TW200746461A - Light emitting device and manufacturing method thereof - Google Patents

Light emitting device and manufacturing method thereof

Info

Publication number
TW200746461A
TW200746461A TW095148775A TW95148775A TW200746461A TW 200746461 A TW200746461 A TW 200746461A TW 095148775 A TW095148775 A TW 095148775A TW 95148775 A TW95148775 A TW 95148775A TW 200746461 A TW200746461 A TW 200746461A
Authority
TW
Taiwan
Prior art keywords
light emitting
emitting device
manufacturing
conductive paste
emitting element
Prior art date
Application number
TW095148775A
Other languages
English (en)
Chinese (zh)
Inventor
Yuichi Taguchi
Hideaki Sakaguchi
Naoyuki Koizumi
Mitsutoshi Higashi
Akinori Shiraishi
Sunohara Masahiro
Murayama Kei
Original Assignee
Shinko Electric Ind Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinko Electric Ind Co filed Critical Shinko Electric Ind Co
Publication of TW200746461A publication Critical patent/TW200746461A/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • H10H20/856—Reflecting means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Led Device Packages (AREA)
TW095148775A 2006-01-06 2006-12-25 Light emitting device and manufacturing method thereof TW200746461A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2006001801A JP4996096B2 (ja) 2006-01-06 2006-01-06 発光装置及びその製造方法

Publications (1)

Publication Number Publication Date
TW200746461A true TW200746461A (en) 2007-12-16

Family

ID=37873115

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095148775A TW200746461A (en) 2006-01-06 2006-12-25 Light emitting device and manufacturing method thereof

Country Status (5)

Country Link
US (1) US7622747B2 (enExample)
EP (1) EP1806792B1 (enExample)
JP (1) JP4996096B2 (enExample)
KR (1) KR20070074466A (enExample)
TW (1) TW200746461A (enExample)

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TWI730951B (zh) * 2015-02-03 2021-06-21 晶元光電股份有限公司 發光裝置

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WO2007002476A2 (en) * 2005-06-28 2007-01-04 Lamina Ceramics, Inc. Backlight module display with optical coupler and lightguide
US7719021B2 (en) * 2005-06-28 2010-05-18 Lighting Science Group Corporation Light efficient LED assembly including a shaped reflective cavity and method for making same
CN101803047B (zh) * 2007-09-20 2012-04-25 皇家飞利浦电子股份有限公司 准直器
KR100902357B1 (ko) 2007-11-05 2009-06-12 아로 주식회사 발광 다이오드 패키지 및 그 제조방법
JP2009182083A (ja) * 2008-01-30 2009-08-13 Kyocera Corp 発光装置
DE102009019412A1 (de) 2009-04-29 2010-11-04 Fa. Austria Technologie & Systemtechnik Ag Verfahren zur Herstellung einer Leiterplatte mit LEDs und gedruckter Reflektorfläche sowie Leiterplatte, hergestellt nach dem Verfahren
KR101130137B1 (ko) * 2010-07-02 2012-03-28 연세대학교 산학협력단 발광다이오드 모듈
JP5242641B2 (ja) 2010-08-25 2013-07-24 シャープ株式会社 発光装置の製造方法
JP2016086191A (ja) * 2010-11-05 2016-05-19 ローム株式会社 半導体発光装置
JP5566268B2 (ja) * 2010-11-19 2014-08-06 新光電気工業株式会社 発光装置及びパッケージ部品
JP5887638B2 (ja) 2011-05-30 2016-03-16 億光電子工業股▲ふん▼有限公司Ｅｖｅｒｌｉｇｈｔ Ｅｌｅｃｔｒｏｎｉｃｓ Ｃｏ．，Ｌｔｄ． 発光ダイオード
JP6097084B2 (ja) * 2013-01-24 2017-03-15 スタンレー電気株式会社 半導体発光装置
CN104103734B (zh) * 2013-04-02 2017-03-01 展晶科技(深圳)有限公司 发光二极管封装结构
JP2014216588A (ja) * 2013-04-30 2014-11-17 株式会社沖データ 発光装置、その製造方法、画像表示装置、及び画像形成装置
WO2015076591A1 (ko) 2013-11-21 2015-05-28 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제작 방법
KR101524046B1 (ko) * 2013-11-21 2015-06-01 주식회사 루멘스 발광 소자 패키지, 백라이트 유닛, 조명 장치 및 발광 소자 패키지의 제작 방법
JP2019017734A (ja) * 2017-07-18 2019-02-07 新日本無線株式会社 発光装置及びその製造方法

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JPS60261181A (ja) 1984-06-07 1985-12-24 Toshiba Corp 光半導体装置
JPS6216584A (ja) * 1985-07-16 1987-01-24 Toshiba Corp 光半導体素子
JP3329716B2 (ja) 1997-12-15 2002-09-30 日亜化学工業株式会社 チップタイプｌｅｄ
WO2003073520A1 (fr) * 2002-02-28 2003-09-04 Rohm Co.,Ltd. Lampe a diode electroluminescente
DE10229067B4 (de) * 2002-06-28 2007-08-16 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement und Verfahren zu dessen Herstellung
JP3655267B2 (ja) * 2002-07-17 2005-06-02 株式会社東芝 半導体発光装置
JP4352687B2 (ja) * 2002-11-26 2009-10-28 パナソニック電工株式会社 発光装置の製造方法
JP2004247701A (ja) * 2002-12-19 2004-09-02 Kyocera Corp 発光素子収納用パッケージおよび発光装置
JP3904210B2 (ja) * 2003-04-28 2007-04-11 株式会社リコー 光学電子デバイスの接合方法及び接合構造
WO2005025787A1 (ja) * 2003-09-12 2005-03-24 National Institute Of Advanced Industrial Science And Technology 微細な液滴の形状で噴射し、積層塗布可能な金属ナノ粒子分散液
JP4774201B2 (ja) * 2003-10-08 2011-09-14 日亜化学工業株式会社 パッケージ成形体及び半導体装置
JP2005159082A (ja) * 2003-11-27 2005-06-16 Kyocera Corp 発光素子収納用パッケージおよび発光装置ならびに発光素子収納用パッケージの製造方法。
JP4572312B2 (ja) * 2004-02-23 2010-11-04 スタンレー電気株式会社 Ｌｅｄ及びその製造方法
US20050225222A1 (en) * 2004-04-09 2005-10-13 Joseph Mazzochette Light emitting diode arrays with improved light extraction
JP4659421B2 (ja) * 2004-09-30 2011-03-30 株式会社トクヤマ 発光素子収納用パッケージの製造方法
KR101154801B1 (ko) * 2004-12-03 2012-07-03 엔지케이 스파크 플러그 캄파니 리미티드 세라믹 기판 및 발광 소자 수납용 세라믹 패키지

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI730951B (zh) * 2015-02-03 2021-06-21 晶元光電股份有限公司 發光裝置

Also Published As

Publication number Publication date
KR20070074466A (ko) 2007-07-12
JP4996096B2 (ja) 2012-08-08
US7622747B2 (en) 2009-11-24
US20070158674A1 (en) 2007-07-12
EP1806792B1 (en) 2013-07-24
EP1806792A3 (en) 2010-05-19
EP1806792A2 (en) 2007-07-11
JP2007184425A (ja) 2007-07-19

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