JP2007224228A - 回路接続材料並びに回路端子の接続構造体及び接続方法 - Google Patents
回路接続材料並びに回路端子の接続構造体及び接続方法 Download PDFInfo
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Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Wire Bonding (AREA)
- Non-Insulated Conductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006049624A JP2007224228A (ja) | 2006-02-27 | 2006-02-27 | 回路接続材料並びに回路端子の接続構造体及び接続方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006049624A JP2007224228A (ja) | 2006-02-27 | 2006-02-27 | 回路接続材料並びに回路端子の接続構造体及び接続方法 |
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|---|---|---|---|
| JP2011157627A Division JP5365666B2 (ja) | 2011-07-19 | 2011-07-19 | 回路接続材料並びに回路端子の接続構造体及び接続方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2007224228A true JP2007224228A (ja) | 2007-09-06 |
| JP2007224228A5 JP2007224228A5 (enrdf_load_stackoverflow) | 2011-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| JP2006049624A Pending JP2007224228A (ja) | 2006-02-27 | 2006-02-27 | 回路接続材料並びに回路端子の接続構造体及び接続方法 |
Country Status (1)
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| JP (1) | JP2007224228A (enrdf_load_stackoverflow) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135255A (ja) * | 2008-12-08 | 2010-06-17 | Sony Chemical & Information Device Corp | 異方性導電フィルム、並びに、接合体及びその製造方法 |
| JP2010280896A (ja) * | 2010-08-06 | 2010-12-16 | Sony Chemical & Information Device Corp | 対向電極接続用接着剤 |
| JP2013229314A (ja) * | 2012-03-30 | 2013-11-07 | Sekisui Chem Co Ltd | 導電材料、接続構造体及び接続構造体の製造方法 |
| JP2014074139A (ja) * | 2012-10-05 | 2014-04-24 | Dexerials Corp | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
| KR20140059828A (ko) | 2011-09-06 | 2014-05-16 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 접속체 |
| JP2015183118A (ja) * | 2014-03-25 | 2015-10-22 | 日立化成株式会社 | 接着剤組成物、異方導電性接着剤組成物、回路接続材料及び接続体 |
| WO2021111978A1 (ja) * | 2019-12-03 | 2021-06-10 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP2021093357A (ja) * | 2019-12-03 | 2021-06-17 | デクセリアルズ株式会社 | 異方性導電フィルム |
| KR20220058611A (ko) | 2019-12-03 | 2022-05-09 | 데쿠세리아루즈 가부시키가이샤 | 필름 권장체 및 접속체의 제조 방법 |
| KR20250027845A (ko) | 2022-08-30 | 2025-02-27 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법 |
| KR20250057889A (ko) | 2022-11-30 | 2025-04-29 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법 |
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| JPH10168412A (ja) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
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| JP2005325161A (ja) * | 2004-05-12 | 2005-11-24 | Hitachi Chem Co Ltd | 異方導電性接着フィルム及びその製造方法並びにそれらを用いた回路接続構造体 |
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| JPH10168412A (ja) * | 1996-12-10 | 1998-06-23 | Sumitomo Bakelite Co Ltd | 異方導電性接着剤 |
| JPH11191320A (ja) * | 1997-12-26 | 1999-07-13 | Sony Chem Corp | 異方性導電接着フィルム |
| JP2002285135A (ja) * | 2001-03-27 | 2002-10-03 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤及びこれを用いた接続構造 |
| JP2002367692A (ja) * | 2001-06-11 | 2002-12-20 | Shin Etsu Polymer Co Ltd | 異方導電性接着剤及びそれを用いた接続構造 |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010135255A (ja) * | 2008-12-08 | 2010-06-17 | Sony Chemical & Information Device Corp | 異方性導電フィルム、並びに、接合体及びその製造方法 |
| JP2010280896A (ja) * | 2010-08-06 | 2010-12-16 | Sony Chemical & Information Device Corp | 対向電極接続用接着剤 |
| KR20140059828A (ko) | 2011-09-06 | 2014-05-16 | 히타치가세이가부시끼가이샤 | 접착제 조성물 및 접속체 |
| JP2013229314A (ja) * | 2012-03-30 | 2013-11-07 | Sekisui Chem Co Ltd | 導電材料、接続構造体及び接続構造体の製造方法 |
| JP2014074139A (ja) * | 2012-10-05 | 2014-04-24 | Dexerials Corp | 回路接続材料及びその製造方法、並びにそれを用いた実装体の製造方法 |
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| WO2021111978A1 (ja) * | 2019-12-03 | 2021-06-10 | デクセリアルズ株式会社 | 異方性導電フィルム |
| JP2021093357A (ja) * | 2019-12-03 | 2021-06-17 | デクセリアルズ株式会社 | 異方性導電フィルム |
| KR20220058611A (ko) | 2019-12-03 | 2022-05-09 | 데쿠세리아루즈 가부시키가이샤 | 필름 권장체 및 접속체의 제조 방법 |
| KR20220061166A (ko) | 2019-12-03 | 2022-05-12 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
| CN114787307A (zh) * | 2019-12-03 | 2022-07-22 | 迪睿合株式会社 | 各向异性导电膜 |
| KR102801141B1 (ko) * | 2019-12-03 | 2025-04-25 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름 |
| KR20250027845A (ko) | 2022-08-30 | 2025-02-27 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법 |
| KR20250057889A (ko) | 2022-11-30 | 2025-04-29 | 데쿠세리아루즈 가부시키가이샤 | 이방성 도전 필름, 접속 구조체 및 접속 구조체의 제조 방법 |
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