JP2007184425A5 - - Google Patents
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- Publication number
- JP2007184425A5 JP2007184425A5 JP2006001801A JP2006001801A JP2007184425A5 JP 2007184425 A5 JP2007184425 A5 JP 2007184425A5 JP 2006001801 A JP2006001801 A JP 2006001801A JP 2006001801 A JP2006001801 A JP 2006001801A JP 2007184425 A5 JP2007184425 A5 JP 2007184425A5
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- recess
- emitting element
- emitting device
- housing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002923 metal particle Substances 0.000 claims 5
- 239000004020 conductor Substances 0.000 claims 4
- 238000004519 manufacturing process Methods 0.000 claims 4
- 238000000034 method Methods 0.000 claims 3
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 229910052751 metal Inorganic materials 0.000 claims 2
- 239000002184 metal Substances 0.000 claims 2
- 150000002739 metals Chemical class 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 2
- 229910052697 platinum Inorganic materials 0.000 claims 2
- 230000002940 repellent Effects 0.000 claims 2
- 239000005871 repellent Substances 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000002904 solvent Substances 0.000 claims 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 2
- 239000000463 material Substances 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006001801A JP4996096B2 (ja) | 2006-01-06 | 2006-01-06 | 発光装置及びその製造方法 |
| EP06256575.9A EP1806792B1 (en) | 2006-01-06 | 2006-12-22 | Light emitting device and manufacturing method thereof |
| TW095148775A TW200746461A (en) | 2006-01-06 | 2006-12-25 | Light emitting device and manufacturing method thereof |
| US11/645,876 US7622747B2 (en) | 2006-01-06 | 2006-12-27 | Light emitting device and manufacturing method thereof |
| KR1020070000045A KR20070074466A (ko) | 2006-01-06 | 2007-01-02 | 발광 장치 및 그 제조 방법 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006001801A JP4996096B2 (ja) | 2006-01-06 | 2006-01-06 | 発光装置及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2007184425A JP2007184425A (ja) | 2007-07-19 |
| JP2007184425A5 true JP2007184425A5 (enExample) | 2009-02-05 |
| JP4996096B2 JP4996096B2 (ja) | 2012-08-08 |
Family
ID=37873115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006001801A Expired - Fee Related JP4996096B2 (ja) | 2006-01-06 | 2006-01-06 | 発光装置及びその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7622747B2 (enExample) |
| EP (1) | EP1806792B1 (enExample) |
| JP (1) | JP4996096B2 (enExample) |
| KR (1) | KR20070074466A (enExample) |
| TW (1) | TW200746461A (enExample) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007002476A2 (en) * | 2005-06-28 | 2007-01-04 | Lamina Ceramics, Inc. | Backlight module display with optical coupler and lightguide |
| US7719021B2 (en) * | 2005-06-28 | 2010-05-18 | Lighting Science Group Corporation | Light efficient LED assembly including a shaped reflective cavity and method for making same |
| CN101803047B (zh) * | 2007-09-20 | 2012-04-25 | 皇家飞利浦电子股份有限公司 | 准直器 |
| KR100902357B1 (ko) | 2007-11-05 | 2009-06-12 | 아로 주식회사 | 발광 다이오드 패키지 및 그 제조방법 |
| JP2009182083A (ja) * | 2008-01-30 | 2009-08-13 | Kyocera Corp | 発光装置 |
| DE102009019412A1 (de) | 2009-04-29 | 2010-11-04 | Fa. Austria Technologie & Systemtechnik Ag | Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren |
| KR101130137B1 (ko) * | 2010-07-02 | 2012-03-28 | 연세대학교 산학협력단 | 발광다이오드 모듈 |
| JP5242641B2 (ja) | 2010-08-25 | 2013-07-24 | シャープ株式会社 | 発光装置の製造方法 |
| JP2016086191A (ja) * | 2010-11-05 | 2016-05-19 | ローム株式会社 | 半導体発光装置 |
| JP5566268B2 (ja) * | 2010-11-19 | 2014-08-06 | 新光電気工業株式会社 | 発光装置及びパッケージ部品 |
| JP5887638B2 (ja) | 2011-05-30 | 2016-03-16 | 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． | 発光ダイオード |
| JP6097084B2 (ja) * | 2013-01-24 | 2017-03-15 | スタンレー電気株式会社 | 半導体発光装置 |
| CN104103734B (zh) * | 2013-04-02 | 2017-03-01 | 展晶科技(深圳)有限公司 | 发光二极管封装结构 |
| JP2014216588A (ja) * | 2013-04-30 | 2014-11-17 | 株式会社沖データ | 発光装置、その製造方法、画像表示装置、及び画像形成装置 |
| WO2015076591A1 (ko) | 2013-11-21 | 2015-05-28 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제작 방법 |
| KR101524046B1 (ko) * | 2013-11-21 | 2015-06-01 | 주식회사 루멘스 | 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제작 방법 |
| US10217904B2 (en) * | 2015-02-03 | 2019-02-26 | Epistar Corporation | Light-emitting device with metallized mounting support structure |
| JP2019017734A (ja) * | 2017-07-18 | 2019-02-07 | 新日本無線株式会社 | 発光装置及びその製造方法 |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5664484A (en) * | 1979-10-30 | 1981-06-01 | Toshiba Corp | Led device |
| JPS60261181A (ja) | 1984-06-07 | 1985-12-24 | Toshiba Corp | 光半導体装置 |
| JPS6216584A (ja) * | 1985-07-16 | 1987-01-24 | Toshiba Corp | 光半導体素子 |
| JP3329716B2 (ja) | 1997-12-15 | 2002-09-30 | 日亜化学工業株式会社 | チップタイプｌｅｄ |
| WO2003073520A1 (fr) * | 2002-02-28 | 2003-09-04 | Rohm Co.,Ltd. | Lampe a diode electroluminescente |
| DE10229067B4 (de) * | 2002-06-28 | 2007-08-16 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Verfahren zu dessen Herstellung |
| JP3655267B2 (ja) * | 2002-07-17 | 2005-06-02 | 株式会社東芝 | 半導体発光装置 |
| JP4352687B2 (ja) * | 2002-11-26 | 2009-10-28 | パナソニック電工株式会社 | 発光装置の製造方法 |
| JP2004247701A (ja) * | 2002-12-19 | 2004-09-02 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置 |
| JP3904210B2 (ja) * | 2003-04-28 | 2007-04-11 | 株式会社リコー | 光学電子デバイスの接合方法及び接合構造 |
| WO2005025787A1 (ja) * | 2003-09-12 | 2005-03-24 | National Institute Of Advanced Industrial Science And Technology | 微細な液滴の形状で噴射し、積層塗布可能な金属ナノ粒子分散液 |
| JP4774201B2 (ja) * | 2003-10-08 | 2011-09-14 | 日亜化学工業株式会社 | パッケージ成形体及び半導体装置 |
| JP2005159082A (ja) * | 2003-11-27 | 2005-06-16 | Kyocera Corp | 発光素子収納用パッケージおよび発光装置ならびに発光素子収納用パッケージの製造方法。 |
| JP4572312B2 (ja) * | 2004-02-23 | 2010-11-04 | スタンレー電気株式会社 | Ｌｅｄ及びその製造方法 |
| US20050225222A1 (en) * | 2004-04-09 | 2005-10-13 | Joseph Mazzochette | Light emitting diode arrays with improved light extraction |
| JP4659421B2 (ja) * | 2004-09-30 | 2011-03-30 | 株式会社トクヤマ | 発光素子収納用パッケージの製造方法 |
| KR101154801B1 (ko) * | 2004-12-03 | 2012-07-03 | 엔지케이 스파크 플러그 캄파니 리미티드 | 세라믹 기판 및 발광 소자 수납용 세라믹 패키지 |
-
2006
- 2006-01-06 JP JP2006001801A patent/JP4996096B2/ja not_active Expired - Fee Related
- 2006-12-22 EP EP06256575.9A patent/EP1806792B1/en not_active Ceased
- 2006-12-25 TW TW095148775A patent/TW200746461A/zh unknown
- 2006-12-27 US US11/645,876 patent/US7622747B2/en not_active Expired - Fee Related
-
2007
- 2007-01-02 KR KR1020070000045A patent/KR20070074466A/ko not_active Withdrawn