JP2010528491A5 - - Google Patents

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Publication number
JP2010528491A5
JP2010528491A5 JP2010510407A JP2010510407A JP2010528491A5 JP 2010528491 A5 JP2010528491 A5 JP 2010528491A5 JP 2010510407 A JP2010510407 A JP 2010510407A JP 2010510407 A JP2010510407 A JP 2010510407A JP 2010528491 A5 JP2010528491 A5 JP 2010528491A5
Authority
JP
Japan
Prior art keywords
opening
forming
substrate
sidewall
conductive material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010510407A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010528491A (ja
Filing date
Publication date
Priority claimed from US11/753,996 external-priority patent/US7886437B2/en
Application filed filed Critical
Publication of JP2010528491A publication Critical patent/JP2010528491A/ja
Publication of JP2010528491A5 publication Critical patent/JP2010528491A5/ja
Pending legal-status Critical Current

Links

JP2010510407A 2007-05-25 2008-05-14 絶縁された導電性接点を金属パッケージを貫通するように形成するプロセス Pending JP2010528491A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US11/753,996 US7886437B2 (en) 2007-05-25 2007-05-25 Process for forming an isolated electrically conductive contact through a metal package
PCT/US2008/063609 WO2008147695A1 (en) 2007-05-25 2008-05-14 Process for forming an isolated electrically conductive contact through a metal package

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014030950A Division JP2014143423A (ja) 2007-05-25 2014-02-20 コンシュマー電子機器パッケージ

Publications (2)

Publication Number Publication Date
JP2010528491A JP2010528491A (ja) 2010-08-19
JP2010528491A5 true JP2010528491A5 (enExample) 2011-06-23

Family

ID=40071052

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2010510407A Pending JP2010528491A (ja) 2007-05-25 2008-05-14 絶縁された導電性接点を金属パッケージを貫通するように形成するプロセス
JP2014030950A Pending JP2014143423A (ja) 2007-05-25 2014-02-20 コンシュマー電子機器パッケージ

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2014030950A Pending JP2014143423A (ja) 2007-05-25 2014-02-20 コンシュマー電子機器パッケージ

Country Status (6)

Country Link
US (2) US7886437B2 (enExample)
JP (2) JP2010528491A (enExample)
KR (1) KR20100023804A (enExample)
CN (1) CN101681818B (enExample)
TW (1) TWI435679B (enExample)
WO (1) WO2008147695A1 (enExample)

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