JP2006518800A5 - - Google Patents
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- Publication number
- JP2006518800A5 JP2006518800A5 JP2006503734A JP2006503734A JP2006518800A5 JP 2006518800 A5 JP2006518800 A5 JP 2006518800A5 JP 2006503734 A JP2006503734 A JP 2006503734A JP 2006503734 A JP2006503734 A JP 2006503734A JP 2006518800 A5 JP2006518800 A5 JP 2006518800A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- composition
- molding composition
- compound
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 claims 36
- 229920000647 polyepoxide Polymers 0.000 claims 36
- 238000000465 moulding Methods 0.000 claims 32
- 239000003795 chemical substances by application Substances 0.000 claims 23
- 150000004714 phosphonium salts Chemical class 0.000 claims 14
- 150000001875 compounds Chemical class 0.000 claims 13
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 claims 12
- 239000003054 catalyst Substances 0.000 claims 11
- 238000000034 method Methods 0.000 claims 11
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 10
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical group OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims 8
- ZQKXQUJXLSSJCH-UHFFFAOYSA-N melamine cyanurate Chemical compound NC1=NC(N)=NC(N)=N1.O=C1NC(=O)NC(=O)N1 ZQKXQUJXLSSJCH-UHFFFAOYSA-N 0.000 claims 7
- HZZUMXSLPJFMCB-UHFFFAOYSA-M ethyl(triphenyl)phosphanium;acetate Chemical compound CC([O-])=O.C=1C=CC=CC=1[P+](C=1C=CC=CC=1)(CC)C1=CC=CC=C1 HZZUMXSLPJFMCB-UHFFFAOYSA-M 0.000 claims 6
- 239000003063 flame retardant Substances 0.000 claims 6
- 229920003986 novolac Polymers 0.000 claims 6
- 239000011256 inorganic filler Substances 0.000 claims 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims 5
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 4
- 239000003431 cross linking reagent Substances 0.000 claims 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 claims 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 4
- -1 flame retardant compound Chemical class 0.000 claims 4
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 claims 4
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 claims 3
- 238000004132 cross linking Methods 0.000 claims 3
- 238000007789 sealing Methods 0.000 claims 3
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 claims 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims 2
- 239000004971 Cross linker Substances 0.000 claims 2
- 239000004593 Epoxy Substances 0.000 claims 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 150000008065 acid anhydrides Chemical class 0.000 claims 2
- 125000002723 alicyclic group Chemical group 0.000 claims 2
- 235000010290 biphenyl Nutrition 0.000 claims 2
- 239000004305 biphenyl Substances 0.000 claims 2
- 229930003836 cresol Natural products 0.000 claims 2
- 230000000694 effects Effects 0.000 claims 2
- 150000002118 epoxides Chemical group 0.000 claims 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 claims 2
- 238000010438 heat treatment Methods 0.000 claims 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims 2
- 229940087305 limonene Drugs 0.000 claims 2
- 235000001510 limonene Nutrition 0.000 claims 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims 2
- 125000001624 naphthyl group Chemical group 0.000 claims 2
- 229920000642 polymer Polymers 0.000 claims 2
- 239000004065 semiconductor Substances 0.000 claims 2
- 150000003512 tertiary amines Chemical class 0.000 claims 2
- IGZBSJAMZHNHKE-UHFFFAOYSA-N 2-[[4-[bis[4-(oxiran-2-ylmethoxy)phenyl]methyl]phenoxy]methyl]oxirane Chemical compound C1OC1COC(C=C1)=CC=C1C(C=1C=CC(OCC2OC2)=CC=1)C(C=C1)=CC=C1OCC1CO1 IGZBSJAMZHNHKE-UHFFFAOYSA-N 0.000 claims 1
- LYWVNPSVLAFTFX-UHFFFAOYSA-N 4-methylbenzenesulfonate;morpholin-4-ium Chemical compound C1COCCN1.CC1=CC=C(S(O)(=O)=O)C=C1 LYWVNPSVLAFTFX-UHFFFAOYSA-N 0.000 claims 1
- 239000005995 Aluminium silicate Substances 0.000 claims 1
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- RREGISFBPQOLTM-UHFFFAOYSA-N alumane;trihydrate Chemical compound O.O.O.[AlH3] RREGISFBPQOLTM-UHFFFAOYSA-N 0.000 claims 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims 1
- 229910000323 aluminium silicate Inorganic materials 0.000 claims 1
- 235000012211 aluminium silicate Nutrition 0.000 claims 1
- 229910000019 calcium carbonate Inorganic materials 0.000 claims 1
- 239000007795 chemical reaction product Substances 0.000 claims 1
- 239000004927 clay Substances 0.000 claims 1
- 229910052570 clay Inorganic materials 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 claims 1
- 125000000524 functional group Chemical group 0.000 claims 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 claims 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- 125000005496 phosphonium group Chemical group 0.000 claims 1
- 230000001737 promoting effect Effects 0.000 claims 1
- 229920005989 resin Polymers 0.000 claims 1
- 239000011347 resin Substances 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910021647 smectite Inorganic materials 0.000 claims 1
- 239000000454 talc Substances 0.000 claims 1
- 229910052623 talc Inorganic materials 0.000 claims 1
- 239000010456 wollastonite Substances 0.000 claims 1
- 229910052882 wollastonite Inorganic materials 0.000 claims 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/369,916 | 2003-02-20 | ||
| US10/369,916 US20040166241A1 (en) | 2003-02-20 | 2003-02-20 | Molding compositions containing quaternary organophosphonium salts |
| PCT/US2004/005029 WO2004074366A2 (en) | 2003-02-20 | 2004-02-20 | Molding compositions containing quaternary organophosphonium salts |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2006518800A JP2006518800A (ja) | 2006-08-17 |
| JP2006518800A5 true JP2006518800A5 (https=) | 2007-04-12 |
| JP4960084B2 JP4960084B2 (ja) | 2012-06-27 |
Family
ID=32868127
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006503734A Expired - Fee Related JP4960084B2 (ja) | 2003-02-20 | 2004-02-20 | 第四級有機ホスホニウム塩含有成型組成物 |
Country Status (9)
| Country | Link |
|---|---|
| US (3) | US20040166241A1 (https=) |
| EP (1) | EP1597315B1 (https=) |
| JP (1) | JP4960084B2 (https=) |
| KR (1) | KR101126416B1 (https=) |
| CN (1) | CN100497473C (https=) |
| AT (1) | ATE368707T1 (https=) |
| DE (1) | DE602004007892T2 (https=) |
| MX (1) | MXPA05008844A (https=) |
| WO (1) | WO2004074366A2 (https=) |
Families Citing this family (30)
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| US6936646B2 (en) * | 2003-04-30 | 2005-08-30 | Henkel Corporation | Flame-retardant molding compositions |
| US7378455B2 (en) * | 2005-06-30 | 2008-05-27 | General Electric Company | Molding composition and method, and molded article |
| US20070004871A1 (en) * | 2005-06-30 | 2007-01-04 | Qiwei Lu | Curable composition and method |
| US7429800B2 (en) * | 2005-06-30 | 2008-09-30 | Sabic Innovative Plastics Ip B.V. | Molding composition and method, and molded article |
| US20070066698A1 (en) * | 2005-09-20 | 2007-03-22 | Yang Wenliang P | Dual cure compositions, methods of curing thereof and articles therefrom |
| US20070066710A1 (en) * | 2005-09-21 | 2007-03-22 | Peters Edward N | Method for electrical insulation and insulated electrical conductor |
| WO2007057311A1 (en) * | 2005-11-16 | 2007-05-24 | Ciba Holding Inc. | Flame retardant prepregs and laminates for printed circuit boards |
| US20080071036A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Cured poly(arylene ether) composition, method, and article |
| US20080071035A1 (en) * | 2006-09-15 | 2008-03-20 | Delsman Erik R | Curable poly(arylene ether) composition and method |
| EP2067824A1 (en) * | 2006-09-29 | 2009-06-10 | Nippon Shokubai Co., Ltd. | Curable resin composition, optical material, and method of regulating optical material |
| DE102007041988A1 (de) * | 2007-09-05 | 2009-03-12 | Forschungszentrum Karlsruhe Gmbh | Flammhemmende Additive |
| US8337163B2 (en) * | 2007-12-05 | 2012-12-25 | General Electric Company | Fiber composite half-product with integrated elements, manufacturing method therefor and use thereof |
| JP5173779B2 (ja) * | 2008-01-11 | 2013-04-03 | 株式会社東芝 | 水中駆動モータ |
| US8079820B2 (en) * | 2008-12-18 | 2011-12-20 | General Electric Company | Blade module, a modular rotor blade and a method for assembling a modular rotor blade |
| JP5886629B2 (ja) * | 2009-01-06 | 2016-03-16 | ブルー キューブ アイピー エルエルシー | 非臭素化難燃性エポキシ樹脂における金属化合物 |
| CN101955629B (zh) * | 2009-07-16 | 2011-12-07 | 中芯国际集成电路制造(上海)有限公司 | 可用作半导体封装材料的环氧树脂组合物 |
| US20110039467A1 (en) * | 2009-08-11 | 2011-02-17 | H&C Chemical | Ionic liquid flame retardants |
| US20120138223A1 (en) | 2011-09-29 | 2012-06-07 | General Electric Company | Uv-ir combination curing system and method of use for wind blade manufacture and repair |
| WO2013066078A1 (ko) | 2011-11-01 | 2013-05-10 | 한국생산기술연구원 | 알콕시실릴기를 갖는 이소시아누레이트 에폭시 화합물, 이의 제조 방법 및 이를 포함하는 조성물과 경화물 및 이의 용도 |
| US9893287B2 (en) | 2012-12-12 | 2018-02-13 | Empire Technology Development Llc | Nano-encapsulating polymers with high barrier properties |
| EP3088455B1 (en) * | 2015-04-28 | 2017-10-04 | Rubbintec, SIA | Method of devulcanization of sulfur-cured rubber |
| US10531555B1 (en) * | 2016-03-22 | 2020-01-07 | The United States Of America As Represented By The Secretary Of The Army | Tungsten oxide thermal shield |
| JP6832519B2 (ja) * | 2016-07-28 | 2021-02-24 | パナソニックＩｐマネジメント株式会社 | 封止用樹脂組成物及び半導体装置 |
| JP6765252B2 (ja) * | 2016-08-02 | 2020-10-07 | 明和化成株式会社 | 組成物、半導体封止用組成物、及びこれらの組成物の硬化物 |
| JP6896591B2 (ja) * | 2017-11-14 | 2021-06-30 | Ｅｎｅｏｓ株式会社 | プリプレグ、繊維強化複合材料及び成形体 |
| CN110511354B (zh) * | 2019-08-30 | 2021-11-16 | 苏州科技大学 | 一种含有环氧基团的磷硅协同阻燃剂及其制备方法 |
| KR102232340B1 (ko) | 2019-11-15 | 2021-03-26 | 한국생산기술연구원 | 알콕시실릴기를 갖는 에폭시 수지의 조성물 및 이의 복합체 |
| CN118994855B (zh) * | 2024-10-24 | 2025-01-14 | 天津凯华绝缘材料股份有限公司 | 一种无磷无酸酐环氧包封料及其制备方法 |
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| US6660811B2 (en) * | 2001-01-30 | 2003-12-09 | Dainippon Ink And Chemicals, Inc. | Epoxy resin composition and curing product thereof |
| JP3969101B2 (ja) * | 2001-01-31 | 2007-09-05 | 日立化成工業株式会社 | 封止用エポキシ樹脂成形材料及び電子部品装置 |
| JP4381630B2 (ja) * | 2001-06-06 | 2009-12-09 | 株式会社日立製作所 | 自動車制御用樹脂封止型モジュール装置 |
| JP2003160640A (ja) * | 2001-09-14 | 2003-06-03 | Sumitomo Chem Co Ltd | 光半導体封止用樹脂組成物 |
| US6706414B1 (en) * | 2002-09-26 | 2004-03-16 | Ashland Inc. | Liquid uncrosslinked Michael addition oligomers prepared in the presence of a catalyst having both an epoxy moiety and a quaternary salt |
| US20040166241A1 (en) * | 2003-02-20 | 2004-08-26 | Henkel Loctite Corporation | Molding compositions containing quaternary organophosphonium salts |
-
2003
- 2003-02-20 US US10/369,916 patent/US20040166241A1/en not_active Abandoned
- 2003-08-19 US US10/644,791 patent/US20040166325A1/en not_active Abandoned
-
2004
- 2004-02-20 AT AT04713324T patent/ATE368707T1/de not_active IP Right Cessation
- 2004-02-20 KR KR1020057015308A patent/KR101126416B1/ko not_active Expired - Fee Related
- 2004-02-20 JP JP2006503734A patent/JP4960084B2/ja not_active Expired - Fee Related
- 2004-02-20 MX MXPA05008844A patent/MXPA05008844A/es active IP Right Grant
- 2004-02-20 EP EP20040713324 patent/EP1597315B1/en not_active Expired - Lifetime
- 2004-02-20 CN CNB2004800076043A patent/CN100497473C/zh not_active Expired - Fee Related
- 2004-02-20 WO PCT/US2004/005029 patent/WO2004074366A2/en not_active Ceased
- 2004-02-20 US US10/546,088 patent/US20070036981A1/en not_active Abandoned
- 2004-02-20 DE DE200460007892 patent/DE602004007892T2/de not_active Expired - Lifetime
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