JP2007142436A5 - - Google Patents

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Publication number
JP2007142436A5
JP2007142436A5 JP2006313358A JP2006313358A JP2007142436A5 JP 2007142436 A5 JP2007142436 A5 JP 2007142436A5 JP 2006313358 A JP2006313358 A JP 2006313358A JP 2006313358 A JP2006313358 A JP 2006313358A JP 2007142436 A5 JP2007142436 A5 JP 2007142436A5
Authority
JP
Japan
Prior art keywords
film
metal film
pad electrode
alignment mark
passivation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2006313358A
Other languages
English (en)
Japanese (ja)
Other versions
JP2007142436A (ja
Filing date
Publication date
Priority claimed from KR1020050111994A external-priority patent/KR100660893B1/ko
Application filed filed Critical
Publication of JP2007142436A publication Critical patent/JP2007142436A/ja
Publication of JP2007142436A5 publication Critical patent/JP2007142436A5/ja
Pending legal-status Critical Current

Links

JP2006313358A 2005-11-22 2006-11-20 整列マーク膜を備える半導体素子及びその製造方法 Pending JP2007142436A (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020050111994A KR100660893B1 (ko) 2005-11-22 2005-11-22 정렬 마크막을 구비하는 반도체 소자 및 그 제조 방법

Publications (2)

Publication Number Publication Date
JP2007142436A JP2007142436A (ja) 2007-06-07
JP2007142436A5 true JP2007142436A5 (enExample) 2010-01-14

Family

ID=37815395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006313358A Pending JP2007142436A (ja) 2005-11-22 2006-11-20 整列マーク膜を備える半導体素子及びその製造方法

Country Status (5)

Country Link
US (1) US7482703B2 (enExample)
JP (1) JP2007142436A (enExample)
KR (1) KR100660893B1 (enExample)
CN (1) CN1971903B (enExample)
DE (1) DE102006056066A1 (enExample)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8492263B2 (en) 2007-11-16 2013-07-23 Taiwan Semiconductor Manufacturing Company, Ltd. Protected solder ball joints in wafer level chip-scale packaging
US20090174069A1 (en) * 2008-01-04 2009-07-09 National Semiconductor Corporation I/o pad structure for enhancing solder joint reliability in integrated circuit devices
KR20090095076A (ko) * 2008-03-04 2009-09-09 삼성전자주식회사 반도체 집적 회로 장치 및 그 제조 방법
JP2010021293A (ja) * 2008-07-09 2010-01-28 Nec Electronics Corp 半導体装置および半導体装置の製造方法
CN101789391B (zh) * 2009-01-23 2012-08-22 中芯国际集成电路制造(上海)有限公司 半导体装置及其制造方法
JP2010225934A (ja) * 2009-03-24 2010-10-07 Mitsumi Electric Co Ltd ウエハの製造方法
US8299616B2 (en) * 2010-01-29 2012-10-30 Taiwan Semiconductor Manufacturing Company, Ltd. T-shaped post for semiconductor devices
US8803319B2 (en) 2010-02-11 2014-08-12 Taiwan Semiconductor Manufacturing Company, Ltd. Pillar structure having a non-planar surface for semiconductor devices
US8318596B2 (en) * 2010-02-11 2012-11-27 Taiwan Semiconductor Manufacturing Company, Ltd. Pillar structure having a non-planar surface for semiconductor devices
CN102157497B (zh) * 2011-01-26 2016-03-09 上海华虹宏力半导体制造有限公司 多层堆栈的半导体器件的结构及形成方法
DE102011005642B4 (de) 2011-03-16 2012-09-27 GLOBALFOUNDRIES Dresden Module One Ltd. Liability Company & Co. KG Verfahren zum Schutz von reaktiven Metalloberflächen von Halbleiterbauelementen während des Transports durch Bereitstellen einer zusätzlichen Schutzschicht
JP2013004572A (ja) * 2011-06-13 2013-01-07 Mitsubishi Electric Corp 半導体装置の製造方法
US9230932B2 (en) 2012-02-09 2016-01-05 Taiwan Semiconductor Manufacturing Company, Ltd. Interconnect crack arrestor structure and methods
US9515036B2 (en) 2012-04-20 2016-12-06 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for solder connections
CN103682085B (zh) * 2012-09-20 2016-08-03 中芯国际集成电路制造(上海)有限公司 一种磁随机存取存储器及其制造方法
CN103199084B (zh) * 2013-03-08 2015-10-14 京东方科技集团股份有限公司 基板对位标记、基板及基板对位标记的制作方法
US8987922B2 (en) * 2013-03-11 2015-03-24 Taiwan Semiconductor Manufacturing Company, Ltd. Methods and apparatus for wafer level packaging
US9355979B2 (en) 2013-08-16 2016-05-31 Taiwan Semiconductor Manufacturing Company, Ltd. Alignment structures and methods of forming same
CN104091808B (zh) * 2014-06-25 2016-08-17 合肥鑫晟光电科技有限公司 阵列基板及其制作方法和显示装置
US9505609B2 (en) * 2015-04-29 2016-11-29 Invensense, Inc. CMOS-MEMS integrated device with selective bond pad protection
US9935047B2 (en) * 2015-10-16 2018-04-03 Taiwan Semiconductor Manufacturing Company, Ltd. Bonding structures and methods forming the same
US10658318B2 (en) * 2016-11-29 2020-05-19 Taiwan Semiconductor Manufacturing Co., Ltd. Film scheme for bumping
KR101902566B1 (ko) 2017-07-25 2018-09-28 엘지디스플레이 주식회사 발광 표시 장치 및 이의 제조 방법
US11694967B2 (en) * 2019-03-14 2023-07-04 Taiwan Semiconductor Manufacturing Company, Ltd. Package structure and method of fabricating the same
CN114093842A (zh) * 2020-12-23 2022-02-25 矽磐微电子(重庆)有限公司 裸片及其制作方法、芯片封装结构及其制作方法
US20230317648A1 (en) * 2022-03-04 2023-10-05 Taiwan Semiconductor Manufacturing Co., Ltd. Semiconductor Devices and Methods of Manufacture

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03105937A (ja) * 1989-09-19 1991-05-02 Nec Corp 半導体装置
JPH0488622A (ja) * 1990-08-01 1992-03-23 Fujitsu Ltd 半導体装置の製造方法
JPH0590325A (ja) * 1991-09-27 1993-04-09 Toshiba Corp 半導体装置のボンデイングパツド
KR100258719B1 (ko) 1993-04-16 2000-06-15 손욱 칩온 글래스용 패널구조
KR960008978A (ko) * 1994-08-02 1996-03-22 김주용 반도체 소자의 정렬 마크 보호방법
JP3256391B2 (ja) * 1994-11-28 2002-02-12 キヤノン株式会社 回路基板構造
US6875681B1 (en) * 1997-12-31 2005-04-05 Intel Corporation Wafer passivation structure and method of fabrication
JP4037561B2 (ja) * 1999-06-28 2008-01-23 株式会社東芝 半導体装置の製造方法
US6586323B1 (en) * 2000-09-18 2003-07-01 Taiwan Semiconductor Manufacturing Company Method for dual-layer polyimide processing on bumping technology
US6465898B1 (en) * 2001-07-23 2002-10-15 Texas Instruments Incorporated Bonding alignment mark for bonds over active circuits
JP2004319549A (ja) 2003-04-11 2004-11-11 Matsushita Electric Ind Co Ltd 半導体装置およびその製造方法
JP2005012065A (ja) * 2003-06-20 2005-01-13 Renesas Technology Corp 半導体装置およびその製造方法
JP2005044971A (ja) 2003-07-28 2005-02-17 Sharp Corp 半導体装置及びその製造方法
JP2005109145A (ja) * 2003-09-30 2005-04-21 Toshiba Corp 半導体装置
US7122458B2 (en) * 2004-07-22 2006-10-17 Taiwan Semiconductor Manufacturing Co., Ltd. Method for fabricating pad redistribution layer
KR100577308B1 (ko) * 2004-12-29 2006-05-10 동부일렉트로닉스 주식회사 반도체 소자 및 그의 제조 방법
KR100712289B1 (ko) * 2005-04-07 2007-04-27 삼성에스디아이 주식회사 평판표시장치 및 그의 제조방법

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