JP2007035848A - 積層セラミックコンデンサ及びその製造方法 - Google Patents

積層セラミックコンデンサ及びその製造方法 Download PDF

Info

Publication number
JP2007035848A
JP2007035848A JP2005215839A JP2005215839A JP2007035848A JP 2007035848 A JP2007035848 A JP 2007035848A JP 2005215839 A JP2005215839 A JP 2005215839A JP 2005215839 A JP2005215839 A JP 2005215839A JP 2007035848 A JP2007035848 A JP 2007035848A
Authority
JP
Japan
Prior art keywords
internal electrode
electrode layers
unfired
ceramic capacitor
multilayer ceramic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2005215839A
Other languages
English (en)
Japanese (ja)
Inventor
Jun Nishikawa
潤 西川
Yoichi Mizuno
洋一 水野
Hirokazu Orimo
寛和 織茂
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Taiyo Yuden Co Ltd
Original Assignee
Taiyo Yuden Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiyo Yuden Co Ltd filed Critical Taiyo Yuden Co Ltd
Priority to JP2005215839A priority Critical patent/JP2007035848A/ja
Priority to KR1020060069819A priority patent/KR20070014052A/ko
Priority to US11/493,101 priority patent/US7495883B2/en
Priority to TW095127210A priority patent/TW200713356A/zh
Priority to CN2006100995265A priority patent/CN1905098B/zh
Publication of JP2007035848A publication Critical patent/JP2007035848A/ja
Withdrawn legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/008—Selection of materials
    • H01G4/0085—Fried electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Capacitors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
JP2005215839A 2005-07-26 2005-07-26 積層セラミックコンデンサ及びその製造方法 Withdrawn JP2007035848A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005215839A JP2007035848A (ja) 2005-07-26 2005-07-26 積層セラミックコンデンサ及びその製造方法
KR1020060069819A KR20070014052A (ko) 2005-07-26 2006-07-25 적층 세라믹 콘덴서 및 그 제조 방법
US11/493,101 US7495883B2 (en) 2005-07-26 2006-07-25 Multilayer ceramic capacitor and method for manufacturing the same
TW095127210A TW200713356A (en) 2005-07-26 2006-07-26 Multilayer ceramic capacitor and method for manufacturing the same
CN2006100995265A CN1905098B (zh) 2005-07-26 2006-07-26 积层陶瓷电容器及其制造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005215839A JP2007035848A (ja) 2005-07-26 2005-07-26 積層セラミックコンデンサ及びその製造方法

Publications (1)

Publication Number Publication Date
JP2007035848A true JP2007035848A (ja) 2007-02-08

Family

ID=37674326

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2005215839A Withdrawn JP2007035848A (ja) 2005-07-26 2005-07-26 積層セラミックコンデンサ及びその製造方法

Country Status (5)

Country Link
US (1) US7495883B2 (cg-RX-API-DMAC10.html)
JP (1) JP2007035848A (cg-RX-API-DMAC10.html)
KR (1) KR20070014052A (cg-RX-API-DMAC10.html)
CN (1) CN1905098B (cg-RX-API-DMAC10.html)
TW (1) TW200713356A (cg-RX-API-DMAC10.html)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014103422A (ja) * 2014-03-10 2014-06-05 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
KR101454059B1 (ko) * 2007-09-18 2014-10-27 에프코스 아게 전기적 다층 소자
CN108231414A (zh) * 2016-12-21 2018-06-29 太阳诱电株式会社 多层陶瓷电容器及多层陶瓷电容器的制造方法
CN114121494A (zh) * 2021-11-30 2022-03-01 上海交通大学 3d多层高介电常数高功率密度超级电容器和微加工方法

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101079478B1 (ko) 2009-12-30 2011-11-03 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
KR101141369B1 (ko) * 2010-12-13 2012-05-03 삼성전기주식회사 적층 세라믹 콘덴서 및 그 제조방법
CN103794361A (zh) * 2011-04-07 2014-05-14 徐孝华 一种积层陶瓷电容器
JP6094597B2 (ja) * 2012-12-18 2017-03-15 株式会社村田製作所 積層セラミック電子部品
KR101462761B1 (ko) 2013-02-13 2014-11-20 삼성전기주식회사 다층 세라믹 소자 및 그 제조 방법
KR101525676B1 (ko) * 2013-09-24 2015-06-03 삼성전기주식회사 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판
JP2016127262A (ja) * 2014-12-26 2016-07-11 太陽誘電株式会社 貫通型積層セラミックコンデンサ
US10777359B2 (en) 2017-01-25 2020-09-15 Holy Stone Enterprise Co., Ltd. Multilayer ceramic capacitor
TWI665691B (zh) * 2017-01-25 2019-07-11 禾伸堂企業股份有限公司 積層陶瓷電容器及其製造方法
JP6954519B2 (ja) * 2017-04-11 2021-10-27 太陽誘電株式会社 積層セラミックコンデンサ
KR102694713B1 (ko) * 2019-12-03 2024-08-13 삼성전기주식회사 적층형 전자 부품
JP7498912B2 (ja) * 2019-12-06 2024-06-13 太陽誘電株式会社 セラミック電子部品、実装基板およびセラミック電子部品の製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5014158A (en) * 1989-04-11 1991-05-07 Matsushita Electric Industrial Co., Ltd. Laminated ceramic capacitor
DE69027394T2 (de) * 1989-10-18 1997-02-06 Tdk Corp Keramischer Mehrschicht-Chipkondensator und Verfahren zu seiner Herstellung
JP2852809B2 (ja) 1990-11-30 1999-02-03 太陽誘電株式会社 積層セラミックコンデンサの製造方法
JPH08273970A (ja) 1995-03-29 1996-10-18 Murata Mfg Co Ltd 積層セラミック電子部品
JP3024536B2 (ja) * 1995-12-20 2000-03-21 株式会社村田製作所 積層セラミックコンデンサ
JPH11176642A (ja) * 1997-12-08 1999-07-02 Taiyo Yuden Co Ltd 電子部品とその製造方法
JP3419713B2 (ja) 1999-09-06 2003-06-23 ティーディーケイ株式会社 積層型セラミックチップコンデンサの製造方法
JP2003022930A (ja) 2001-07-09 2003-01-24 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
TWI223291B (en) * 2001-10-25 2004-11-01 Matsushita Electric Industrial Co Ltd Laminated ceramic electronic component and method of manufacturing the same
KR100586961B1 (ko) * 2004-04-14 2006-06-08 삼성전기주식회사 내환원성 유전체 자기조성물과 초박층 적층세라믹 콘덴서
JP4295179B2 (ja) * 2004-08-31 2009-07-15 Tdk株式会社 電子部品およびその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101454059B1 (ko) * 2007-09-18 2014-10-27 에프코스 아게 전기적 다층 소자
JP2014103422A (ja) * 2014-03-10 2014-06-05 Taiyo Yuden Co Ltd 積層セラミックコンデンサ
CN108231414A (zh) * 2016-12-21 2018-06-29 太阳诱电株式会社 多层陶瓷电容器及多层陶瓷电容器的制造方法
CN114121494A (zh) * 2021-11-30 2022-03-01 上海交通大学 3d多层高介电常数高功率密度超级电容器和微加工方法
CN114121494B (zh) * 2021-11-30 2023-04-18 上海交通大学 3d多层高介电常数高功率密度超级电容器和微加工方法

Also Published As

Publication number Publication date
CN1905098B (zh) 2011-01-12
CN1905098A (zh) 2007-01-31
US20070025056A1 (en) 2007-02-01
TW200713356A (en) 2007-04-01
TWI326090B (cg-RX-API-DMAC10.html) 2010-06-11
US7495883B2 (en) 2009-02-24
KR20070014052A (ko) 2007-01-31

Similar Documents

Publication Publication Date Title
JP6812477B2 (ja) 積層セラミックキャパシタ、積層セラミックキャパシタの製造方法、及び積層セラミックキャパシタの実装基板
JP4305808B2 (ja) 積層コンデンサ
JP2023052913A (ja) 積層セラミックキャパシタ及びその製造方法
CN104240950B (zh) 多层陶瓷电容器和安装有该多层陶瓷电容器的板
KR101642636B1 (ko) 적층 세라믹 전자부품 및 적층 세라믹 전자부품의 실장기판
JP5825322B2 (ja) 積層セラミックキャパシタ、その製造方法及び積層セラミックキャパシタの実装基板
KR101983129B1 (ko) 적층 세라믹 전자부품 및 이의 제조방법
KR102061507B1 (ko) 적층 세라믹 전자부품 및 적층 세라믹 전자부품 실장 기판
JP2020167231A (ja) 積層セラミックコンデンサおよび積層セラミックコンデンサの製造方法
TWI326090B (cg-RX-API-DMAC10.html)
JP5423977B2 (ja) 積層セラミック電子部品の製造方法
KR101434103B1 (ko) 적층 세라믹 전자부품 및 적층 세라믹 전자부품의 실장 기판
WO2011114808A1 (ja) 積層セラミック電子部品
JP2016115448A (ja) 導電性ペーストおよびセラミック電子部品
KR20150011264A (ko) 적층 세라믹 전자부품 및 이의 제조방법
JPH10335168A (ja) 積層セラミックコンデンサ
JP2010212503A (ja) 積層セラミックコンデンサ
JP4175284B2 (ja) 積層セラミック電子部品の製造方法
JP2001217137A (ja) 積層セラミック電子部品およびその製造方法
JP4858233B2 (ja) グリーンシート積層ユニット、電子部品の製造方法、および電子部品
JP3939281B2 (ja) 電極ペースト及びこれを用いたセラミック電子部品の製造方法
JP2023063203A (ja) 積層型キャパシタ
JP5527400B2 (ja) 積層セラミック電子部品
JP5527403B2 (ja) 積層セラミック電子部品
JP4387150B2 (ja) 積層セラミック電子部品およびその製造方法

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20070320

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20090324

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20090525

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20090819

A761 Written withdrawal of application

Free format text: JAPANESE INTERMEDIATE CODE: A761

Effective date: 20091109