JP2007150285A5 - - Google Patents

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Publication number
JP2007150285A5
JP2007150285A5 JP2006296403A JP2006296403A JP2007150285A5 JP 2007150285 A5 JP2007150285 A5 JP 2007150285A5 JP 2006296403 A JP2006296403 A JP 2006296403A JP 2006296403 A JP2006296403 A JP 2006296403A JP 2007150285 A5 JP2007150285 A5 JP 2007150285A5
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JP
Japan
Prior art keywords
oxide film
film
metal
silicon
nitride
Prior art date
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Application number
JP2006296403A
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English (en)
Japanese (ja)
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JP5020598B2 (ja
JP2007150285A (ja
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Priority claimed from KR1020050112306A external-priority patent/KR100647472B1/ko
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Publication of JP2007150285A publication Critical patent/JP2007150285A/ja
Publication of JP2007150285A5 publication Critical patent/JP2007150285A5/ja
Application granted granted Critical
Publication of JP5020598B2 publication Critical patent/JP5020598B2/ja
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JP2006296403A 2005-11-23 2006-10-31 半導体装置のデュアルゲート構造物及びその形成方法 Active JP5020598B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050112306A KR100647472B1 (ko) 2005-11-23 2005-11-23 반도체 장치의 듀얼 게이트 구조물 및 그 형성 방법.
KR10-2005-0112306 2005-11-23

Publications (3)

Publication Number Publication Date
JP2007150285A JP2007150285A (ja) 2007-06-14
JP2007150285A5 true JP2007150285A5 (enrdf_load_stackoverflow) 2009-12-17
JP5020598B2 JP5020598B2 (ja) 2012-09-05

Family

ID=37712874

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006296403A Active JP5020598B2 (ja) 2005-11-23 2006-10-31 半導体装置のデュアルゲート構造物及びその形成方法

Country Status (2)

Country Link
JP (1) JP5020598B2 (enrdf_load_stackoverflow)
KR (1) KR100647472B1 (enrdf_load_stackoverflow)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5139023B2 (ja) * 2007-10-16 2013-02-06 株式会社東芝 半導体装置の製造方法
KR101122756B1 (ko) * 2008-06-30 2012-03-23 주식회사 하이닉스반도체 단층 확산방지막을 구비하는 반도체 장치 및 그 제조 방법
JP5147588B2 (ja) * 2008-08-04 2013-02-20 パナソニック株式会社 半導体装置
US20100052072A1 (en) * 2008-08-28 2010-03-04 Taiwan Semiconductor Manufacturing Company, Ltd. Dual gate structure on a same chip for high-k metal gate technology
KR101556641B1 (ko) * 2008-12-31 2015-10-02 삼성전자주식회사 듀얼 게이트 반도체 장치의 제조방법
JP2012231123A (ja) * 2011-04-15 2012-11-22 Hitachi Kokusai Electric Inc 半導体装置、半導体装置の製造方法、基板処理システムおよびプログラム

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0831949A (ja) * 1994-07-08 1996-02-02 Ricoh Co Ltd デュアルゲート構造cmos半導体装置とその製造方法
KR20020002175A (ko) * 2000-06-29 2002-01-09 박종섭 반도체소자의 이중게이트 형성방법
JP2002217313A (ja) * 2000-11-30 2002-08-02 Texas Instruments Inc 金属及び対応する金属珪化物から形成した各ゲートを有する相補形トランジスタ
KR100379548B1 (ko) 2000-12-21 2003-04-10 주식회사 하이닉스반도체 Ldd 구조를 갖는 반도체 장치의 제조방법
US6518106B2 (en) * 2001-05-26 2003-02-11 Motorola, Inc. Semiconductor device and a method therefor
JP3974507B2 (ja) * 2001-12-27 2007-09-12 株式会社東芝 半導体装置の製造方法
KR20040108488A (ko) * 2003-06-17 2004-12-24 삼성전자주식회사 디램 소자의 듀얼 게이트 형성방법
JP2006156807A (ja) * 2004-11-30 2006-06-15 Toshiba Corp 半導体装置およびその製造方法
JP2006165068A (ja) * 2004-12-02 2006-06-22 Sony Corp 半導体装置およびその製造方法

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