JP2007115692A - 有機電界発光表示装置及びその製造方法 - Google Patents
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000758 substrate Substances 0.000 claims abstract description 119
- 239000003566 sealing material Substances 0.000 claims abstract description 53
- 238000007789 sealing Methods 0.000 claims abstract description 36
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 13
- 239000000395 magnesium oxide Substances 0.000 claims description 12
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 12
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 8
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims description 6
- 229910015902 Bi 2 O 3 Inorganic materials 0.000 claims description 6
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 6
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 claims description 6
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims description 6
- 229910000416 bismuth oxide Inorganic materials 0.000 claims description 6
- 239000005388 borosilicate glass Substances 0.000 claims description 6
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims description 6
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims description 6
- XUCJHNOBJLKZNU-UHFFFAOYSA-M dilithium;hydroxide Chemical compound [Li+].[Li+].[OH-] XUCJHNOBJLKZNU-UHFFFAOYSA-M 0.000 claims description 6
- YWEUIGNSBFLMFL-UHFFFAOYSA-N diphosphonate Chemical compound O=P(=O)OP(=O)=O YWEUIGNSBFLMFL-UHFFFAOYSA-N 0.000 claims description 6
- GNTDGMZSJNCJKK-UHFFFAOYSA-N divanadium pentaoxide Chemical compound O=[V](=O)O[V](=O)=O GNTDGMZSJNCJKK-UHFFFAOYSA-N 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 6
- YEXPOXQUZXUXJW-UHFFFAOYSA-N oxolead Chemical compound [Pb]=O YEXPOXQUZXUXJW-UHFFFAOYSA-N 0.000 claims description 6
- SJLOMQIUPFZJAN-UHFFFAOYSA-N oxorhodium Chemical compound [Rh]=O SJLOMQIUPFZJAN-UHFFFAOYSA-N 0.000 claims description 6
- 239000005365 phosphate glass Substances 0.000 claims description 6
- 239000010948 rhodium Substances 0.000 claims description 6
- 229910003450 rhodium oxide Inorganic materials 0.000 claims description 6
- CWBWCLMMHLCMAM-UHFFFAOYSA-M rubidium(1+);hydroxide Chemical compound [OH-].[Rb+].[Rb+] CWBWCLMMHLCMAM-UHFFFAOYSA-M 0.000 claims description 6
- 229910001925 ruthenium oxide Inorganic materials 0.000 claims description 6
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 6
- LAJZODKXOMJMPK-UHFFFAOYSA-N tellurium dioxide Chemical compound O=[Te]=O LAJZODKXOMJMPK-UHFFFAOYSA-N 0.000 claims description 6
- ZNOKGRXACCSDPY-UHFFFAOYSA-N tungsten trioxide Chemical compound O=[W](=O)=O ZNOKGRXACCSDPY-UHFFFAOYSA-N 0.000 claims description 6
- LSGOVYNHVSXFFJ-UHFFFAOYSA-N vanadate(3-) Chemical compound [O-][V]([O-])([O-])=O LSGOVYNHVSXFFJ-UHFFFAOYSA-N 0.000 claims description 6
- 229910000859 α-Fe Inorganic materials 0.000 claims description 6
- GHPGOEFPKIHBNM-UHFFFAOYSA-N antimony(3+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Sb+3].[Sb+3] GHPGOEFPKIHBNM-UHFFFAOYSA-N 0.000 claims description 5
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 claims description 5
- 238000001723 curing Methods 0.000 claims description 4
- 230000003647 oxidation Effects 0.000 claims description 4
- 238000007254 oxidation reaction Methods 0.000 claims description 4
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 239000000565 sealant Substances 0.000 claims description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims 3
- 239000005355 lead glass Substances 0.000 claims 3
- 239000011521 glass Substances 0.000 abstract description 30
- 239000010410 layer Substances 0.000 description 74
- 239000010408 film Substances 0.000 description 32
- 239000000463 material Substances 0.000 description 20
- 238000002347 injection Methods 0.000 description 14
- 239000007924 injection Substances 0.000 description 14
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 13
- 229910052760 oxygen Inorganic materials 0.000 description 13
- 239000001301 oxygen Substances 0.000 description 13
- 239000000126 substance Substances 0.000 description 11
- 239000000654 additive Substances 0.000 description 10
- 239000000945 filler Substances 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 9
- 239000011368 organic material Substances 0.000 description 9
- 239000010409 thin film Substances 0.000 description 8
- 230000005525 hole transport Effects 0.000 description 7
- 230000000996 additive effect Effects 0.000 description 6
- 239000011159 matrix material Substances 0.000 description 6
- 230000000903 blocking effect Effects 0.000 description 5
- 229910010272 inorganic material Inorganic materials 0.000 description 5
- 239000011147 inorganic material Substances 0.000 description 5
- 239000002245 particle Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- XEEYBQQBJWHFJM-UHFFFAOYSA-N iron Substances [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 150000002894 organic compounds Chemical class 0.000 description 4
- 238000010298 pulverizing process Methods 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 239000005385 borate glass Substances 0.000 description 3
- ZPPSOOVFTBGHBI-UHFFFAOYSA-N lead(2+);oxido(oxo)borane Chemical compound [Pb+2].[O-]B=O.[O-]B=O ZPPSOOVFTBGHBI-UHFFFAOYSA-N 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 3
- 229910001887 tin oxide Inorganic materials 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 239000000969 carrier Substances 0.000 description 2
- 239000011651 chromium Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- -1 hydroxyl propyl Chemical group 0.000 description 2
- 239000011344 liquid material Substances 0.000 description 2
- 239000011572 manganese Substances 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- VXQBJTKSVGFQOL-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethyl acetate Chemical compound CCCCOCCOCCOC(C)=O VXQBJTKSVGFQOL-UHFFFAOYSA-N 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 108091006149 Electron carriers Proteins 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- PWHULOQIROXLJO-UHFFFAOYSA-N Manganese Chemical compound [Mn] PWHULOQIROXLJO-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- FJWGYAHXMCUOOM-QHOUIDNNSA-N [(2s,3r,4s,5r,6r)-2-[(2r,3r,4s,5r,6s)-4,5-dinitrooxy-2-(nitrooxymethyl)-6-[(2r,3r,4s,5r,6s)-4,5,6-trinitrooxy-2-(nitrooxymethyl)oxan-3-yl]oxyoxan-3-yl]oxy-3,5-dinitrooxy-6-(nitrooxymethyl)oxan-4-yl] nitrate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O)O[C@H]1[C@@H]([C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@@H](CO[N+]([O-])=O)O1)O[N+]([O-])=O)CO[N+](=O)[O-])[C@@H]1[C@@H](CO[N+]([O-])=O)O[C@@H](O[N+]([O-])=O)[C@H](O[N+]([O-])=O)[C@H]1O[N+]([O-])=O FJWGYAHXMCUOOM-QHOUIDNNSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 229910000174 eucryptite Inorganic materials 0.000 description 1
- 230000005281 excited state Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 239000003049 inorganic solvent Substances 0.000 description 1
- 229910001867 inorganic solvent Inorganic materials 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- CHWRSCGUEQEHOH-UHFFFAOYSA-N potassium oxide Chemical compound [O-2].[K+].[K+] CHWRSCGUEQEHOH-UHFFFAOYSA-N 0.000 description 1
- 229910001950 potassium oxide Inorganic materials 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910001948 sodium oxide Inorganic materials 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- QUBMWJKTLKIJNN-UHFFFAOYSA-B tin(4+);tetraphosphate Chemical compound [Sn+4].[Sn+4].[Sn+4].[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O.[O-]P([O-])([O-])=O QUBMWJKTLKIJNN-UHFFFAOYSA-B 0.000 description 1
- 229910052723 transition metal Inorganic materials 0.000 description 1
- 150000003624 transition metals Chemical class 0.000 description 1
- 229910052720 vanadium Inorganic materials 0.000 description 1
- GPPXJZIENCGNKB-UHFFFAOYSA-N vanadium Chemical compound [V]#[V] GPPXJZIENCGNKB-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/851—Division of substrate
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- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
【解決手段】本発明の有機電界発光表示装置は、基板と、前記基板上に設けられる有機発光素子と、前記有機発光素子が設けられた基板に対向するように設けられる封止基板と、前記有機発光素子の周辺に設けられ、前記封止基板と前記基板を結合するフリットと、前記封止基板と前記有機発光素子との間に設けられるフィルムまたはシール材と、を備えることを特徴とする。
【選択図】図7
Description
310 第1電極
320 正孔輸送層
330 有機発光層
340 電子輸送層
350 第2電極
360 有機発光素子
370 無機膜
380 フリット
390 シール材
400 封止基板
410 UVマスク
440 スクライブライン
450 シール材
1000、1001 有機電界発光表示装置
1002 基板
1004 アノード
1006 カソード
1010 有機膜層
1012 駆動回路
1014 平坦化膜
1016 データライン
1018 スキャンライン
1071 封止材
Claims (16)
- 基板と、
前記基板上に設けられた有機発光素子と、
前記有機発光素子が設けられた基板に対向するように設けられた封止基板と、
前記有機発光素子の周辺に設けられ、前記封止基板と前記基板とを結合するフリットと、
前記封止基板と前記有機発光素子との間に設けられたフィルムまたはシール材と、を備えることを特徴とする有機電界発光表示装置。 - 前記フィルムとシール材は、ウレタンアクリルで形成されることを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フリットは、酸化マグネシウム(MgO)、酸化カルシウム(CaO)、酸化バリウム(BaO)、酸化リチウム(Li2O)、酸化ナトリウム(Na2O)、酸化カリウム(K2O)、酸化ホウ素(B2O3)、酸化バナジウム(V2O5)、酸化亜鉛(ZnO)、酸化テルル(TeO2)、酸化アルミニウム(Al2O3)、二酸化シリコン(SiO2)、酸化鉛(PbO)、酸化スズ(SnO)、酸化リン(P2O5)、酸化ルテニウム(Ru2O)、酸化ルビジウム(Rb2O)、酸化ロジウム(Rh2O)、酸化フェライト(Fe2O3)、酸化銅(CuO)、酸化チタニウム(TiO2)、酸化タングステン(WO3)、酸化ビスマス(Bi2O3)、酸化アンチモン(Sb2O3)、ホウ酸鉛ガラス、リン酸スズガラス、バナジン酸ガラス、及びホウケイ酸ガラスよりなる群から選ばれた一種以上を使用することを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フィルムまたはシール材は、前記有機発光素子の上部表面を覆っていることを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フィルムまたはシール材は、前記有機発光素子以外の領域と前記封止基板との間に位置しないことを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フィルムまたはシール材は、前記フリットと接触しないことを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フィルムまたはシール材は、前記フリットと接触することを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フィルムまたはシール材は、透明であることを特徴とする請求項1に記載の有機電界発光表示装置。
- 前記フィルムまたはシール材は、前記封止基板と反射率が同じか、小さいことを特徴とする請求項1に記載の有機電界発光表示装置。
- 基板を用意する段階と、
前記基板上に有機発光素子を設ける段階と、
前記基板上に設けられた前記有機発光素子の両側部にフリットを設ける段階と、
前記素子に対向する封止基板の一面にフィルムを設ける段階と、
前記基板と前記封止基板とを結合する段階と、
前記フリットを熱硬化させる段階と、を備えることを特徴とする有機電界発光表示装置の製造方法。 - 前記フィルムは、ウレタンアクリルで形成されることを特徴とする請求項10に記載の有機電界発光表示装置の製造方法。
- 前記フリットは、酸化マグネシウム(MgO)、酸化カルシウム(CaO)、酸化バリウム(BaO)、酸化リチウム(Li2O)、酸化ナトリウム(Na2O)、酸化カリウム(K2O)、酸化ホウ素(B2O3)、酸化バナジウム(V2O5)、酸化亜鉛(ZnO)、酸化テルル(TeO2)、酸化アルミニウム(Al2O3)、二酸化シリコン(SiO2)、酸化鉛(PbO)、酸化スズ(SnO)、酸化リン(P2O5)、酸化ルテニウム(Ru2O)、酸化ルビジウム(Rb2O)、酸化ロジウム(Rh2O)、酸化フェライト(Fe2O3)、酸化銅(CuO)、酸化チタニウム(TiO2)、酸化タングステン(WO3)、酸化ビスマス(Bi2O3)、酸化アンチモン(Sb2O3)、ホウ酸鉛ガラス、リン酸スズガラス、バナジン酸ガラス、及びホウケイ酸ガラスよりなる群から選ばれた一種以上を使用することを特徴とする請求項10に記載の有機電界発光表示装置の製造方法。
- 基板を用意する段階と、
前記基板上に有機発光素子を設ける段階と、
前記有機発光素子上に無機物層を設ける段階と、
前記基板上に設けられた前記有機発光素子の両側部にフリットを設ける段階と、
前記有機発光素子に対向する封止基板の一面にシール材を設ける段階と、
前記基板と前記封止基板とを結合する段階と、
前記シール材を光硬化し、硬化部と非硬化部を設ける段階と、
前記結合された基板をスクライブし、スクライブラインのシール材を除去する段階と、
前記非硬化部を熱硬化させる段階と、を備えることを特徴とする有機電界発光表示装置の製造方法。 - 前記シール材は、前記フリットが設けられた領域が硬化し、前記有機発光素子が位置する領域及びスクライブライン領域が硬化しないことを特徴とする請求項13に記載の有機電界発光表示装置の製造方法。
- 前記シール材は、ウレタンアクリルで形成されることを特徴とする請求項13に記載の有機電界発光表示装置の製造方法。
- 前記フリットは、酸化マグネシウム(MgO)、酸化カルシウム(CaO)、酸化バリウム(BaO)、酸化リチウム(Li2O)、酸化ナトリウム(Na2O)、酸化カリウム(K2O)、酸化ホウ素(B2O3)、酸化バナジウム(V2O5)、酸化亜鉛(ZnO)、酸化テルル(TeO2)、酸化アルミニウム(Al2O3)、二酸化シリコン(SiO2)、酸化鉛(PbO)、酸化スズ(SnO)、酸化リン(P2O5)、酸化ルテニウム(Ru2O)、酸化ルビジウム(Rb2O)、酸化ロジウム(Rh2O)、酸化フェライト(Fe2O3)、酸化銅(CuO)、酸化チタニウム(TiO2)、酸化タングステン(WO3)、酸化ビスマス(Bi2O3)、酸化アンチモン(Sb2O3)、ホウ酸鉛ガラス、リン酸スズガラス、バナジン酸ガラス、及びホウケイ酸ガラスよりなる群から選ばれた一種以上を使用することを特徴とする請求項13に記載の有機電界発光表示装置の製造方法。
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KR20170120555A (ko) | 2015-02-24 | 2017-10-31 | 세키스이가가쿠 고교가부시키가이샤 | 유기 일렉트로루미네선스 표시 소자용 봉지제 |
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Also Published As
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US20070090759A1 (en) | 2007-04-26 |
TWI333391B (en) | 2010-11-11 |
KR100685845B1 (ko) | 2007-02-22 |
US7545094B2 (en) | 2009-06-09 |
JP4642727B2 (ja) | 2011-03-02 |
CN1953199A (zh) | 2007-04-25 |
US7838314B2 (en) | 2010-11-23 |
EP1777748A3 (en) | 2010-09-15 |
EP1777748A2 (en) | 2007-04-25 |
US20090221109A1 (en) | 2009-09-03 |
TW200718269A (en) | 2007-05-01 |
CN1953199B (zh) | 2010-07-21 |
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