JP2007036058A - 半田付け実装構造およびその製造方法、並びにその利用 - Google Patents
半田付け実装構造およびその製造方法、並びにその利用 Download PDFInfo
- Publication number
- JP2007036058A JP2007036058A JP2005219547A JP2005219547A JP2007036058A JP 2007036058 A JP2007036058 A JP 2007036058A JP 2005219547 A JP2005219547 A JP 2005219547A JP 2005219547 A JP2005219547 A JP 2005219547A JP 2007036058 A JP2007036058 A JP 2007036058A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- mounting
- electrode
- substrate
- alignment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09372—Pads and lands
- H05K2201/094—Array of pads or lands differing from one another, e.g. in size, pitch, thickness; Using different connections on the pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10234—Metallic balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/048—Self-alignment during soldering; Terminals, pads or shape of solder adapted therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3463—Solder compositions in relation to features of the printed circuit board or the mounting process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/368—Assembling printed circuits with other printed circuits parallel to each other
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Abstract
【解決手段】 本発明のカメラモジュール構造は、プリント基板1に形成された基板電極2と、そのプリント基板1に実装されたカメラモジュール3に形成された実装電極4とが、半田接合部5を介して接合され、基板電極2と実装電極4とが、セルフアライメントにより位置合わせされている。そして、半田接合部5が、半田接合のための半田部16と、カメラモジュール3を支持するための支持部17とから構成されている。
【選択図】 図1
Description
2 基板電極(凹部が形成された電極)
3 カメラモジュール(実装部品、光学素子)
4 実装電極(凹部が形成された電極)
5 半田接合部
10 カメラモジュール構造(半田付け実装構造)
16 半田部
17 支持部(球状部材)
20a,20b 凹部
Claims (13)
- 基板に形成された基板電極と、その基板に実装された実装部品に形成された実装電極とが、半田接合部を介して接合され、
上記半田接合部が、半田接合のための半田部と、実装部品を支持するための支持部とを有することを特徴とする半田付け実装構造。 - 上記支持部が、半田部を構成する半田よりも溶融温度が高い材料からなることを特徴とする請求項1に記載の半田付け実装構造。
- 上記支持部が、導電性物質からなることを特徴とする請求項1に記載の半田付け実装構造。
- 上記支持部が球状であるとともに、
上記支持部が、上記基板電極および実装電極のそれぞれに形成された凹部に挟持されていることを特徴とする請求項1に記載の半田付け実装構造。 - 上記基板電極および実装電極は、上記半田接合部に覆われていることを特徴とする請求項1に記載の半田付け実装構造。
- 上記支持部は、上記半田接合部の中央部に設けられていることを特徴とする請求項1に記載の半田付け実装構造。
- 上記半田部が、鉛フリー半田からなることを特徴とする請求項1に記載の半田付け実装構造。
- 上記実装部品が、光学素子であることを特徴とする請求項1に記載の半田付け実装構造。
- 基板に形成された基板電極と、その基板に実装される実装部品に形成された実装電極とが、半田接合部によって接合された半田付け実装構造の製造方法であって、
半田接合のための半田部と、実装部品を支持するための支持部とを有する半田接合部を形成し、
上記支持部により実装部品を支持しながら、半田部を構成する半田のセルフアライメントにより、基板電極と実装電極との位置合わせを行うことを特徴とする半田付け実装構造の製造方法。 - 上記支持部として、球状部材を用いることを特徴とする請求項9に記載の半田付け実装構造の製造方法。
- 上記基板電極および実装電極として、凹部が形成された電極を用いることを特徴とする請求項10に記載の半田付け実装構造の製造方法。
- 請求項1〜8のいずれか1項に記載の半田付け実装構造を備えることを特徴とする電子機器。
- 基板に形成された基板電極と、その基板に実装される実装部品に形成された実装電極とを、半田接合部によって接合する半田付け実装方法であって、
半田接合のための半田部と、実装部品を支持するための支持部とを有する半田接合部を形成し、
上記支持部により実装部品を支持しながら、半田部を構成する半田のセルフアライメントにより、基板電極と実装電極との位置合わせを行うことを特徴とする半田付け実装方法。
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005219547A JP4421528B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造およびその製造方法、並びにその利用 |
PCT/JP2006/314379 WO2007013344A1 (ja) | 2005-07-28 | 2006-07-20 | 半田付け実装構造およびその製造方法、並びにその利用 |
EP06781339A EP1912485A1 (en) | 2005-07-28 | 2006-07-20 | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
KR1020087004274A KR101058390B1 (ko) | 2005-07-28 | 2006-07-20 | 납땜 실장 구조, 그 제조 방법, 및 그 이용 |
CN2006800274471A CN101233794B (zh) | 2005-07-28 | 2006-07-20 | 钎焊安装结构及其制造方法以及该钎焊安装结构的应用 |
TW095127495A TWI328989B (en) | 2005-07-28 | 2006-07-27 | Soldered package, manufacturing method of same, and utilization of same |
US12/011,565 US7968801B2 (en) | 2005-07-28 | 2008-01-25 | Solder mounting structure, method for manufacturing such solder mounting structure and use of such solder mounting structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005219547A JP4421528B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造およびその製造方法、並びにその利用 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2007036058A true JP2007036058A (ja) | 2007-02-08 |
JP4421528B2 JP4421528B2 (ja) | 2010-02-24 |
Family
ID=37683245
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2005219547A Expired - Fee Related JP4421528B2 (ja) | 2005-07-28 | 2005-07-28 | 半田付け実装構造およびその製造方法、並びにその利用 |
Country Status (7)
Country | Link |
---|---|
US (1) | US7968801B2 (ja) |
EP (1) | EP1912485A1 (ja) |
JP (1) | JP4421528B2 (ja) |
KR (1) | KR101058390B1 (ja) |
CN (1) | CN101233794B (ja) |
TW (1) | TWI328989B (ja) |
WO (1) | WO2007013344A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1944623A2 (en) | 2007-01-12 | 2008-07-16 | Konica Minolta Medical & Graphic, Inc. | Radiation image detecting device and radiation image radiographing system |
JP2012199400A (ja) * | 2011-03-22 | 2012-10-18 | Nichicon Corp | パワーモジュール |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE112016007096B4 (de) * | 2016-07-28 | 2023-06-29 | Mitsubishi Electric Corporation | Halbleitervorrichtung |
JPWO2020100555A1 (ja) * | 2018-11-16 | 2021-10-07 | パナソニックIpマネジメント株式会社 | ロウ付け作業支援方法、プログラム及びロウ付け作業支援システム |
CN110691464A (zh) * | 2019-10-14 | 2020-01-14 | 业成科技(成都)有限公司 | 避免Mini LED位移之焊接结构 |
KR102461313B1 (ko) * | 2020-05-19 | 2022-11-01 | 엠케이전자 주식회사 | 리버스 리플로우용 심재를 이용한 반도체 패키지 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0437147A (ja) | 1990-06-01 | 1992-02-07 | Oki Electric Ind Co Ltd | 半導体チップの実装方法 |
JPH1117065A (ja) * | 1997-06-27 | 1999-01-22 | Kyocera Corp | 配線基板とそれを用いた半導体素子収納用パッケージおよびその実装構造 |
US6005198A (en) * | 1997-10-07 | 1999-12-21 | Dimensional Circuits Corporation | Wiring board constructions and methods of making same |
JP2001060759A (ja) | 1999-08-19 | 2001-03-06 | Yaskawa Electric Corp | 電子部品のボール端子接続構造 |
JP2002151532A (ja) | 2000-11-08 | 2002-05-24 | Sharp Corp | 電子部品、半導体装置の実装方法および半導体装置の実装構造 |
JP2002368373A (ja) * | 2001-06-06 | 2002-12-20 | Toyo Commun Equip Co Ltd | 電子デバイス |
JP2003188515A (ja) | 2001-12-19 | 2003-07-04 | Sony Corp | はんだ付け装置、はんだ付け方法、プリント回路板の製造装置及び方法 |
JP4052848B2 (ja) | 2002-02-15 | 2008-02-27 | 日本オプネクスト株式会社 | 光素子の実装方法 |
JP4416373B2 (ja) * | 2002-03-08 | 2010-02-17 | 株式会社日立製作所 | 電子機器 |
JP4104889B2 (ja) * | 2002-03-29 | 2008-06-18 | 株式会社東芝 | 光半導体装置 |
FI20020992A (fi) * | 2002-05-27 | 2003-11-28 | Nokia Corp | Komponentin kiinnitysrakenne |
US7038917B2 (en) * | 2002-12-27 | 2006-05-02 | Vlt, Inc. | Low loss, high density array interconnection |
JP2004342959A (ja) * | 2003-05-19 | 2004-12-02 | Sharp Corp | 半導体装置およびその製造方法 |
JP4791685B2 (ja) * | 2003-05-22 | 2011-10-12 | シャープ株式会社 | 導電性ボール、電極構造、電子部品の電極の形成方法、電子部品ならびに電子機器 |
US8033016B2 (en) * | 2005-04-15 | 2011-10-11 | Panasonic Corporation | Method for manufacturing an electrode and electrode component mounted body |
-
2005
- 2005-07-28 JP JP2005219547A patent/JP4421528B2/ja not_active Expired - Fee Related
-
2006
- 2006-07-20 WO PCT/JP2006/314379 patent/WO2007013344A1/ja active Application Filing
- 2006-07-20 CN CN2006800274471A patent/CN101233794B/zh not_active Expired - Fee Related
- 2006-07-20 EP EP06781339A patent/EP1912485A1/en not_active Withdrawn
- 2006-07-20 KR KR1020087004274A patent/KR101058390B1/ko not_active IP Right Cessation
- 2006-07-27 TW TW095127495A patent/TWI328989B/zh not_active IP Right Cessation
-
2008
- 2008-01-25 US US12/011,565 patent/US7968801B2/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1944623A2 (en) | 2007-01-12 | 2008-07-16 | Konica Minolta Medical & Graphic, Inc. | Radiation image detecting device and radiation image radiographing system |
JP2012199400A (ja) * | 2011-03-22 | 2012-10-18 | Nichicon Corp | パワーモジュール |
Also Published As
Publication number | Publication date |
---|---|
JP4421528B2 (ja) | 2010-02-24 |
EP1912485A1 (en) | 2008-04-16 |
TW200727758A (en) | 2007-07-16 |
CN101233794A (zh) | 2008-07-30 |
KR20080027961A (ko) | 2008-03-28 |
US20080237302A1 (en) | 2008-10-02 |
CN101233794B (zh) | 2011-03-30 |
TWI328989B (en) | 2010-08-11 |
KR101058390B1 (ko) | 2011-08-22 |
US7968801B2 (en) | 2011-06-28 |
WO2007013344A1 (ja) | 2007-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR100776114B1 (ko) | 땜납 접합용 페이스트 및 이를 이용한 땜납 접합 방법 | |
KR101332532B1 (ko) | 전자 장치의 제조 방법, 전자 부품 탑재용 기판 및 반도체 소자 탑재용 기판의 제조 방법 | |
KR101209845B1 (ko) | 전자부품 땜납 방법 및 전자부품 땜납 구조 | |
JP4421528B2 (ja) | 半田付け実装構造およびその製造方法、並びにその利用 | |
KR20010112057A (ko) | 반도체 모듈 및 반도체 장치를 접속한 회로 기판 | |
KR20050083640A (ko) | 리드 프리 솔더 접합용 솔더 계층구조 | |
JP4040644B2 (ja) | 半田付け実装構造の製造方法および半田付け実装方法 | |
US20230006107A1 (en) | Substrate, method for forming the same, display device and for forming the same | |
KR20080038028A (ko) | 기판에 전자 부품을 탑재하는 방법 및 솔더면을 형성하는방법 | |
JP4696110B2 (ja) | 電子部品の実装方法及び電子部品実装装置 | |
JP2005167257A (ja) | はんだ付け方法 | |
JP2002076605A (ja) | 半導体モジュール及び半導体装置を接続した回路基板 | |
JP2007194495A (ja) | チップ部品の製造方法 | |
JP2008027954A (ja) | 電子部品実装基板の製造方法 | |
JP2013121142A (ja) | 撮像装置および撮像装置の製造方法 | |
JP3864172B2 (ja) | はんだ付け用組成物 | |
JP2010287654A (ja) | 電子部品の製造方法 | |
JPH10144850A (ja) | 接続ピンと基板実装方法 | |
JP2007288075A (ja) | 半導体装置 | |
US20090111299A1 (en) | Surface Mount Array Connector Leads Planarization Using Solder Reflow Method | |
JP3286805B2 (ja) | ソルダーペースト組成物及びリフローはんだ付け方法 | |
JP2006012883A (ja) | 電子部品はんだ接合方法,エリアアレイ型電子部品,電子回路基板および電子部品ユニット |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061201 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070116 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070319 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070522 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070719 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20070815 |
|
A912 | Re-examination (zenchi) completed and case transferred to appeal board |
Free format text: JAPANESE INTERMEDIATE CODE: A912 Effective date: 20070907 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20091106 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20091202 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121211 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121211 Year of fee payment: 3 |
|
LAPS | Cancellation because of no payment of annual fees |