JP2009516393A5 - - Google Patents
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- Publication number
- JP2009516393A5 JP2009516393A5 JP2008541256A JP2008541256A JP2009516393A5 JP 2009516393 A5 JP2009516393 A5 JP 2009516393A5 JP 2008541256 A JP2008541256 A JP 2008541256A JP 2008541256 A JP2008541256 A JP 2008541256A JP 2009516393 A5 JP2009516393 A5 JP 2009516393A5
- Authority
- JP
- Japan
- Prior art keywords
- metal oxide
- functional group
- oxide particles
- covalently bonded
- organic functional
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000006185 dispersion Substances 0.000 claims 5
- 125000000524 functional group Chemical group 0.000 claims 4
- 229910044991 metal oxide Inorganic materials 0.000 claims 4
- 150000004706 metal oxides Chemical class 0.000 claims 4
- 239000002245 particle Substances 0.000 claims 4
- 239000011159 matrix material Substances 0.000 claims 3
- 229920000642 polymer Polymers 0.000 claims 3
- 239000000203 mixture Substances 0.000 claims 2
- 238000007641 inkjet printing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/282,923 US7498662B2 (en) | 2005-11-18 | 2005-11-18 | Dielectric media including surface-treated metal oxide particles |
| PCT/US2006/044055 WO2007061669A1 (en) | 2005-11-18 | 2006-11-14 | Dielectric media including surface-treated metal oxide particles |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2009516393A JP2009516393A (ja) | 2009-04-16 |
| JP2009516393A5 true JP2009516393A5 (enExample) | 2010-01-07 |
Family
ID=38052603
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008541256A Withdrawn JP2009516393A (ja) | 2005-11-18 | 2006-11-14 | 表面処理された金属酸化物粒子を含む誘電媒体 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7498662B2 (enExample) |
| EP (1) | EP1952429A1 (enExample) |
| JP (1) | JP2009516393A (enExample) |
| CN (1) | CN101310368B (enExample) |
| WO (1) | WO2007061669A1 (enExample) |
Families Citing this family (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7765265B1 (en) | 2005-05-11 | 2010-07-27 | Aol Inc. | Identifying users sharing common characteristics |
| US20070146426A1 (en) * | 2005-12-28 | 2007-06-28 | Nelson Brian K | All-inkjet printed thin film transistor |
| US8164087B2 (en) | 2006-06-12 | 2012-04-24 | Alcatel Lucent | Organic semiconductor compositions with nanoparticles |
| US7879688B2 (en) * | 2007-06-29 | 2011-02-01 | 3M Innovative Properties Company | Methods for making electronic devices with a solution deposited gate dielectric |
| WO2009005972A1 (en) * | 2007-06-29 | 2009-01-08 | 3M Innovative Properties Company | Electronic devices having a solution deposited gate dielectric |
| US20090001356A1 (en) * | 2007-06-29 | 2009-01-01 | 3M Innovative Properties Company | Electronic devices having a solution deposited gate dielectric |
| TWI412125B (zh) * | 2007-07-17 | 2013-10-11 | Creator Technology Bv | 電子元件及電子元件之製法 |
| CN102124015B (zh) * | 2008-05-30 | 2015-03-11 | 3M创新有限公司 | 甲硅烷基乙炔基并五苯化合物和组合物及其制备和使用方法 |
| US8017471B2 (en) * | 2008-08-06 | 2011-09-13 | International Business Machines Corporation | Structure and method of latchup robustness with placement of through wafer via within CMOS circuitry |
| KR101040320B1 (ko) * | 2008-08-29 | 2011-06-10 | 고려대학교 산학협력단 | 절연막 및 절연막의 제조 방법 |
| DE102009016659A1 (de) | 2008-09-23 | 2010-06-24 | Siemens Aktiengesellschaft | Ankergruppe für Monolagen organischer Verbindungen auf Metall und damit hergestelltes Bauelement auf Basis organischer Elektronik |
| EP2435446B8 (en) | 2009-05-29 | 2017-02-22 | 3M Innovative Properties Company | Fluorinated silylethynyl pentacene compounds and compositions and methods of making and using the same |
| DE102009037691A1 (de) * | 2009-08-17 | 2011-03-03 | Siemens Aktiengesellschaft | Dielektrische Schutzschicht für eine selbstorganisierende Monolage (SAM) |
| EP2548210B1 (en) * | 2010-03-17 | 2024-07-31 | The Secretary of State For Defence | Improvements in dielectrics |
| JP6034613B2 (ja) * | 2012-07-31 | 2016-11-30 | 第一工業製薬株式会社 | 無機化合物微粒子分散組成物の製造方法および無機化合物微粒子分散硬化物の製造方法 |
| KR102570397B1 (ko) * | 2016-05-11 | 2023-08-24 | 삼성디스플레이 주식회사 | 유기 박막 트랜지스터 및 그 제조 방법 |
| CN107722557A (zh) * | 2016-08-12 | 2018-02-23 | 深圳先进技术研究院 | 一种超薄电容材料及其制备方法 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6329058B1 (en) | 1998-07-30 | 2001-12-11 | 3M Innovative Properties Company | Nanosize metal oxide particles for producing transparent metal oxide colloids and ceramers |
| GB9927431D0 (en) * | 1999-11-22 | 2000-01-19 | Ciba Sc Holding Ag | Casting resin and process for the fabrication of resin molds |
| JP2003518754A (ja) * | 1999-12-21 | 2003-06-10 | プラスティック ロジック リミテッド | 溶液処理された素子 |
| EP1195417B1 (de) * | 2000-10-05 | 2009-10-14 | Evonik Degussa GmbH | Siliciumorganische Nanokapseln |
| EP1231637A3 (en) | 2001-02-08 | 2004-08-25 | Hitachi, Ltd. | High dielectric constant composite material and multilayer wiring board using the same |
| EP1393122B1 (en) * | 2001-05-15 | 2018-03-28 | E Ink Corporation | Electrophoretic particles |
| WO2004081111A1 (en) | 2003-03-11 | 2004-09-23 | Dow Global Technologies Inc. | High dielectric constant composites |
| US7098525B2 (en) | 2003-05-08 | 2006-08-29 | 3M Innovative Properties Company | Organic polymers, electronic devices, and methods |
| ATE422525T1 (de) | 2003-05-20 | 2009-02-15 | Dsm Ip Assets Bv | Verfahren zur herstellung von nanostrukturierten oberflächenbeschichtungen, deren beschichtungen und gegenständen enthaltend die beschichtung |
| US20050095448A1 (en) | 2003-11-04 | 2005-05-05 | Katz Howard E. | Layer incorporating particles with a high dielectric constant |
-
2005
- 2005-11-18 US US11/282,923 patent/US7498662B2/en not_active Expired - Fee Related
-
2006
- 2006-11-14 EP EP06837476A patent/EP1952429A1/en not_active Withdrawn
- 2006-11-14 JP JP2008541256A patent/JP2009516393A/ja not_active Withdrawn
- 2006-11-14 CN CN2006800430658A patent/CN101310368B/zh not_active Expired - Fee Related
- 2006-11-14 WO PCT/US2006/044055 patent/WO2007061669A1/en not_active Ceased
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