JP2006526895A5 - - Google Patents

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Publication number
JP2006526895A5
JP2006526895A5 JP2006514212A JP2006514212A JP2006526895A5 JP 2006526895 A5 JP2006526895 A5 JP 2006526895A5 JP 2006514212 A JP2006514212 A JP 2006514212A JP 2006514212 A JP2006514212 A JP 2006514212A JP 2006526895 A5 JP2006526895 A5 JP 2006526895A5
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JP
Japan
Prior art keywords
composition
concentration
weight
corrosion inhibitor
sif
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Pending
Application number
JP2006514212A
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English (en)
Japanese (ja)
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JP2006526895A (ja
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Priority claimed from PCT/US2004/013588 external-priority patent/WO2004100245A1/en
Publication of JP2006526895A publication Critical patent/JP2006526895A/ja
Publication of JP2006526895A5 publication Critical patent/JP2006526895A5/ja
Pending legal-status Critical Current

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JP2006514212A 2003-05-02 2004-05-03 半導体処理におけるエッチング後の残留物の除去 Pending JP2006526895A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US46713403P 2003-05-02 2003-05-02
PCT/US2004/013588 WO2004100245A1 (en) 2003-05-02 2004-05-03 Removal of post-etch residues in semiconductor processing

Publications (2)

Publication Number Publication Date
JP2006526895A JP2006526895A (ja) 2006-11-24
JP2006526895A5 true JP2006526895A5 (https=) 2007-07-05

Family

ID=33435028

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2006514212A Pending JP2006526895A (ja) 2003-05-02 2004-05-03 半導体処理におけるエッチング後の残留物の除去

Country Status (7)

Country Link
US (1) US7479474B2 (https=)
EP (1) EP1620882A1 (https=)
JP (1) JP2006526895A (https=)
KR (1) KR20060014388A (https=)
CN (1) CN100442449C (https=)
TW (1) TW200428512A (https=)
WO (1) WO2004100245A1 (https=)

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JP5646882B2 (ja) * 2009-09-30 2014-12-24 富士フイルム株式会社 洗浄組成物、洗浄方法、及び半導体装置の製造方法
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RU2631870C2 (ru) * 2012-02-06 2017-09-28 Басф Се Композиция для очистки после химико-механического полирования (после - смр), содержащая конкретное содержащее серу соединение и сахарный спирт или поликарбоновую кислоту
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CN108166002B (zh) * 2017-12-27 2020-01-07 吉林省电力科学研究院有限公司 一种适用于化学清洗的低温除油漂洗洗液及其使用工艺
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