JP2007186590A5 - - Google Patents
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- Publication number
- JP2007186590A5 JP2007186590A5 JP2006005673A JP2006005673A JP2007186590A5 JP 2007186590 A5 JP2007186590 A5 JP 2007186590A5 JP 2006005673 A JP2006005673 A JP 2006005673A JP 2006005673 A JP2006005673 A JP 2006005673A JP 2007186590 A5 JP2007186590 A5 JP 2007186590A5
- Authority
- JP
- Japan
- Prior art keywords
- groups
- semiconductor device
- adhesive composition
- epoxy
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000000853 adhesive Substances 0.000 claims description 14
- 230000001070 adhesive effect Effects 0.000 claims description 14
- 239000003822 epoxy resin Substances 0.000 claims description 14
- 229920000647 polyepoxide Polymers 0.000 claims description 14
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 8
- 125000002723 alicyclic group Chemical group 0.000 claims description 7
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 125000003700 epoxy group Chemical group 0.000 claims description 6
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 4
- 125000000524 functional group Chemical group 0.000 claims description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims description 4
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 claims description 4
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 claims description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 4
- 125000005372 silanol group Chemical group 0.000 claims description 4
- 229920005992 thermoplastic resin Polymers 0.000 claims description 4
- 125000003396 thiol group Chemical group [H]S* 0.000 claims description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 4
- 150000008065 acid anhydrides Chemical class 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 230000001681 protective effect Effects 0.000 claims description 2
- 239000012790 adhesive layer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 125000003518 norbornenyl group Chemical group C12(C=CC(CC1)C2)* 0.000 claims 1
- 125000003003 spiro group Chemical group 0.000 claims 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- -1 3,4-epoxycyclohexylmethyl (3,4-epoxycyclohexane) carboxylate Chemical class 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- QYCGBAJADAGLLK-UHFFFAOYSA-N 1-(cyclohepten-1-yl)cycloheptene Chemical compound C1CCCCC=C1C1=CCCCCC1 QYCGBAJADAGLLK-UHFFFAOYSA-N 0.000 description 1
- PDAZMXUHGPNZOU-UHFFFAOYSA-N 2-ethylpropane-1,2,3-triol Chemical compound CCC(O)(CO)CO PDAZMXUHGPNZOU-UHFFFAOYSA-N 0.000 description 1
- ULPDSNLBZMHGPI-UHFFFAOYSA-N 4-methyl-7-oxabicyclo[4.1.0]heptane Chemical compound C1C(C)CCC2OC21 ULPDSNLBZMHGPI-UHFFFAOYSA-N 0.000 description 1
- OECTYKWYRCHAKR-UHFFFAOYSA-N 4-vinylcyclohexene dioxide Chemical compound C1OC1C1CC2OC2CC1 OECTYKWYRCHAKR-UHFFFAOYSA-N 0.000 description 1
- GJEZBVHHZQAEDB-UHFFFAOYSA-N 6-oxabicyclo[3.1.0]hexane Chemical compound C1CCC2OC21 GJEZBVHHZQAEDB-UHFFFAOYSA-N 0.000 description 1
- 229920002614 Polyether block amide Polymers 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 150000007942 carboxylates Chemical class 0.000 description 1
- 239000011353 cycloaliphatic epoxy resin Substances 0.000 description 1
- ZWAJLVLEBYIOTI-UHFFFAOYSA-N cyclohexene oxide Chemical compound C1CCCC2OC21 ZWAJLVLEBYIOTI-UHFFFAOYSA-N 0.000 description 1
- FWFSEYBSWVRWGL-UHFFFAOYSA-N cyclohexene oxide Natural products O=C1CCCC=C1 FWFSEYBSWVRWGL-UHFFFAOYSA-N 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006005673A JP4961747B2 (ja) | 2006-01-13 | 2006-01-13 | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体装置接続用基板ならびに半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006005673A JP4961747B2 (ja) | 2006-01-13 | 2006-01-13 | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体装置接続用基板ならびに半導体装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007186590A JP2007186590A (ja) | 2007-07-26 |
| JP2007186590A5 true JP2007186590A5 (enExample) | 2009-01-15 |
| JP4961747B2 JP4961747B2 (ja) | 2012-06-27 |
Family
ID=38341974
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006005673A Expired - Fee Related JP4961747B2 (ja) | 2006-01-13 | 2006-01-13 | 半導体装置用接着剤組成物およびそれを用いた半導体装置用接着剤シート、半導体装置接続用基板ならびに半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4961747B2 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5239661B2 (ja) * | 2007-09-13 | 2013-07-17 | 東レ株式会社 | カバーレイフィルム |
| JP5521364B2 (ja) * | 2008-03-18 | 2014-06-11 | 日立化成株式会社 | 接着シート |
| JP5436827B2 (ja) * | 2008-03-21 | 2014-03-05 | 日立化成株式会社 | 半導体装置の製造方法 |
| JP5439863B2 (ja) * | 2008-03-26 | 2014-03-12 | 日立化成株式会社 | 半導体封止用接着剤、半導体封止用フィルム状接着剤、半導体装置及びその製造方法 |
| JP2012094716A (ja) * | 2010-10-27 | 2012-05-17 | Asahi Kasei E-Materials Corp | 接続構造体及びその製造方法 |
| EP2734184B1 (en) * | 2011-07-21 | 2018-03-28 | Croda International Plc | Branched polyether-polyamide block copolymers and methods of making and using the same |
| CN104356990A (zh) * | 2014-11-23 | 2015-02-18 | 桂林理工大学 | 一种光学零件用胶黏剂的制备方法 |
| WO2016175612A1 (ko) | 2015-04-29 | 2016-11-03 | 주식회사 엘지화학 | 반도체용 접착 필름 |
| JP6817592B2 (ja) * | 2017-03-08 | 2021-01-20 | パナソニックＩｐマネジメント株式会社 | 熱硬化性接着フィルム |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0343481A (ja) * | 1989-06-26 | 1991-02-25 | Raytheon Co | エポキシ接着剤 |
| JPH09100452A (ja) * | 1995-10-03 | 1997-04-15 | Bando Chem Ind Ltd | 半導体用接着テープ |
| JPH09181128A (ja) * | 1995-12-25 | 1997-07-11 | Bando Chem Ind Ltd | 半導体用接着テープの製造方法 |
| JPH09321094A (ja) * | 1996-03-29 | 1997-12-12 | Toray Ind Inc | Ｔａｂ用接着剤付きテープおよび半導体接続基板並びに半導体装置 |
| JPH11228932A (ja) * | 1998-02-18 | 1999-08-24 | Kanegafuchi Chem Ind Co Ltd | 電子部品用接着剤組成物および電子部品用接着テープ |
| JP2004307846A (ja) * | 2003-03-24 | 2004-11-04 | Sumitomo Bakelite Co Ltd | 表示素子基板用エポキシ樹脂組成物 |
-
2006
- 2006-01-13 JP JP2006005673A patent/JP4961747B2/ja not_active Expired - Fee Related
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