JP2020513696A5 - - Google Patents
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- Publication number
- JP2020513696A5 JP2020513696A5 JP2019531942A JP2019531942A JP2020513696A5 JP 2020513696 A5 JP2020513696 A5 JP 2020513696A5 JP 2019531942 A JP2019531942 A JP 2019531942A JP 2019531942 A JP2019531942 A JP 2019531942A JP 2020513696 A5 JP2020513696 A5 JP 2020513696A5
- Authority
- JP
- Japan
- Prior art keywords
- nanoparticles
- group
- metal
- solvent paste
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 claims 39
- 238000000034 method Methods 0.000 claims 35
- 239000002105 nanoparticle Substances 0.000 claims 19
- 239000002904 solvent Substances 0.000 claims 14
- 229910052751 metal Inorganic materials 0.000 claims 10
- 239000002184 metal Substances 0.000 claims 10
- 239000000758 substrate Substances 0.000 claims 7
- 238000000151 deposition Methods 0.000 claims 6
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims 4
- 239000000919 ceramic Substances 0.000 claims 4
- 229910044991 metal oxide Inorganic materials 0.000 claims 4
- 150000004706 metal oxides Chemical class 0.000 claims 4
- 239000004065 semiconductor Substances 0.000 claims 4
- 150000001875 compounds Chemical class 0.000 claims 3
- 230000008021 deposition Effects 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 229910000838 Al alloy Inorganic materials 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 2
- 229910000881 Cu alloy Inorganic materials 0.000 claims 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 2
- 229910052782 aluminium Inorganic materials 0.000 claims 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 2
- 229910052802 copper Inorganic materials 0.000 claims 2
- 239000010949 copper Substances 0.000 claims 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 2
- 229910052737 gold Inorganic materials 0.000 claims 2
- 239000010931 gold Substances 0.000 claims 2
- 238000007641 inkjet printing Methods 0.000 claims 2
- 229910052759 nickel Inorganic materials 0.000 claims 2
- 229910052763 palladium Inorganic materials 0.000 claims 2
- 238000007747 plating Methods 0.000 claims 2
- 238000007639 printing Methods 0.000 claims 2
- 238000007789 sealing Methods 0.000 claims 2
- 229910052709 silver Inorganic materials 0.000 claims 2
- 239000004332 silver Substances 0.000 claims 2
- 239000011135 tin Substances 0.000 claims 2
- 229910052718 tin Inorganic materials 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 1
- 238000003618 dip coating Methods 0.000 claims 1
- 238000007646 gravure printing Methods 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 238000007650 screen-printing Methods 0.000 claims 1
- 238000005245 sintering Methods 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- 239000000126 substance Substances 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/378,236 | 2016-12-14 | ||
| US15/378,236 US20180166369A1 (en) | 2016-12-14 | 2016-12-14 | Bi-Layer Nanoparticle Adhesion Film |
| PCT/US2017/066495 WO2018112247A1 (en) | 2016-12-14 | 2017-12-14 | A bi-layer nanoparticle adhesion film |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2020513696A JP2020513696A (ja) | 2020-05-14 |
| JP2020513696A5 true JP2020513696A5 (enExample) | 2021-01-28 |
| JP7256343B2 JP7256343B2 (ja) | 2023-04-12 |
Family
ID=62489623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019531942A Active JP7256343B2 (ja) | 2016-12-14 | 2017-12-14 | 二層ナノ粒子接着フィルム |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US20180166369A1 (enExample) |
| EP (1) | EP3554823B1 (enExample) |
| JP (1) | JP7256343B2 (enExample) |
| KR (1) | KR102516493B1 (enExample) |
| CN (1) | CN109937137B (enExample) |
| WO (1) | WO2018112247A1 (enExample) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20180138110A1 (en) * | 2016-11-17 | 2018-05-17 | Texas Instruments Incorporated | Enhanced Adhesion by Nanoparticle Layer Having Randomly Configured Voids |
| US9865527B1 (en) | 2016-12-22 | 2018-01-09 | Texas Instruments Incorporated | Packaged semiconductor device having nanoparticle adhesion layer patterned into zones of electrical conductance and insulation |
| US9941194B1 (en) | 2017-02-21 | 2018-04-10 | Texas Instruments Incorporated | Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer |
| JP7338204B2 (ja) * | 2019-04-01 | 2023-09-05 | 富士電機株式会社 | 半導体装置 |
| US10770206B1 (en) * | 2019-04-08 | 2020-09-08 | Government Of The United States As Represented By The Secretary Of The Air Force | System and method for fabricating a strain sensing device directly on a structure |
| US11116096B2 (en) | 2019-04-18 | 2021-09-07 | City University Of Hong Kong | Medium for binding components in an assembly of an electronic device, a method of preparing the same, a display assembly of an electronic device, and a system for simulating mechanical behaviours of the electronic device and the medium |
| CN114730741A (zh) * | 2019-11-28 | 2022-07-08 | 京瓷株式会社 | 布线基体、半导体元件容纳用封装件及半导体装置 |
| US12347805B2 (en) * | 2023-05-11 | 2025-07-01 | Infineon Technologies Austria Ag | Inkjet printing of diffusion solder |
| US20250140653A1 (en) * | 2023-10-25 | 2025-05-01 | Texas Instruments Incorporated | Hybrid quad flat package electronic device |
Family Cites Families (36)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1674178A3 (en) * | 2001-02-16 | 2007-01-24 | Sumitomo Titanium Corporation | Titanium powder sintered compact |
| EP1403231B1 (en) * | 2001-05-31 | 2012-11-21 | Ibiden Co., Ltd. | Method of producing a porous ceramic sintered body |
| DE10208635B4 (de) * | 2002-02-28 | 2010-09-16 | Infineon Technologies Ag | Diffusionslotstelle, Verbund aus zwei über eine Diffusionslotstelle verbundenen Teilen und Verfahren zur Herstellung der Diffusionslotstelle |
| KR101076135B1 (ko) * | 2002-12-12 | 2011-10-21 | 엔테그리스, 아이엔씨. | 다공성 소결 복합 재료 |
| US8257795B2 (en) * | 2004-02-18 | 2012-09-04 | Virginia Tech Intellectual Properties, Inc. | Nanoscale metal paste for interconnect and method of use |
| US20070163643A1 (en) * | 2004-02-19 | 2007-07-19 | Nanosolar, Inc. | High-throughput printing of chalcogen layer and the use of an inter-metallic material |
| JP4583063B2 (ja) * | 2004-04-14 | 2010-11-17 | 三井金属鉱業株式会社 | 銀化合物被覆銀粉及びその製造方法 |
| JP2006059904A (ja) * | 2004-08-18 | 2006-03-02 | Toshiba Corp | 半導体装置およびその製造方法 |
| DE102005028704B4 (de) * | 2005-06-20 | 2016-09-08 | Infineon Technologies Ag | Verfahren zur Herstellung eines Halbleiterbauteils mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten |
| DE102005061248B4 (de) * | 2005-12-20 | 2007-09-20 | Infineon Technologies Ag | Systemträger mit in Kunststoffmasse einzubettenden Oberflächen, Verfahren zur Herstellung eines Systemträgers und Verwendung einer Schicht als Haftvermittlerschicht |
| DE102006017115B4 (de) * | 2006-04-10 | 2008-08-28 | Infineon Technologies Ag | Halbleiterbauteil mit einem Kunststoffgehäuse und Verfahren zu seiner Herstellung |
| DE102006022254B4 (de) * | 2006-05-11 | 2008-12-11 | Infineon Technologies Ag | Halbleiterbauteil mit in Kunststoffgehäusemasse eingebetteten Halbleiterbauteilkomponenten, Anordnung für eine Mehrzahl von Halbleiterbauteilen und Verfahren zur Herstellung von Halbleiterbauteilen |
| WO2008068873A1 (en) * | 2006-12-08 | 2008-06-12 | Kazufumi Ogawa | Monolayer nanoparticle film, multilayer nanoparticle film, and manufacturing method thereof |
| JP2008153470A (ja) * | 2006-12-18 | 2008-07-03 | Renesas Technology Corp | 半導体装置および半導体装置の製造方法 |
| JP4895994B2 (ja) * | 2006-12-28 | 2012-03-14 | 株式会社日立製作所 | 金属粒子を用いた接合方法及び接合材料 |
| US20080272344A1 (en) * | 2007-03-23 | 2008-11-06 | Georgia Tech Research Corporation | Conductive polymer composites |
| JP5012239B2 (ja) * | 2007-06-13 | 2012-08-29 | 株式会社デンソー | 接合方法及び接合体 |
| US7846642B2 (en) * | 2007-08-17 | 2010-12-07 | The University Of Massachusetts | Direct incident beam lithography for patterning nanoparticles, and the articles formed thereby |
| CA2701655A1 (en) * | 2007-10-09 | 2009-04-16 | Nanomas Technologies, Inc. | Conductive nanoparticle inks and pastes and applications using the same |
| TWI456707B (zh) * | 2008-01-28 | 2014-10-11 | 瑞薩電子股份有限公司 | 半導體裝置及其製造方法 |
| JP4644718B2 (ja) | 2008-01-31 | 2011-03-02 | 株式会社日立製作所 | 金属／樹脂接着構造体及び樹脂封止型半導体装置とその製造方法 |
| US8513534B2 (en) * | 2008-03-31 | 2013-08-20 | Hitachi, Ltd. | Semiconductor device and bonding material |
| JP2010171271A (ja) | 2009-01-23 | 2010-08-05 | Renesas Technology Corp | 半導体装置およびその製造方法 |
| US20110209751A1 (en) * | 2010-01-25 | 2011-09-01 | Hitachi Chemical Company, Ltd. | Paste composition for electrode and photovoltaic cell |
| JP5525335B2 (ja) * | 2010-05-31 | 2014-06-18 | 株式会社日立製作所 | 焼結銀ペースト材料及び半導体チップ接合方法 |
| DE102010044709B4 (de) * | 2010-09-08 | 2015-07-02 | Vincotech Holdings S.à.r.l. | Leistungshalbleitermodul mit Metallsinterverbindungen sowie Herstellungsverfahren |
| US8736052B2 (en) * | 2011-08-22 | 2014-05-27 | Infineon Technologies Ag | Semiconductor device including diffusion soldered layer on sintered silver layer |
| DE102012207652A1 (de) * | 2012-05-08 | 2013-11-14 | Robert Bosch Gmbh | Zweistufiges Verfahren zum Fügen eines Halbleiters auf ein Substrat mit Verbindungsmaterial auf Silberbasis |
| US9583453B2 (en) * | 2012-05-30 | 2017-02-28 | Ormet Circuits, Inc. | Semiconductor packaging containing sintering die-attach material |
| JP2014127537A (ja) | 2012-12-26 | 2014-07-07 | Hitachi Power Semiconductor Device Ltd | 導電性接合材料を用いた半導体装置及びその半導体装置の製造方法。 |
| JP5975911B2 (ja) * | 2013-03-15 | 2016-08-23 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
| US20150069600A1 (en) * | 2013-09-12 | 2015-03-12 | Texas Instruments Incorporated | Embedded Silver Nanomaterials into Die Backside to Enhance Package Performance and Reliability |
| KR102214829B1 (ko) * | 2014-02-27 | 2021-02-10 | 삼성전자주식회사 | 나노입자 다층 박막 |
| KR20240112953A (ko) * | 2014-06-12 | 2024-07-19 | 알파 어쎔블리 솔루션 인크. | 재료들의 소결 및 그를 이용하는 부착 방법들 |
| FR3038535B1 (fr) * | 2015-07-10 | 2017-08-11 | Commissariat Energie Atomique | Assemblage comprenant deux elements de coefficient de dilatation thermique differents et un joint fritte heterogene en densite et procede de fabrication de l'assemblage |
| FR3038534A1 (fr) * | 2015-07-10 | 2017-01-13 | Commissariat Energie Atomique | Assemblage d'un element avec un substrat isole electriquement et a faible resistance thermique notamment pour des applications haute temperature, ensemble comprenant ledit assemblage et un drain thermique et procede de fabrication |
-
2016
- 2016-12-14 US US15/378,236 patent/US20180166369A1/en not_active Abandoned
-
2017
- 2017-12-14 JP JP2019531942A patent/JP7256343B2/ja active Active
- 2017-12-14 CN CN201780070261.2A patent/CN109937137B/zh active Active
- 2017-12-14 KR KR1020197016711A patent/KR102516493B1/ko active Active
- 2017-12-14 WO PCT/US2017/066495 patent/WO2018112247A1/en not_active Ceased
- 2017-12-14 EP EP17880180.9A patent/EP3554823B1/en active Active
-
2025
- 2025-09-29 US US19/343,721 patent/US20260026366A1/en active Pending
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