B2/ja not_active Expired - Fee Related
-
2007
- 2007-02-28 CN CN2007100850720A patent/CN101034700B/zh not_active Expired - Fee Related
- 2007-03-02 US US11/712,904 patent/US8023277B2/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2009130230A (ja) * | 2007-11-27 | 2009-06-11 | Kyocera Corp | 電力制御モジュール |
JP2018142967A (ja) * | 2012-07-11 | 2018-09-13 | スカイワークスフィルターソリューションズジャパン株式会社 | 電子部品 |
Also Published As
Publication number | Publication date |
---|---|
CN101034700A (zh) | 2007-09-12 |
JP4484831B2 (ja) | 2010-06-16 |
US8023277B2 (en) | 2011-09-20 |
US20070216039A1 (en) | 2007-09-20 |
CN101034700B (zh) | 2011-04-06 |
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