CN1905098B - 积层陶瓷电容器及其制造方法 - Google Patents
积层陶瓷电容器及其制造方法 Download PDFInfo
- Publication number
- CN1905098B CN1905098B CN2006100995265A CN200610099526A CN1905098B CN 1905098 B CN1905098 B CN 1905098B CN 2006100995265 A CN2006100995265 A CN 2006100995265A CN 200610099526 A CN200610099526 A CN 200610099526A CN 1905098 B CN1905098 B CN 1905098B
- Authority
- CN
- China
- Prior art keywords
- internal electrode
- electrode layers
- ceramic capacitor
- electrode layer
- interior electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/30—Stacked capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/008—Selection of materials
- H01G4/0085—Fried electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/005—Electrodes
- H01G4/012—Form of non-self-supporting electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005215839A JP2007035848A (ja) | 2005-07-26 | 2005-07-26 | 積層セラミックコンデンサ及びその製造方法 |
| JP2005-215839 | 2005-07-26 | ||
| JP2005215839 | 2005-07-26 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1905098A CN1905098A (zh) | 2007-01-31 |
| CN1905098B true CN1905098B (zh) | 2011-01-12 |
Family
ID=37674326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2006100995265A Expired - Lifetime CN1905098B (zh) | 2005-07-26 | 2006-07-26 | 积层陶瓷电容器及其制造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US7495883B2 (cg-RX-API-DMAC10.html) |
| JP (1) | JP2007035848A (cg-RX-API-DMAC10.html) |
| KR (1) | KR20070014052A (cg-RX-API-DMAC10.html) |
| CN (1) | CN1905098B (cg-RX-API-DMAC10.html) |
| TW (1) | TW200713356A (cg-RX-API-DMAC10.html) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581284B (zh) * | 2014-12-26 | 2017-05-01 | Taiyo Yuden Kk | Through type laminated ceramic capacitors |
Families Citing this family (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007044453A1 (de) * | 2007-09-18 | 2009-03-26 | Epcos Ag | Elektrisches Vielschichtbauelement |
| KR101079478B1 (ko) | 2009-12-30 | 2011-11-03 | 삼성전기주식회사 | 적층 세라믹 커패시터 및 그 제조방법 |
| KR101141369B1 (ko) * | 2010-12-13 | 2012-05-03 | 삼성전기주식회사 | 적층 세라믹 콘덴서 및 그 제조방법 |
| CN103794361A (zh) * | 2011-04-07 | 2014-05-14 | 徐孝华 | 一种积层陶瓷电容器 |
| JP6094597B2 (ja) * | 2012-12-18 | 2017-03-15 | 株式会社村田製作所 | 積層セラミック電子部品 |
| KR101462761B1 (ko) | 2013-02-13 | 2014-11-20 | 삼성전기주식회사 | 다층 세라믹 소자 및 그 제조 방법 |
| KR101525676B1 (ko) * | 2013-09-24 | 2015-06-03 | 삼성전기주식회사 | 기판 내장용 적층 세라믹 전자부품, 그 제조방법 및 적층 세라믹 전자부품 내장형 인쇄회로기판 |
| JP5827358B2 (ja) * | 2014-03-10 | 2015-12-02 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| JP6933461B2 (ja) * | 2016-12-21 | 2021-09-08 | 太陽誘電株式会社 | 積層セラミックコンデンサおよびその製造方法 |
| US10777359B2 (en) | 2017-01-25 | 2020-09-15 | Holy Stone Enterprise Co., Ltd. | Multilayer ceramic capacitor |
| TWI665691B (zh) * | 2017-01-25 | 2019-07-11 | 禾伸堂企業股份有限公司 | 積層陶瓷電容器及其製造方法 |
| JP6954519B2 (ja) * | 2017-04-11 | 2021-10-27 | 太陽誘電株式会社 | 積層セラミックコンデンサ |
| KR102694713B1 (ko) * | 2019-12-03 | 2024-08-13 | 삼성전기주식회사 | 적층형 전자 부품 |
| JP7498912B2 (ja) * | 2019-12-06 | 2024-06-13 | 太陽誘電株式会社 | セラミック電子部品、実装基板およびセラミック電子部品の製造方法 |
| CN114121494B (zh) * | 2021-11-30 | 2023-04-18 | 上海交通大学 | 3d多层高介电常数高功率密度超级电容器和微加工方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014158A (en) * | 1989-04-11 | 1991-05-07 | Matsushita Electric Industrial Co., Ltd. | Laminated ceramic capacitor |
| US5097391A (en) * | 1989-10-18 | 1992-03-17 | Tdk Corporation | Ceramic multilayer chip capacitor and method for making |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2852809B2 (ja) | 1990-11-30 | 1999-02-03 | 太陽誘電株式会社 | 積層セラミックコンデンサの製造方法 |
| JPH08273970A (ja) | 1995-03-29 | 1996-10-18 | Murata Mfg Co Ltd | 積層セラミック電子部品 |
| JP3024536B2 (ja) * | 1995-12-20 | 2000-03-21 | 株式会社村田製作所 | 積層セラミックコンデンサ |
| JPH11176642A (ja) * | 1997-12-08 | 1999-07-02 | Taiyo Yuden Co Ltd | 電子部品とその製造方法 |
| JP3419713B2 (ja) | 1999-09-06 | 2003-06-23 | ティーディーケイ株式会社 | 積層型セラミックチップコンデンサの製造方法 |
| JP2003022930A (ja) | 2001-07-09 | 2003-01-24 | Taiyo Yuden Co Ltd | 積層セラミックコンデンサ |
| TWI223291B (en) * | 2001-10-25 | 2004-11-01 | Matsushita Electric Industrial Co Ltd | Laminated ceramic electronic component and method of manufacturing the same |
| KR100586961B1 (ko) * | 2004-04-14 | 2006-06-08 | 삼성전기주식회사 | 내환원성 유전체 자기조성물과 초박층 적층세라믹 콘덴서 |
| JP4295179B2 (ja) * | 2004-08-31 | 2009-07-15 | Tdk株式会社 | 電子部品およびその製造方法 |
-
2005
- 2005-07-26 JP JP2005215839A patent/JP2007035848A/ja not_active Withdrawn
-
2006
- 2006-07-25 US US11/493,101 patent/US7495883B2/en active Active
- 2006-07-25 KR KR1020060069819A patent/KR20070014052A/ko not_active Ceased
- 2006-07-26 CN CN2006100995265A patent/CN1905098B/zh not_active Expired - Lifetime
- 2006-07-26 TW TW095127210A patent/TW200713356A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5014158A (en) * | 1989-04-11 | 1991-05-07 | Matsushita Electric Industrial Co., Ltd. | Laminated ceramic capacitor |
| US5097391A (en) * | 1989-10-18 | 1992-03-17 | Tdk Corporation | Ceramic multilayer chip capacitor and method for making |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI581284B (zh) * | 2014-12-26 | 2017-05-01 | Taiyo Yuden Kk | Through type laminated ceramic capacitors |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1905098A (zh) | 2007-01-31 |
| US20070025056A1 (en) | 2007-02-01 |
| TW200713356A (en) | 2007-04-01 |
| TWI326090B (cg-RX-API-DMAC10.html) | 2010-06-11 |
| US7495883B2 (en) | 2009-02-24 |
| JP2007035848A (ja) | 2007-02-08 |
| KR20070014052A (ko) | 2007-01-31 |
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